TCD1300D

TCD1300D TOSHIBA | Alldatasheet

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TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) The TCD1300D is a high sensitive and low dark current 3648-elements linear image sensor. The sensor can be used for facsimile, imagescanner and OCR. The signal pre- processing circuit which is composed of Sample and Hold = circuit and Pre-amplifier circuit. The device contains a row = —S of 3648 photodiodes, which provide a 16 lines/mm — “ 7 oun (400DP!) across a A4 size paper. N= nL

FEATURES

@ Number of Image Sensing Elements : 3648 @ Image Sensing Element Size : 84m by 84m on 8um WDIP22-G-400-2.54A centers Weight : 4.4g (Typ.) © Photo Sensing Region : High sensitive pn photodiode © Clock : 2 phase @ Internal Circuit : S/H circuit, Pre-Amplifier circuit @ Package : 22 pin cerdip MAXIMUM RATINGS (Note 1) PIN CONNECTIONS CHARACTERISTIC SYMBOL RATING UNIT =o ss Clock Pulse Voltage os Ne shift Pulse Voltage | 4 Reset Pulse Voltage vao [3] Dos Sample and Hold ne [4] [13] sw Vsp v Pulse Voltage -03~15 nc [5] [ie] sp Switch Pulse Voltage ss[e] ss Power Supply Voltage v, v 7 (Analog) AD “Ee Ll se Power Supply Voltage Vy Vv nce] [is] nc (Driver) DD LP] [ra] nc Operating Temperature = 25~60 voo [ro] fa] vss Storage Temperature -40~100 SH Ne (Note 1) All voltage are with respect to SS and Vss terminals (Ground). (TOP VIEW) 2610016802 malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to observe standards of safety, and to avoid situations in which a malfunction or failure of a TOSHIBA product could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent products specifications. Also, please keep in mind the precautions and conditions set forth in the TOSHIBA Semiconductor Reliability Handbook 1997-06-30 1/13

T_~-¥ © CCD ANALOG SHIFT REGISTER 2 SIGNAL OUTPUT BUFFER SHIFT GATE 2 Pos @® OUTPUT BUFFER CCD ANALOG SHIFT REGISTER 1 ad O——9 eae Yoo SW Rf «SP OSH PIN NAMES [¢ ___[Gock [si [shift ate Reset Gote | sp | Sample Hold Gate | os —signat Output Compensation Output Power (Analog) Power (Driver) Ground (Analog) Ground (Driver) Final Clock Select Switch Non Connection

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@ The products described in this document are subject to foreign exchange and foreign trade control laws, © ‘he Information contained herein 's presented only as 9 guide for the applications of our products. No responsibility is assumed by, TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. NO license is granted by implication or otherwise Under any intellectual property oF other rights of TOSHIBA CORPORATION or others @ The information contained herein is subject to change without notice 1997-06-30 2/13

OPTICAL / ELECTRICAL CHARACTERISTICS (Ta =25°C, Vap = 12V, Vpp = 12V, Vé =VsH = Ves =5V (PULSE), f¢ =0.5MHz, fps = 1MHz, tint (INTEGRATION TIME) = 10ms, LIGHT SOURCE = DAYLGIHT FLUORESCENT LAMP) CHARACTERISTIC SYMBOL | win. | tye. | max. | UNIT NOTE [sensitivity RB 7 TvsiesT Photo Response Non Uniformity prnu(iy | — [ — [ wo | % {Note 2) [Register Imbatance ——S~s~S rt SCT CS | | 8 | % | (Note) | Saturation Output Voltage [Vest | 70 [15 [ — [Vv _| Wiote 5) [Saturation Exposure ——S~sCESSSC*C Sd | || ote | Dark Signal Voltage VDRK P= | = [3 | mv J ote?) Dark Signal Non Uniformity [psnu | — [= [3 | mv | ote 7)_| Analog Current Dissipation a [Driver Current Dissipation | ipo | — | 8 | 15 | ma [|_| Total Transfer Efficiency [me ps2 |[—~-|[* ~ | Output Impedance [2 | — [os [+ pen [4 DC Signal Output Voltage [Vos | 35 [45 [6 [| v_| Wote 8) DC Compensation Output Voiage | Vos | 35 | 45 | 6 | V_| (Note 8) DC Mismatch Voltage Wosvpos | — | — [100 [mv |_| (Note 2) Measured at 50% of SE (Typ.) Definition of PRNU : PRNU= =o x 100 (%) Where X is average of total signal outputs and Ax is the maximum deviation from % under uniform illumination. (Note 3) PRNU (3) is defined as maximum voltage with next pixel, where measured 5% of SE (Typ.) (Note 4) Measured at 50% of SE (Typ.) RI is defined as follows: 3647 2, jxn-xn + 1| 3647 x ¥ Where xn and xn +1 are signal outputs of each pixel. ¥ is average of total signal outputs. (Note 5) Vsat is defined as minimum saturation output voltage of all effective pixels. (Note 6) Definition of SE: SE= SAT. (1x) 9997-06-30 3/13

(Note 7) Vprk is defined as average dark signal voltage of all effective pixels. DSNU is defined as different voltage between VprK and VimpK when Vypk is maximum dark signal voltage. os vmok| Vork DsNu (Note 8) DC signal output voltage and DC compensation output voltage are defined as follows: os Y Vos Yoos ss 1997-06-30 4/13

CHARACTERISTIC SYMBOL | min, | orve. | max. | UNIT Las [so | a Clock Pulse Voltage Th eve Vg Vv [ofp 05] Shift Pulse Voltage [H* Level Vs | 45 | 50 [ 13 | y [of os] Las 50] 3] Reset Pulte Voltage Porters] Ys [ota] Sample and Hold Pulse Voltage v | 45 [| 50 [ 13 | y (Note 9) ae a [asso 13] Switch Pulse Voltage aa} Vsw v [0 —_[o5_] Power Supply Voltage (Analog) | Van [| 4 fi] 3 fv Power Supply Voltage (Driver) [ vop foo fe Ts (Note 9) Supply "H” level to SP terminal when sample-and-hold circuitry is not used. CLOCK CHARACTERISTICS (Ta = 25°C) CHARACTERISTIC SYMBOL | min. | orve. | max. | UNIT Clock Pulse Frequency | fg | — [05 | 15 | Miz | Reset Pulse Frequency | frs [| — [ 1 | 3 | Miz | Sample and Hold Pulse Frequency | tsp | — [ot | 3 | Mae | Clock Capacitance | cy, | — | 20 | 40 | pF [shift Gate Capacitance Tg | CT 20 [Reset Gate Capacitance rs | Tt 20 Sample and Hold Gate Capacitance [esp | =| 10 | 20] oF] Switch Gate Capacitance P cw f= [0 20 TF TOO «97-06-30

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os " Y iY Yip LQ Siena |_ sow _| Y Y “Y WY «Wy l Uf 113 82 a Video Data Delay Time (Note 9) ° CHARACTERISTIC SYMBOL | min. [eetPiay | Max. | UNIT (Note 10) " SH Pulke Rise Time, Fall Time Lew] 0 | » > — |m_ [se Puke width i800 F000 | fe Rise Time, Fail mes | RS Rise Time, Fall Time [oe] 0 | 0 | =] rs RS Pulse Width pf oT so | Ts Pulse Timing of 7 and RS oar — 0 | 100 [=] rs SP Rive Time, Fall Time v2, ti4_[ —10| 100] — | ns _] SP Pulse Width [oes [20900 | Pulse Timing of SP and AS [sos Pulke Timing of g and SP [e350 Pulse Timing of SH and SP Sc (Note 10) TYP. is the case of fps = 1MHz. (Note 11) Load Resistance is 100kQ.. (Note 12) The Case of Non Using the Dos Ons. 1997-06-30 7/13

TYPICAL PERFORMANCE CURVES SPECTRAL RESPONSE " FS ese | ofA Ti ITNT itt tt , CLEFT N EEE er zt} TAT TT tt se tit ry PP iN TTT ry ee zo tT TET TT RET TTT TT eg {TTT TEP PIN Tete et | of TEEPE TE NET TET poppy Pr yn Ait ti ti tii t | swt WAVE LENGTH 4 (nm) MODULATION TRANSFER FUNCTION MODULATION TRANSFER FUNCTION OF X-DIRECTION OF Y-DIRECTION SPATIAL FREQUENCY (Cycles/mm) SPATIAL FREQUENCY (Cycles/mm) 2 125 25 375 50 625 2 125 25 375 50 625 fT TTT eT TT yy [iT tT tT ttt Pet ety yy Pett ttt ty 10 = a PP Te TET PPP TET | wt tT AAT TY aw ELE ENE BLL | pete SAS I ee ~j tT TPT Pr irs > f PPT Tt NG Pity ey et ye PT tty ttt atti Ett Tt ty ott tt tt tt Litt tty tt ty Pit tT ey ery wali tt ttt It | w ttt tT ttt tf 0 02 oa 06 08 10 0 02 04 06 08 10 NORMALIZED SPATIAL FREQUENCY NORMALIZED SPATIAL FREQUENCY 1997-06-30 8/13

TYPICAL PERFORMANCE CURVES (Cont'd) CURRENT DISSIPATION (ANALOG) - CURRENT DISSIPATION (DIGITAL) - OPERATING FREQUENCY OPERATING FREQUENCY es Vap=VDD= 12 Vap =VoD= 12 30) 30) & & Po ee z 2 2 2 2 2 é ‘ ‘ : a B10 | 1 | 85 10 15. 20°25 ~~«<30 8519.15.20 25.30 RESET PULSE FREQUENCY fpata (MHz) RESET PULSE FREQUENCY fpata (MHz) 1997-06-30 9/13

TYPICAL PERFORMANCE CURVES DC OUTPUT VOLTAGE - DC OUTPUT VOLTAGE - AMBIENT TEMPERATUER POWER SUPPLY VOLTAGE 10) 10) ee Pt ft yy fee] i | | | ft Jit i tt ty a a rs ee gf | T | | tf a a a ee % 20 40 60 50 W 12 3 14 AMBIENT TEMPERATUER Ta (°C) POWER SUPPLY VOLTAGE Vop (V) DARK SIGNAL VOLTAGE - INTEGRATION TIME g eee eee eee a 3 a 407 2 bet AA BOMAiiilinmmanivasericl gs LUT VA |S Nal) Blo ccc ny Aa or a AR < < pe AAA ala [HH 2-6 A ATH ss | TTT Gen ieaMniilil a a ZZ ae VAL Y ar Sass AV 2= 2e5 ee nee: gle AA a|e tA AA PA AFA A ee F420") A jo? 10-1 1 10 INTEGRATION TIME tiyt (5) 1997-06-30 10/13

+5V oape #0 + [>o + SPO. - f>o - Load Ar receeacnenenene TS NC DOS SW SP SS NC NC NC Wop NC TCD1300D Soe eee oe re = +12V = + S gS. Ss. EY 2 2 > > ot 8 + 8 1502 = Va os O ° . vos 7x ar PS gg oa es ler: Tevanceaae ~ ~ TRI : 281815 TR2 : 2SC1815 1997-06-30 11/13

1. Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. 3. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 1997-06-30 12/13

WDIP22-G-400-2.54A (F) Unit : mm So 2 3 4 oe = ed PY BS $F g SS 8 + 1 1 s a 41.640.5 $ 2 rz) | £ g LLL - Zz | 8 S re) 1.3140.1 (Note 1) No.1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. (Note 2) TOP OF CHIP TO BOTTOM OF PACKAGE. (Note 3) GLASS THICKNES (n= 1.5) Weight : 4.4g (Typ.) 1997-06-30 13/13