5962-9750901QPA TI1 | Alldatasheet

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TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 www.ti.com SLVS087M –DECEMBER 1994–REVISED MARCH 2012 MicropowerSupplyVoltageSupervisors Check forSamples: TLC7701, TLC7725, TLC7703 ,TLC7733, TLC7705 1FEATURES

  • Power-On Reset Generator
  • Automatic Reset GenerationAfterVoltage Drop
  • PrecisionVoltageSensor
  • Temperature-Compensated VoltageReference
  • Programmable Delay Time by External Capacitor
  • Supply VoltageRange ...2 V to6 V
  • DefinedRESET Output from VDD ≥ 1 V
  • Power-Down ControlSupport forStaticRAM With BatteryBackup
  • Maximum Supply Currentof16 µA
  • Power Saving Totem-Pole Outputs
  • Temperature Range ...Up to–55°C to125°C

APPLICATIONS

  • MedicalImaging

DESCRIPTION

The TLC77xx familyof micropower supply voltage supervisorsprovide reset control,primarilyin microcomputerand microprocessorsystems. During power-on, RESET is asserted when VDD reaches 1 V. After minimum VDD (≥2 V) is established,the circuitmonitorsSENSE voltageand keeps the resetoutputsactiveas long as SENSE voltage (VI(SENSE)) remains below the threshold voltage.An internaltimerdelaysreturnoftheoutput to the inactivestateto ensure propersystem reset. The delay time,td, is determinedby an external capacitor: td = 2.1× 104 × C T Where C T isinfarads td isinseconds SPACER ExceptfortheTLC7701, whichcan be customizedwithtwo externalresistors,each supervisorhas a fixedsense thresholdvoltagesetby an internalvoltagedivider.When SENSE voltagedropsbelow thethresholdvoltage,the outputsbecome activeand stayinthatstateuntilSENSE voltagereturnsabove thresholdvoltageand thedelay time,td,has expired. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1994–2012,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 SLVS087M –DECEMBER 1994–REVISED MARCH 2012 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. DESCRIPTION (CONTINUED) Inadditiontothepower-on-resetand undervoltage-supervisorfunction,theTLC77xx adds power-down control supportforstaticRAM. When CONTROL istiedto GND, RESET willactas activehigh.The voltagemonitor containsadditionallogicintendedforcontrolof staticmemories withbatterybackup duringpower failure.By drivingthechipselect(CS) ofthememory circuitwiththeRESET outputoftheTLC77xx and withtheCONTROL drivenby thememory bank selectsignal(CSH1) ofthemicroprocessor(seeFigure10),thememory circuitis automaticallydisabledduringa power loss.(Inthisapplicationthe TLC77xx power has to be suppliedby the battery.) The TLC77xxI ischaracterizedforoperationover a temperaturerange of –40°C to 85°C; the TLC77xxQ is characterizedforoperationovera temperaturerangeof–40°C to125°C; and theTLC77xxM ischaracterizedfor operationoverthefullMilitarytemperaturerangeof–55°C to125°C. The 3x3 mm DRB package isalsoavailableas a non-magneticpackage formedicalimagingapplication. AVAILABLE OPTIONS PACKAGED DEVICES THRESHOLD THIN SHRINKCHIP CERAMIC CERAMIC SMALL OUTLINEVOLTAGETA PLASTIC DIPSMALL CARRIER DIP DUAL SMALL OUTLINE NO LEAD(V) OUTLINE (D)(1) (P) (DRB)(FK) (JG) FLATPACK (U) (PW)(2)

1.1 TCLC7701ID — — — TCLC7701IP TCLC7701IPWR —

2.25 TLC7725ID — — — TLC7725IP TLC7725IPWR —

2.63 TLC7703ID — — — TLC7703IP TLC7703IPWR —–40°C to

85°C 2.93 TLC7733ID — — — TLC7733IP TLC7733IPWR —

4.55 TLC7705ID — — — TLC7705IP TLC7705IPWR —

1.1 TLC7701IDBR — — — — — TLC7701IDRBT-NM

1.1 TLC7701QD — — — TLC7701QP TLC7701QPWR —

2.25 TLC7725QD — — — TLC7725QP TLC7725QPWR —

–40°C to 2.63 TLC7703QD — — — TLC7703QP TLC7703QPWR —125°C

2.93 TLC7733QD — — — TLC7733QP TLC7733QPWR —

4.55 TLC7705QD — — — TLC7705QP TLC7705QPWR —

(1) The D package isavailabletapedand reeled.Add thesuffixR tothedevicetypewhen ordering(e.g.,TLC7705QDR). (2) The PW package isonlyavailableleft-endtapedand reeled(indicatedby theR suffixon thedevicetype;e.g.,TLC7705QPWR). Table1.FUNCTION TABLE CONT RESIN VI(SENSE)>VIT+ RESE RESET ROL T L L False H L L L True H L L H False H L L H True L(1) H (1) H L False H L H L True H L H H False H L H H True H H (1) (1) RESET and RESET statesshown arevalidfort> td.

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ProductFolderLink(s):TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 www.ti.com SLVS087M –DECEMBER 1994–REVISED MARCH 2012 LOGIC SYMBOL (1) ThissymbolisinaccordancewithANSI/IEEE Std91-1984and IEC Publication617-12. Copyright© 1994–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 SLVS087M –DECEMBER 1994–REVISED MARCH 2012 www.ti.com FUNCTIONAL BLOCK DIAGRAM TIMING DIAGRAM

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TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 www.ti.com SLVS087M –DECEMBER 1994–REVISED MARCH 2012 ABSOLUTE MAXIMUM RATINGS (1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) VALUE UNIT VDD Supplyvoltage(2) 7 V Inputvoltagerange,CONTROL, RESIN, SENSE (2) –0.3to7 V IOL Maximum lowoutputcurrent 10 mA IOH Maximum highoutputcurrent, –10 mA IIK Inputclamp current,(VI< 0 orVI> VDD) ±10 mA IOK Outputclamp current,(VO 0 orVO > VDD) ±10 mA Continuoustotalpower dissipation See DissipationRatingTable TL77xxI –40 to84 °C Operatingfree-airTA TL77xxQ –40 to125 °Ctemperaturerange TL77xxM –55 to125 °C Tstg Storagetemperaturerange –65 to150 °C (1) Stressesbeyond thoselistedunder"absolutemaximum ratings"may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunder"recommended operating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) AllvoltagevaluesarewithrespecttoGND. DISSIPATION RATINGS TA ≤ 25°C DERATING FACTOR TA = 85°C TA = 125°CPACKAGE POWER RATING ABOVE TA = 25°C POWER RATING POWER RATING D 725 mW 5.8mW/ °C 377 mW 145 mW DRB FK 1375 mW 11.0mW/ °C 715 mW 275 mW JG 1050 mW 8.4mW/ °C 546 mW 210 mW P 1000 mW 8.0mW/ °C 520 mW 200 mW PW 525 mW 4.2mW/ °C 273 mW 105 mW U 700 mW 5.5mW/ °C 370 mW 150 mW RECOMMENDED OPERATING CONDITIONS atspecifiedtemperaturerange MIN MAX UNIT VDD Supplyvoltage 2 6 V VI Inputvoltage 0 VDD V VIH High-levelinputvoltageatRESIN and CONTROL (1) 0.7×VDD V VIL Low-levelinputvoltageatRESIN and CONTROL (1) 0.2×VDD V IOH High-leveloutputcurrent –2 mA IOL Low-leveloutputcurrent 2 mA Δt/ΔV inputtransitionriseand fallrateatRESIN and CONTROL 100 ns/V TLC77xxI –40 85 Operatingfree-airTA TLC77xxQ –40 125 °Ctemperaturerange TLC77xxM –55 125 (1) To ensurea lowsupplycurrent,VILshouldbe kept<0.3V and VIH > VDD –0.3V. Copyright© 1994–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 SLVS087M –DECEMBER 1994–REVISED MARCH 2012 www.ti.com

ELECTRICAL CHARACTERISTICS

overrecommended operatingconditions(1)(unlessotherwisenoted) TLC77xx PARAMETER TEST CONDITIONS UNIT MIN TYP MAX VDD = 2 V 1.8 IOH = –20 µA VDD = 2.7V 2.5High-leveloutputVOH Vvoltage VDD = 4.5V 4.3 IOH = 2 –mA VDD = 4.5V 3.7 VDD = 2 V 0.2 IOL = 20 µA VDD = 2.7V 0.2Low-LeveloutputVOL Vvoltage VDD = 4.5V 0.2 IOL = 2 mA VDD = 4.5V 0.5 TCLC7701 1.04 1.1 1.16 TLC7725 2.18 2.25 2.32 Negative-goinginputthresholdvoltage,VIT– TLC7703 VDD = 2 V to6 V 2.56 2.63 2.70 mVSENSE (2) TLC7733 2.86 2.93 3 TLC7705 4.47 4.55 4.63 TCLC7701 30 TLC7725 Vhus Hysteresisvoltage,SENSE TLC7703 VDD = 2 V to6 V mV TLC7733 TLC7705 Vres Power-upresetvoltage(3) IOL = 20 µA 1 V RESIN VI= 0 V toVDD 2 CONTROL VI = VDD 7 15 II Inputcurrent µA SENSE VI= 5 V 5 10 SENSE, TLC7701 only VI= 5 V 2 RESIN = VDD ,SENSE = VDD ≥ VITmax + 0.2V,IDD Supplycurrent 9 16 µACONTROL = 0 V,Outputsopen VDD = 5 V,VCT = 0, IDD(d) Supplycurrentduringtd RESIN = VDD ,SENSE = VDD , 120 150 µA CONTROL = 0 V,Outputsopen C I Inputcapacitance,SENSE VI= 0 V toVDD 50 pF (1) Allcharacteristicsaremeasured withC T = 0.1µF. (2) To ensurebeststabilityofthethresholdvoltage,a bypasscapacitor(ceramic,0.1mF) shouldbe connectednearthesupplyterminals. (3) The lowestsupplyvoltageatwhichRESET becomes active.The symbolVresisnotcurrentlylistedwithinEIA orJEDEC standardsfor semiconductorsymbology.RisetimeofVDD ≥ 15 µs/V.

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TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 www.ti.com SLVS087M –DECEMBER 1994–REVISED MARCH 2012 overrecommended operatingconditions(1)(unlessotherwisenoted) TLC77xxM PARAMETER TEST CONDITIONS UNIT MIN TYP (2) MAX TA = 25°C 1.8 VDD = 2 V V TA = –55°C to125°C 1.7 TA = 25°C 2.5 IOH = –20 µA VDD = 2.7V V TA = –55°C to125°C 2.3High-leveloutputVOH voltage TA = 25°C 4.3 VDD = 4.5V V TA = –55°C to125°C 4.2 TA = 25°C 3.7 IOH = –2 µA VDD = 4.5V V TA = –55°C to125°C 3.6 TA = 25°C 0.2 VDD = 2 V V TA = –55°C to125°C 0.2 TA = 25°C 0.2 IOL = –20 µA VDD = 2.7V V TA = –55°C to125°C 0.2Low-leveloutputVOL voltage TA = 25°C 0.2 VDD = 4.5V V TA = –55°C to125°C 0.2 IOL = 2 mA TA = 25°C 0.5 VDD = 4.5V V TA = –55°C to125°C 0.5 TLC7733 2.86 2.93 3.1Negative-goinginputthresholdVIT– VDD = 2 V to6 V Vvoltage,SENSE (3) TLC7705 4.3 4.5 4.8 Vhys Hysteresisvoltage,SENSE VDD = 2 V to6 V 70 mV Vres Power-upresetvoltage(2) IOL = 20 µA 1 V RESIN VI= 0 V toVDD 2 CONTROL VI= VDD 7 15 II Inputcurrent µA SENSE VI= 5 V 5 10 SENSE, TLC7701 only VI= 5 V 2 RESIN = VDD, SENSE = VDD ≥ VITmax + 0.2VIDD Supplycurrent 9 16 µACONTROL = 0 V, Outputsopen TLC7733 VCT = 0 , VDD = 3.3V 250 RESIN = VDD , 120 150 IDD(d) Supplycurrentduringtd CONTROL = 0 V, µA TLC7705 VDD = 5 VSENSE = VDD , Outputsopen C I Inputcapacitance,SENSE VI= 0 V toVDD 50 pF (1) Allcharacteristicsaremeasured withC T = 0.1µF. (2) TypicalvaluesapplyatTA = 25°C. (3) To ensurebeststabilityofthethresholdvoltage,a bypasscapacitor(ceramic,0.1mF) shouldbe connectednearthesupplyterminals. Copyright© 1994–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 SLVS087M –DECEMBER 1994–REVISED MARCH 2012 www.ti.com SWITCHING CHARACTERISTICS atVDD = 5 V,R L = 2 kΩ,C L = 50 pF,TA = 25°C (unlessotherwisenoted) MEASURED TLC77xx PARAMETER TEST CONDITIONS UNITFROM TO MIN TYP MAX(INPUT) (OUTPUT) RESET RESIN = 0.7× VDD , td Delaytime VI(SENSE) ≥ VIT+ and CONTROL = 0.2× VDD ,C T = 100 nF, 1.1 2.1 4.2 ms RESET TA = Fullrange,See timingdiagram Propagationdelaytime,low-tPLH 20to-high-leveloutput RESET Propagationdelaytime,high-tPHL 5VIH = VIT+max + 0.2V,VIL= VIT-min – 0.2V,to-low-leveloutput SENSE RESIN = 0.7× VDD ,CONTROL = 0.2× VDD , µs Propagationdelaytime,low- CT = NC (1)tPLH 5to-high-leveloutput RESET Propagationdelaytime,high-tPHL 20to-low-leveloutput Propagationdelaytime,low-tPLH 20 µsto-high-leveloutput RESET Propagationdelaytime,high- VIH = 0.7× VDD ,VIL= 0.2× VDD ,tPHL 40to-low-leveloutput SENSE = VIT+max + 0.2V,RESIN nsCONTROL = 0.2× VDD ,Propagationdelaytime,low-tPLH 45CT = NC (1)to-high-leveloutput RESET Propagationdelaytime,high-tPHL 20 µsto-low-leveloutput Propagationdelaytime,low-tPLH 38 nsVIH = 0.7× VDD ,VIL= 0.2× VDD ,to-high-leveloutput CONTROL RESET SENSE = VIT+max + 0.2V,RESIN = 0.7× VDD , Propagationdelaytime,high- CT = NC (1)tPHL 38 nsto-low-leveloutput Low-levelminimum pulse SENSE VIH = VIT+max + 0.2V,VIL= VIT-min –0.2V, durationtoswitchRESET RESIN VIL= 0.2× VDD ,VIH = 0.7× VDDand RESET tr Risetime RESET 10% to90% and tf Falltime 90% to10%RESET (1) NC = No capacitor,and includesup to100-pFprobeand jigcapacitance.

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TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 www.ti.com SLVS087M –DECEMBER 1994–REVISED MARCH 2012 SWITCHING CHARACTERISTICS atVDD = 5 V,R L = 2 kΩ,C L = 50 pF,TA = 25°C (unlessotherwisenoted) MEASURED TLC77xxM PARAMETER TEST CONDITIONS TA UNITFROM TO MIN TYP MAX(INPUT) (OUTPUT) 25°C 20VIH = VIT+max + 0.2V,RESET µsPropagationdelay Fullrange 24VIL= VIT-min-0.2V,tPLH time,low-to-high-level SENSE RESIN = 2.7V,CONTROL = 0.4V, 25°C 5output RESET µsCT = NC (1) Fullrange 7 25°C 5VIH = VIT+max + 0.2V,RESET µsPropagationdelay Fullrange 7VIL= VIT-min-0.2V,tPHL time,high-to-low-level SENSE RESIN = 2.7V,CONTROL = 0.4V, 25°C 20output RESET µsCT = NC (1) Fullrange 24 25°C 20VIH = 2.7V,VIL= 0.4V,RESET µsPropagationdelay Fullrange 24SENSE = VIT+max + 0.2V,tPLH time,low-to-high-level RESIN CONTROL = 0.4V, 25°C 45output RESET nsCT = NC (1) Fullrange 65 25°C 40VIH = 2.7V,VIL= 0.4V,RESET nsPropagationdelay Fullrange 60SENSE = VIT+max + 0.2V,tPHL time,high-to-low-level RESIN CONTROL = 0.4V, 25°C 20output RESET µsCT = NC (1) Fullrange 24 Propagationdelay 25°C 38 tPLH time,low-to-high-level nsVIH = 2.7V,VIL= 0.4V, Fullrange 58output SENSE = VIT+max + 0.2V,CONTROL RESET RESIN = 2.7V,Propagationdelay 25°C 38 CT = NC (1)tPHL time,high-to-low-level ns FullRange 58output VIH = VIT+max + 0.2V,SENSE 3Low-levelminimum VIL= VIT-min-0.2V Fullrange µspulseduration RESIN VIL= 0.4V,VIH = 2.7V 1 tr Risetime RESET 10% to90% 8 and Fullrange ns/V tf Falltime 90% to10% 4RESET (1) NC = No capacitor,and includesup to100-pFprobeand jigcapacitance. Copyright© 1994–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 SLVS087M –DECEMBER 1994–REVISED MARCH 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure1. RESET and RESET Output Configurations Figure2. InputPulse DefinitionWaveforms

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TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 www.ti.com SLVS087M –DECEMBER 1994–REVISED MARCH 2012 TYPICAL CHARACTERISTICS NORMALIZED INPUT THRESHOLD VOLTAGE SUPPLY CURRENT vs vs TEMPERATURE SUPPLY VOLTAGE Figure3. Figure4. HIGH-LEVEL OUTPUT VOLTAGE LOW-LEVEL OUTPUT VOLTAGE vs vs HIGH-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT CURRENT Figure5. Figure6. Copyright© 1994–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 SLVS087M –DECEMBER 1994–REVISED MARCH 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) INPUT CURRENT MINIMUM PULSE DURATION AT SENSE vs vs INPUT VOLTAGE AT SENSE SENSE THRESHOLD OVERDRIVE Figure7. Figure8.

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TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 www.ti.com SLVS087M –DECEMBER 1994–REVISED MARCH 2012

APPLICATION INFORMATION

Figure9. Reset Controllerina Microcomputer System Figure10. Data RetentionDuring Power Down Using StaticCMOS RAMs Copyright© 1994–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLink(s):TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

TLC7701,TLC7725,TLC7703 TLC7733,TLC7705 SLVS087M –DECEMBER 1994–REVISED MARCH 2012 www.ti.com Changes from RevisionL (February2003)toRevisionM Page

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www.ti.com 13-Oct-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples 5962-9750901Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9750901Q2A TLC7733 MFKB 5962-9750901QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9750901QPA TLC7733M 5962-9751301Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9751301Q2A TLC7705 MFKB 5962-9751301QHA ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 9751301QHA TLC7705M 5962-9751301QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9751301QPA TLC7705M TLC7701ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7701I TLC7701IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7701I TLC7701IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7701I TLC7701IDRBT-NM ACTIVE SON DRB 8 250 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 7701N TLC7701IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7701I TLC7701IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 TLC7701IP TLC7701IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 TLC7701IP TLC7701IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7701 TLC7701IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7701 TLC7701IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 85 TLC7701IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7701

www.ti.com 13-Oct-2013 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLC7701IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7701 TLC7701QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7701Q TLC7701QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7701Q TLC7701QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7701Q TLC7701QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7701Q TLC7701QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLC7701QP TLC7701QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLC7701QP TLC7701QPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD701 TLC7701QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD701 TLC7701QPWLE PREVIEW TSSOP PW 8 TBD Call TI Call TI -40 to 125 TLC7701QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD701 TLC7701QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD701 TLC7703-W ACTIVE WAFERSALE YS 0 TBD Call TI Call TI TLC7703ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7703I TLC7703IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7703I TLC7703IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7703I TLC7703IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7703I TLC7703IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 TLC7703IP

www.ti.com 13-Oct-2013 Addendum-Page 3 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLC7703IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 TLC7703IP TLC7703IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y7703 TLC7703IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y7703 TLC7703IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 85 TLC7703IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7703 TLC7703IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7703 TLC7703QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7703Q TLC7703QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7703Q TLC7703QPE4 ACTIVE PDIP P 8 TBD Call TI Call TI -40 to 125 TLC7703QPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD703 TLC7703QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD703 TLC7705ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7705I TLC7705IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7705I TLC7705IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7705I TLC7705IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7705I TLC7705IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 TLC7705IP TLC7705IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 TLC7705IP TLC7705IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y7705

www.ti.com 13-Oct-2013 Addendum-Page 4 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLC7705IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y7705 TLC7705IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 85 TLC7705IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7705 TLC7705IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7705 TLC7705MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9751301Q2A TLC7705 MFKB TLC7705MJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 TLC7705 MJG TLC7705MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9751301QPA TLC7705M TLC7705MUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 9751301QHA TLC7705M TLC7705QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7705Q TLC7705QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7705Q TLC7705QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7705Q TLC7705QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7705Q TLC7705QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLC7705QP TLC7705QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLC7705QP TLC7705QPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD705 TLC7705QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD705 TLC7705QPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125 TLC7705QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD705

www.ti.com 13-Oct-2013 Addendum-Page 5 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLC7705QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD705 TLC7725ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7725I TLC7725IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7725I TLC7725IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7725I TLC7725IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7725I TLC7725IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 TLC7725IP TLC7725IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 TLC7725IP TLC7725IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y7725 TLC7725IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y7725 TLC7725IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 85 TLC7725IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7725 TLC7725IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7725 TLC7725QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7725Q TLC7725QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7725Q TLC7725QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7725Q TLC7725QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7725Q TLC7725QPE4 ACTIVE PDIP P 8 TBD Call TI Call TI -40 to 125 TLC7725QPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125 TLC7725QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD725

www.ti.com 13-Oct-2013 Addendum-Page 6 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLC7725QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD725 TLC7733ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7733I TLC7733IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7733I TLC7733IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7733I TLC7733IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7733I TLC7733IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 TLC7733IP TLC7733IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 TLC7733IP TLC7733IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y7733 TLC7733IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y7733 TLC7733IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7733 TLC7733IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7733 TLC7733MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9750901Q2A TLC7733 MFKB TLC7733MJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 TLC7733 MJG TLC7733MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9750901QPA TLC7733M TLC7733QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7733Q TLC7733QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7733Q TLC7733QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7733Q

www.ti.com 13-Oct-2013 Addendum-Page 7 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLC7733QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C7733Q TLC7733QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLC7733QP TLC7733QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLC7733QP TLC7733QPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD733 TLC7733QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD733 TLC7733QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD733 TLC7733QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TD733 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.

www.ti.com 13-Oct-2013 Addendum-Page 8 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLC7701, TLC7705, TLC7705M, TLC7733, TLC7733M :

  • Catalog: TLC7705 , TLC7733
  • Automotive: TLC7701-Q1 , TLC7705-Q1 , TLC7705-Q1 , TLC7733-Q1 , TLC7733-Q1
  • Enhanced Product: TLC7701-EP , TLC7705-EP , TLC7705-EP , TLC7733-EP , TLC7733-EP
  • Military: TLC7705M , TLC7733M NOTE: Qualified Version Definitions:
  • Catalog - TI's standard catalog product
  • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
  • Enhanced Product - Supports Defense, Aerospace and Medical Applications
  • Military - QML certified for Military and Defense Applications

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 3-Oct-2013 Pack Materials-Page 1

(mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLC7701IDR SOIC D 8 2500 367.0 367.0 35.0 TLC7701IDRBT-NM SON DRB 8 250 210.0 185.0 35.0 TLC7701IPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7701QDR SOIC D 8 2500 367.0 367.0 35.0 TLC7701QPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7703IDR SOIC D 8 2500 367.0 367.0 35.0 TLC7703IPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7705IDR SOIC D 8 2500 367.0 367.0 35.0 TLC7705IPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7705QDR SOIC D 8 2500 367.0 367.0 35.0 TLC7705QPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7725IDR SOIC D 8 2500 367.0 367.0 35.0 TLC7725IPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7725QDR SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 3-Oct-2013 Pack Materials-Page 2

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLC7725QPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7733IDR SOIC D 8 2500 367.0 367.0 35.0 TLC7733IDR SOIC D 8 2500 367.0 367.0 35.0 TLC7733IPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7733QDR SOIC D 8 2500 367.0 367.0 35.0 TLC7733QDR SOIC D 8 2500 367.0 367.0 35.0 TLC7733QPWR TSSOP PW 8 2000 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 3-Oct-2013 Pack Materials-Page 3

MCER001A – JANUARY 1995 – REVISED JANUARY 1997 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.310 (7,87) 0.290 (7,37) 0.014 (0,36) 0.008 (0,20) Seating Plane 4040107/C 08/96 0.065 (1,65) 0.045 (1,14) 0.020 (0,51) MIN 0.400 (10,16) 0.355 (9,00) 0.015 (0,38) 0.023 (0,58) 0.063 (1,60) 0.015 (0,38) 0.200 (5,08) MAX 0.130 (3,30) MIN 0.245 (6,22) 0.280 (7,11) 0.100 (2,54) 0°–15° NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a ceramic lid using glass frit. D. Index point is provided on cap for terminal identification. E. Falls within MIL STD 1835 GDIP1-T8

Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46, latestissue,and todiscontinueany productorserviceperJESD48, latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. 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No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents as meetingISO/TS16949 requirements,mainlyforautomotiveuse.Inany case ofuse of non-designatedproducts,TIwillnotbe responsibleforany failuretomeet ISO/TS16949. 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