TCM810RENB713

TCM809 MICROCHIP | Alldatasheet

Document overview

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Technical content

Features

• Precision VDD Monitor for 2.5V, 3.0V, 3.3V, 5.0V Nominal System Voltage Supplies  140 msec Minimum RESET Time Out Period  RESET Output to VDD = 1.0V (TCM809 )  Low Supply Current, 9 µA (typ.) DD Transient Immunity  Small 3-Pin SC-70 and SOT-23B Packages  No External Components  Push-Pull RESET Output  Temperature Range: - Industrial, SC-70 (E): -40°C to +85°C - Extended, SOT-23, SC-70 (V): -40°C to +125°C

Applications

 Computers  Embedded Systems  Battery-Powered Equipment  Critical Microcontroller Power Supply Monitoring  Automotive Typical Application Circuit General Description The TCM809 and TCM810 are cost-effective system supervisor circuits designed to monitor VDD in digital systems and provide a reset signal to the host proces- sor, when necessary. No external components are required. The RESET output is typically driven active within 65 µsec of VDD falling through the reset voltage thresh- old. RESET is maintained active for a minimum of 140 msec after VDD rises above the reset threshold. The TCM810 has an active-high RESET output, while the TCM809 has an active-low RESET output. The out- put of the TCM809/TCM810 is valid down to VDD = 1V. Both devices are available in 3-Pin SC-70 and SOT-23B packages. The TCM809/TCM810 is optimized to reject fast transient glitches on the VDD line. A low supply current of 9 µA (typ., VDD = 3.3V) make these devices suitable for battery-powered applications. Pin Configurations TCM809 VDD VDD VDD RESET RESET INPUT (Active-Low) GND GND PICmicro® Microcontroller SOT-23B/SC-70 Note: 3-Pin SOT-23B is equivalent to VDD TCM809 RESET GND TCM809/ TCM8101 TCM810 (RESET) JEDEC TO-236. 3-Pin Microcontroller Reset Monitors

DS21661C-page 2  2004 Microchip Technology Inc.

1.0 ELECTRICAL

Absolute Maximum Ratings† Power Dissipation (TA = 70°C): Maximum Junction Temperature, T † Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended peri- ods may affect device reliability. PIN FUNCTION TABLE NAME FUNCTION GND Ground. RESET (TCM809 ) RESET push-pull output remains low while VDD is below the reset voltage threshold and for 240 msec (140 msec min.) after V DD rises above reset threshold. RESET (TCM810 ) RESET push-pull output remains high while VDD is below the reset voltage threshold and for 240 msec (140 msec min.) after V DD rises above reset threshold. VDD Supply voltage (+2.5V, +3.0V, +3.3V, +5.0V).

ELECTRICAL CHARACTERISTICS

VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25°C, VDD = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1). Parameter Sym Min Typ Max Units Test Conditions VDD Range 1.0 — 5.5 V T A = 0°C to +70°C 1.2 — 5.5 T A = – 40°C to +125°C Supply Current I CC —1 2 3 0 µ A TCM8xx L/M/J: V DD < 5.5V —9 2 5 TCM8xx R/S/T/Z: VDD < 3.6V Reset Threshold (Note 2) VTH 4.56 4.63 4.70 V TCM8xx L: T A = +25°C 4.50 — 4.75 TA = – 40°C to +125°C 4.31 4.38 4.45 V TCM8xx M: T A = +25°C 4.25 — 4.50 V T A = – 40°C to +125°C 3.93 4.00 4.06 V TCM809 J: T A = +25°C 3.89 — 4.10 V T A = – 40°C to +125°C 3.04 3.08 3.11 V TCM8xx T: T A = +25°C 3.00 — 3.15 V T A = – 40°C to +125°C 2.89 2.93 2.96 V TCM8xx S: T A = +25°C 2.85 — 3.00 V T A = – 40°C to +125°C 2.59 2.63 2.66 V TCM8xx R: T A = +25°C 2.55 — 2.70 V T A = – 40°C to +125°C 2.28 2.32 2.35 V TCM8xx Z: T A = +25°C 2.25 — 2.38 V T A = – 40°C to +125°C Reset Threshold Tempco — 30 — ppm/°C VDD to Reset Delay, — 65 — µsec V DD = VTH to (VTH – 100 mV) (Note 2) Reset Active Time Out Period 140 320 560 msec Note 1: Production testing done at TA = +25°C, overtemperature limits ensured by QC screen. 2: RESET output for TCM809 , RESET output for TCM810 .

 2004 Microchip Technology Inc. DS21661C-page 3 TCM809/TCM810 RESET Output Voltage Low (TCM809 ) VOL —— 0 . 3 V TCM809 R/S/T/Z: VDD = VTH min, ISINK = 1.2 mA —— 0 . 4 TCM809 L/M/J: V DD = VTH min, ISINK = 3.2 mA —— 0 . 3 V DD > 1.0V, ISINK = 50 µA RESET Output Voltage High (TCM809 ) VOH 0.8 VDD ——V TCM809 R/S/T/Z: VDD > VTH max, ISOURCE = 500 µA VDD – 1.5 — — TCM809 L/M/J: VDD > VTH max, ISOURCE = 800 µA RESET Output Voltage Low (TCM810 ) VOL —— 0 . 3 V TCM810 R/S/T/Z:VDD = VTH max, ISINK = 1.2 mA —— 0 . 4 TCM810 L/M: V DD = VTH max, ISINK = 3.2 mA RESET Output Voltage High (TCM810 ) VOH 0.8 VDD ——V 1 . 8 < V DD < VTH min, ISOURCE = 150 µA ELECTRICAL CHARACTERISTICS (CONTINUED) VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25°C, VDD = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1). Parameter Sym Min Typ Max Units Test Conditions Note 1: Production testing done at TA = +25°C, overtemperature limits ensured by QC screen. 2: RESET output for TCM809 , RESET output for TCM810 .

DS21661C-page 4  2004 Microchip Technology Inc.

2.0 TYPICAL PERFORMANCE CHARACTERISTICS

FIGURE 2-1: Supply Current vs. Temperature. FIGURE 2-2: Supply Current vs. Temperature. FIGURE 2-3: Power-up Reset Time Out vs. Temperature. FIGURE 2-4: Normalized Reset Threshold vs. Temperature. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -40 -20 0 20 40 60 80 100 120 Temperature (°C) Supply Current ( µA) VDD = 1V VDD = 3V VDD = 5V TCM8xx/R/S/T/Z, No Load - 4 0 - 2 00 2 04 06 08 0 1 0 0 1 2 0 Temperature (°C) Supply Current ( µA) VDD = 5V VDD = 3V VDD = 1V TCM8xx/L/M/J, No Load 100 150 200 250 300 350 400 450 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Power-up Reset Timeout (µsec) 0.997 0.998 0.999 1.001 - 4 0 - 2 00 2 04 06 08 0 1 0 0 1 2 0 Temperature (°C) Normalized Reset Threshold

 2004 Microchip Technology Inc. DS21661C-page 5 TCM809/TCM810

3.0 APPLICATIONS INFORMATION

3.1 V DD Transient Rejection

The TCM809/TCM810 provides accurate VDD monitor- ing and reset timing during power-up, power-down and brown-out/sag conditions. These devices also reject negative-going transients (glitches) on the power sup- ply line. Figure 3-1 shows the maximum transient dura- tion vs. maximum negative excursion (overdrive) for glitch rejection. Any combination of duration and over- drive that lies under the curve will not generate a reset signal. FIGURE 3-1: Maximum Transient Duration vs. Overdrive for Glitch Rejection at +25°C. Combinations above the curve are detected as a brown-out or power-down condition. Transient immu- nity can be improved by adding a capacitor in close proximity to the VDD pin of the TCM809/TCM810.

3.2 RESET Signal Integrity During

The TCM809 RESET output is valid to VDD = 1.0V. Below this voltage the output becomes an "open cir- cuit" and does not sink current. This means CMOS logic inputs to the microcontroller will be floating at an undetermined voltage. Most digital systems are completely shut down well above this voltage. However, in situations where RESET must be main- tained valid to VDD = 0V, a pull-down resistor must be connected from RESET to ground to discharge stray capacitances and hold the output low (Figure 3-2). This resistor value, though not critical, should be chosen such that it does not appreciably load RESET under normal operation (100 kΩ will be suitable for most applications). Similarly, a pull-up resistor to VDD is required for the TCM810 to ensure a valid high RESET for VDD below 1.0V. FIGURE 3-2: The addition of R1 at the RESET output of the TCM809 ensures that the RESET output is valid to VDD = 0V. Reset Comparator Overdrive [VTH - VDD ] (mv) 400 240 160 320 1 5 100 1000 TA = +25°C VTH Duration Overdrive VDD TCM8XX L/M/J (SOT-23) Maximum Transient Duration (µsec) TCM8XX Z/R/S/T (SOT-23) [VTH - VDD ] (mv) 100 110 120 130 1 10 100 1000 Reset Comparator Overdrive (mV) VDD to Reset Delay (µsec) TCM8XX L/M/J (SC-70) TCM8XX Z/R/S/T (SC-70) TCM809 VDD VDD R 1 100 kΩ RESET GND

DS21661C-page 6  2004 Microchip Technology Inc.

3.3 Controllers and Processors With

Some microcontrollers have bidirectional reset pins. Depending on the current drive capability of the control- ler pin, an indeterminate logic level may result if there is a logic conflict. This can be avoided by adding a 4.7 kΩ resistor in series with the output of the TCM809/ TCM810 (Figure 3-3). If there are other components in the system that require a reset signal, they should be buffered so as not to load the reset line. If the other components are required to follow the reset I/O of the microcontroller, the buffer should be connected as shown with the solid line. FIGURE 3-3: Interfacing the TCM809 to a Bidirectional RESET I/O. TCM809 VDD RESET GND RESET GND Buffered RESET To Other System Components Micro- 4.7 kΩ controller Buffer PICmicro®

 2004 Microchip Technology Inc. DS21661C-page 7 TCM809/TCM810

4.0 PACKAGING INFORMATION

4.1 Package Marking Information

TCM809 ZVNB/TCM809ZVLB JS (SC-70 package only) Part Number SOT-23/SC-70 TCM810 LENB K1 TCM810 MENB K2 TCM810 TENB K3 TCM810 SENB K4 TCM810 RENB K5 TCM810 ZENB K6 TCM810 LVNB/TCM810 LVLB KZ TCM810 MVNB/ TCM810 MVLB KY TCM810 TVNB/ TCM810 TVLB KX TCM810 SVNB/ TCM810 SVLB KV TCM810 RVNB/ TCM810 RVLB KU Legend: 1 Part Number + temperature range and voltage (two-digit code)

2 Part Number + temperature range and voltage (two-digit code)

3 Lot ID number

4 Year and work week

5 Year and work week

6 Year and work week

Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. 3-Pin SOT-23B 3-Pin SC-70 Top Side Bottom Side cdef cde fgh

DS21661C-page 8  2004 Microchip Technology Inc. 3-Lead Plastic Small Outline Transistor (NB) (SOT-23) 10501050βMold Draft Angle Bottom 10501050αMold Draft Angle Top 10501050φFoot Angle 1.92.076p1Outside lead pitch (basic) 0.96.038pPitch 33nNumber of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units p DB n E L c β φ α A2A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 § Significant Characteristic

 2004 Microchip Technology Inc. DS21661C-page 9 TCM809/TCM810 3-Lead Plastic Small Outline Transistor (LB) (SC-70) 12˚8˚12˚8˚bMold Draft Angle Bottom 12˚8˚12˚8˚aMold Draft Angle Top 0.400.15.016.006BLead Width 0.250.08.010.003cLead Thickness 0.410.10.016.004LFoot Length 2.251.80.089.071DOverall Length 1.351.15.053.045E1Molded Package Width 2.401.80.094.071EOverall Width .0100.00.0004.000A1Standoff 1.000.80.039.031A2Molded Package Thickness 1.100.80.043.031AOverall Height 1.30 BSC.p1Outside lead pitch (basic) 0.65 BSC.pPitch 33Number of Pins MAXMINMAXMINDimension Limits MILLIMETERS*INCHESUnits shall not exceed .005" (0.127mm) per side. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions Notes: JEITA (EIAJ) Equivalent: SC70 Drawing No. C04-104 *Controlling Parameter L B E p c p1 D b a A A2 .026 BSC. .051 BSC.

DS21661C-page 10  2004 Microchip Technology Inc.

4.2 Product Tape and Reel Specifications

FIGURE 4-1: EMBOSSED CARRIER DIMENSIONS (8, 12, 16, AND 24 MM TAPE ONLY) FIGURE 4-2: 3-LEAD SOT-23/SC70 D EVICE TAPE AND REEL SPECIFICATIONS Top Cover Tape P W TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS Case Outline Package Type Carrier Dimensions Cavity Dimensions Output Quantity Units Reel Diameter in mmW mm P mm mm mm mm NB SOT-23 3L 8 4 3.15 2.77 1.22 3000 180 LB SC-70 3L 8 4 2.4 2.4 1.19 3000 180 User Direction of Feed P, Pitch Standard Reel Component Orientation Reverse Reel Component Orientation W, Width of Carrier Tape Pin 1 Pin 1 Device Marking Device Marking

 2004 Microchip Technology Inc. DS21661C-page 11 TCM809/TCM810 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Sales and Support Device: TCM809: Supervisor circuit with active-low RESET output TCM810: Supervisor circuit with active-high RESET output VDD Reset Threshold: L = 4.63V M= 4 . 3 8 V J= 4 . 0 0 V T= 3 . 0 8 V S= 2 . 9 3 V R= 2 . 6 3 V Z= 2 . 3 2 V Temperature Range: E = -40°C to +85°C V = -40°C to +125°C LB713 = SC-70, 3-pin (Tape and Reel) PART NO. X X TemperatureVDD Reset Device Examples: a) TCM809LENB713: SOT-23B-3-TR, Microcontroller 4.63V Reset Monitor, -40°C to +85°C, Tape and Reel. b) TCM809LVLB713: SC-70-3-TR, Microcontroller 4.63V Reset Monitor, -40°C to +125°C, Tape and Reel. c) TCM809LVNB713: SOT-23B-3-TR, Microcontroller 4.63V Reset Monitor, -40°C to +125°C, Tape and Reel. a) TCM810MENB713: SOT-23B-3-TR, Microcontroller 4.38V Reset Monitor, -40°C to +85°C, Tape and Reel. b) TCM810RVLB713: SOT-23B-3-TR, Microcontroller 2.63V Reset Monitor, -40°C to +125°C, Tape and Reel. c) TCM810TVLB713: SC-70-3-TR, Microcontroller 4.38V Reset Monitor, -40°C to +125°C, Tape and Reel. Range Threshold XXXXX Package Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

DS21661C-page 12  2004 Microchip Technology Inc. NOTES:

 2004 Microchip Technology Inc. DS21661C-page 13 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEE LOQ , MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart and rfPIC are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartShunt and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP , ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, Select Mode, SmartSensor, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices:  Microchip products meet the specification contained in their particular Microchip Data Sheet.  Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.  There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  Microchip is willing to work with the customer who is concerned about the integrity of their code.  Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEE LOQ ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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