TCFL0402CF-7N5

TCFL0402CF TRANSKO | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 3

Technical content

Rev 1: 06-05-2020 Ceramic Chip Inductor (1.19 x 0.65 x 0.66 mm)

FEATURES

• Ultra Miniature SMD Package • High SRF
• High Frequency • High Q value SPECIFICATION Part Number L( nH)/@MHz Inductance tolerance Q min @250MHz SRF(MHz) min. DCR (Ω) Max IDC (mA) Max TCFL0402CF-1N0_ 1.0 / 250 J，K 13 6000 0.045 1360 TCFL0402CF-1N8_ 1.8 / 250 J，K 16 6000 0.070 1040 TCFL0402CF-1N9_ 1.9 / 250 J，K 16 6000 0.070 1040 TCFL0402CF-2N0_ 2.0 / 250 J，K 16 6000 0.070 1040 TCFL0402CF-2N2_ 2.2 / 250 J，K 19 6000 0.070 960 TCFL0402CF-2N4_ 2.4 / 250 J，K 15 6000 0.068 790 TCFL0402CF-2N7_ 2.7 / 250 J，K 16 6000 0.120 640 TCFL0402CF-3N3_ 3.3 / 250 J，K 19 6000 0.066 840 TCFL0402CF-3N6_ 3.6 / 250 J，K 19 6000 0.066 840 TCFL0402CF-3N9_ 3.9 / 250 J，K 19 6000 0.066 840 TCFL0402CF-4N3_ 4.3 / 250 J，K 18 6000 0.091 700 TCFL0402CF-4N7_ 4.7 / 250 J，K 15 4700 0.130 640 TCFL0402CF-5N1_ 5.1 / 250 J，K 20 4800 0.083 800 TCFL0402CF-5N6_ 5.6 / 250 J，K 20 4800 0.083 760 TCFL0402CF-6N2_ 6.2 / 250 J，K 20 4800 0.083 760 TCFL0402CF-6N8_ 6.8 / 250 G，J，K 20 4800 0.083 680 TCFL0402CF-7N5_ 7.5 / 250 G，J，K 22 4800 0.100 680 TCFL0402CF-8N2_ 8.2 / 250 G，J，K 22 4400 0.100 680 TCFL0402CF-8N7_ 8.7 / 250 G，J，K 18 4100 0.200 480 TCFL0402CF-9N1_ 9.1 / 250 G，J，K 22 4160 0.100 680 TCFL0402CF-9N5_ 9.5 / 250 G，J，K 18 4000 0.200 480 TCFL0402CF-10N_ 10 / 250 G，J，K 21 3900 0.200 480 TCFL0402CF-11N_ 11 / 250 G，J，K 24 3680 0.120 640 TCFL0402CF-12N_ 12 / 250 G，J，K 24 3600 0.120 640 TCFL0402CF-13N_ 13 / 250 G，J，K 24 3450 0.210 440 TCFL0402CF-15N_ 15 / 250 G，J，K 24 3280 0.170 560 TCFL0402CF-16N_ 16 / 250 G，J，K 24 3100 0.220 560 TCFL0402CF-18N_ 18 / 250 G，J，K 25 3100 0.230 420 TCFL0402CF-19N_ 19 / 250 G，J，K 24 3040 0.200 480 TCFL0402CF-20N_ 20 / 250 G，J，K 25 3000 0.250 420 TCFL0402CF-22N_ 22 / 250 G，J，K 25 2800 0.300 400 TCFL0402CF-23N_ 23 / 250 G，J，K 22 2720 0.300 400 TCFL0402CF-24N_ 24 / 250 G，J，K 25 2700 0.300 400 TCFL0402CF-27N_ 27 / 250 G，J，K 24 2480 0.300 400 TCFL0402CF-30N_ 30 / 250 G，J，K 25 2350 0.300 400 TCFL0402CF-33N_ 33 / 250 G，J，K 24 2350 0.440 400 TCFL0402CF-36N_ 36 / 250 G，J，K 24 2350 0.440 320 TCFL0402CF-39N_ 39 / 250 G，J，K 25 2100 0.550 200

Rev 1: 06-05-2020

• Inductance tolerance: Letter at end of part number: G = ±2% ; J = ±5% ; K = ±10% ● Specifications are measured using HP E4991A DIMENSIONS SOLDER PATTERN Unit: mm A B C D F G D1 D2 D3 ELECTRODE TERMINAL L vs FREQUENCY Q vs FREQUENCY Part Number L( nH)/@MHz Inductance tolerance Q min @250MHz SRF(MHz) min. DCR (Ω) Max IDC (mA) Max TCFL0402CF-40N_ 40 / 250 G，J，K 24 2240 0.440 320 TCFL0402CF-43N_ 43 / 250 G，J，K 25 2030 0.810 100 TCFL0402CF-47N_ 47 / 200 G，J，K 20 2100 0.830 150 TCFL0402CF-51N_ 51 / 200 G，J，K 25 1750 0.820 100 TCFL0402CF-56N_ 56 / 200 G，J，K 22 1760 0.970 100 TCFL0402CF-68N_ 68 / 200 G，J，K 22 1620 1.120 100 TCFL0402CF-82N_ 82 / 150 J，K 20 1260 1.550 50 TCFL0402CF-R10_ 100 / 150 G，J，K 20 1160 2.000 30 TCFL0402CF-R12_ 120 / 150 G，J，K 20 1900 2.200 50

Rev 1: 06-05-2020 1.Operating temperature range -40 TO + 105°C (Includes temperature when the coil is heated) 2. External appearance On visual inspection, the coil has no external defects. 3. Terminal strength After soldering. Between copper plate and terminals of coil. Push in two directions of X.Y withstanding at below conditions. Terminal should not peel off. (refer to figure at right) 0.5kg 4. Insulating resistance Over 100MΩ at 100V D.C. between coil and core. 5. Dielectric strength No dielectric breakdown at 100V D.C. for 1 minute between coil and core. 6. Temperature characteristics Inductance coefficient (0~2,000)x10-6 /°C (-25~+80°C) inductance deviation within ±5.0%, after 96 hours 7. Humidity characteristics (Moisture Resistance) Inductance deviation within ±5%, after 96 hours in 90~95% relative humidity at 40 ±2°C and 1 hour drying under normal condition. 8. Vibration resistance Inductance deviation within ±5%, after vibration for 1 hour. In each of three orientations at sweep vibration (10~55~10 Hz) with 1.5mm P-P amplitudes. 9. Shock resistance Inductance deviation within ±5%, after being dropped once with 981m/s 2 (100G) shock attitude upon a rubber block method shock testing machine, in three different orientations. 10. Resistance to Soldering Heat: 260°C, 10 seconds (See recommend reflow) 11. Storage environment Temperature: 0°C~35°C; -40°C~105°C (after mounting on PCB) Humidity Range: 50% ~ 80% RH 12. Use components within 12 months. If 12 months or more have elapsed, check solderability before use. RELIABILITY TEST Transko Electronics, Inc reserves the right to make changes to the product (s), service (s), and specification (s) described herein without notice. See “Terms of Sale” for details on our website. LEAD-FREE HEAT ENDURANCE TEST LEAD-FREE RECOMMENDED REFLOW