TCD1252AP TOSHIBA | Alldatasheet
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TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) The TCD1252AP is a high sensitive and low dark current 2700- elements linear image sensor. The sensor can be used for facsimile, imagescanner and OCR. The device contains a row of 2700 photodiodes, which provide a 8 oN lines /mm (200 DPI) across a A3 size paper and a 12 lines/ == eo mm (300DPI) across a A4 size paper. The device is << — aarit ie operated by 5V (pulse), and 12V power supply. ey
FEATURES
@ Number of Image Sensing Elements : 2700 WDIP22-G-400-2.54A @ Image Sensing Element Size : 112m by 114m on 11m Weight : 2.79 (Typ.) centers Photo Sensing Region High sensitive, Low dark PIN CONNECTIONS current @ Clock : 2 phase (5V) 0s ss @ Package : 22 pin Cerdip (T-CAPP) bos sH TOSHIBA-CCD-ADVANCED-PLASTIC-PACKAGE op, NC rs [a] [19] 62 MAXIMUM RATINGS (Note 1) ne [5 | [ig] nc CHARACTERISTIC SYMBOL RATING UNIT #16] ne Clock Pulse Voltage we Les] nc Shift Pulse Voltage v ne [e] [15] nc Reset Pulse Voltage ne Do] [ra] nc Power Supply Voltage ne [ro] [ia] nc Operating Temperature = 25~60 Ne Fra] nc Storage Temperature =40~100 (Note 1) All voltage are with respect to SS terminals (Ground). (TOP VIEW) 961001EBA1 @ TOSHIBA is continually working to improve the quality and the reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to observe standards of safety, and to avoid situations in which a malfunction or failure of a TOSHIBA product could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent products specifications. Also, please keep in mind the precautions and conditions set forth in the TOSHIBA Semiconductor Reliability Handbook. Ste products described in this document are subject to foreign exchange and foreign trade control laws. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. @ The information contained herein is subject to change without notice. 1997-04-07 1/13
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"9 |} SIGNAL CCD ANALOG SHIFT REGISTER 2 | BUFFER wlele]__|aJele moro _ [8 ]3)]els BSls} S/F |alalayp~ Bore ~ 4S] S1S1I COMPENSATION caer GAIT 20@} output Pre BUFFER CCD ANALOG SHIFT REGISTER 1 PIN NAMES Clock (Phase 1) Clock (Phase 2) Shift Gate Signal Output Compensation Output 1997-04-07 2/13
OPTICAL / ELECTRICAL CHARACTERISTICS (Ta =25°C, Vop = 5V, V¢ =VsH = Ves = 5V (PULSE), f¢ =0.5MHz, fps = 1MHz, LOAD RESISTANCE = 100kQ, tint (INTEGRATION TIME) = 10ms, LIGHT SOURCE = DAYLGIHT FLUORESCENT LAMP) CHARACTERISTIC SYMBOL | min. | tye. [ max. | uni | NOTE [sensitivity SCS SR ——~*| «| 13 | 82 | is | (Note 2) Photo Response Non Uniformity PRNU (3) L— Lo? f 16 | mv_| (Note 10) Register Imbalance [rf — | — | 3] % | Mote a Saturation Output Voltage [vsar [40 75 [| — |v | Wote 5) [Saturation Exposure ——~—S~dCTSCSESSS*YC | 00 | — | Ts | (Note 6) Dark Signal Voltage Vork | _— | 2.) 6 | _mv_| (Note 7) Dark Signal Non Uniformity DSNU | — | 3 {| 7] mv [| (Note 7) [Oc Power Dissipation SST >| — | 35 | oof mw Total Transfer Efficiency a Output Impedance [7% |—-|,;—-|,7;m] | DC Signal Output Voltage [vos | 25 | 35 | 45 | V_| (ote) | DC Compensation Output Voltage Vpos [25 | 35 [45] vi | (Note 9) DC Mismach Voltage WosVpos|_| — | 50 | 100 [mv | (Note 9) [Random Nose SSSSSCSCSC*d SSC | — | 15 | — | mv _| (Note 11) (Note 2) Sensitivity for 2856K W-Lamp is 105V/Ix-s (Typ.) Sensitivity for LED (567nm) is 22.7V/Ix-s (Typ.) (Note 3) Measured at 50% of SE (Typ.) Definition of PRNU: PRNU=—S— x 100 (%) Where X is average of total signal outputs and Ax is the maximum deviation from % under uniform illumination. (Note 4) Measured at 50% of SE (Typ.) RI is defined as follows: 2699 = 1 |xn-xn + 1| 2699 x X Where xn and xn +1 are signal outputs of each pixel. % is average of total signal outputs. (Note 5) VsaT is defined as minimum saturation output voltage of all effective pixels. Vi (Note 6) Definition of SE : SE= AL (Ix-s) 1997-04-07 3/13
(Note 7) Vprk is defined as average dark signal voltage of all effective pixels. DSNU is defined as different voltage between VprK and Vipk when Vyypk is maximum dark signal voltage. os VMok Vork DsNu (Note 8) Definition of DR: DR= SAT. DRK VprK is proportional to tiyT (Integration time). So the shorter tiyT condition makes wider DR value. (Note 9) DC signal output voltage and DC compensation output voltage are defined as follows: os Dos Vos Voos ss ss VDD =4.7V DC Mismatch Voltage. (Note 10) PRNU (3) is defined as maximum voltage with next pixel where measured 5% of SE (Typ.). 1997-04-07 4/13
(Note 11) 1. DEFINITION Random noise is defined as the standard deviation (sigma) of the output level difference between two adjacent effective pixels under no illumination (i.e. dark condition) calculated by the following procedure. 2. CALCULATION PROCEDURE The following is the calculation procedure of random noise. VIDEO OUTPUT VIDEO OUTPUT OUTPUT WAVEFORM (effective pixels under dark Leb | | PIXEL PIXEL (n+ 1) t 1) Two adjacent pixels (pixel n and n+1) in one reading are fixed as measurement points. 2) Each of the output levels at video output period is averaged over 200 nanosecond period to get Vn and Vn +1. 3) Vn+1 is subtracted from Vn to get AV. AV=Vn-Vn+1 4) The standard deviation of AV is calculated after procedure 2) and 3) are repeated 30 times (30 readings). — 130. 1 30 AV= = -/— il] —AV 3012, 4Vl o=/ 30 jE lavil-ave 5) Procedure 2), 3) and 4) are repeated 10 times to get 10 sigma values. — 10 oe 702 14 6) @ value calculated using the above procedure is observed V2 times larger than that measured relative to the ground level. So we specify the random noise as the following. “ _ Random noise (Np,) =—— & “v2 1997-04-07 5/13
CHARACTERISTIC. SYMBOL ] min. | ve. | max. | UNIT [as [5 [35 | Clock Pulge Voltage “foto fos| [4s [5 [55 | Snift Pulke Voltage va [of o fos} [a7 [5 [55 | Reset Pulke Voltege ves {of o fos | * Power Supply Voltage [Woo [a7 [50 [53 Tv CLOCK CHARACTERISTICS (Ta = 25°C) Clock Capacitance [cs | [200 | 300 | oF Shift Gate Capacitance | “esq [=| 100 [200 | oF 1997-04-07 6/13
as =8 ea Be Bn gc re a isa Ne a osa NI 2 6rd B 2 ava _ z= va ree iS ova 258 rg Pas 5 sva 35% 2 vv Csla 5 eva “15 © zra gz iva a2 ord S 2 ? oozes 66975 Yo = 22 ve ss 53 bs of z 3 Zz ~ ec 6s SS 33 FA g zs 85 Ei ia is o ze . 9 “ea = Q 5 of sea a Fe : sea 2 5 2 6z veo 8 vo & o Fi a ea E o za Eo Zz 4b lea oz fa = oza os Fe ou 6ta a aia es] 6 ua = $ gia 3 fa 8 sta = va 2 ‘ £10 = za z 9 tL 2 € 9a 28 sa ee z va ze €a Em n za BE bE a _ oe ia < 0 oa KR Fa | u Fs g & 2 a = 3 5 = z P % 2 3 2 = Fa 3 3 2 8 é i 1997-04-07 7/13
SH, ¢1 Timing $1, $2, RS, OS Timing 2, 8 jt sH ‘6 7 ts “1 i \\ / +10 ts Ai A $1, $2 Cross Point *s cal 1.5V (MIN) \\ 1.5V (MIN) (Note 12) i: Pulse Timing of SH and ¢1 (Note 14)[ t1,t5 [ 500 [| 1000 [ — | ns | SH Pulse Rise Time, Fall Time Dew [of so [| — [ns _| SH Pulse Width (ote ta | 3 | 1000 | 2000 | — | ns _| #1, 42 Pulse Rise Time, Fall Time Dw [of 10 — [ns _| RS Pulse Rise Time, Fall Time [wt [0] 2 | 6 | ns_| RS Pulse Width D3 | 40 | 250 — [ns _| Pulse Timing of 1, g2 and RS De 20 | — | — | -s_| Video Data Delay Time (Note 13) [| t12,t13 [| — [| 120 [ — | ns | RS Noise Delay Time ja [| = [| oT = [ons | [as [= 900s (Note 12) TYP. is the case of fps =1MHz (Note 13) Load Resistance is 100kQ (Note 14) This condition is SHR=00 1997-04-07 8/13
TYPICAL PERFORMANCE CURVES ‘SPECTRAL RESPONSE “ ETN EEL Lee) wit N tT tt tt ~ ELEEEENE ETE PEE g PEE EEE] e Litt tT ty ALT Tee eof titi PTiX tt ity tt eee Nee ee “ot TET TTT NET TT eee eee Nees LIT TT titty | Ste Tt | WAVE LENGTH 2 (nm) MODULATION TRANSFER FUNCTION MODULATION TRANSFER FUNCTION OF X-DIRECTION OF Y-DIRECTION SPATIAL FREQUENCY (Cycles/mm) SPATIAL FREQUENCY (Cycles/mm) a 94 18.2 273 364 455 a 91 18.2 273 364455 ae itty ttt yyy aE ET ee tT wt tt tT PP reAL ETT | TPN ET TET wt tT TAAL T TT wt PNA TT BLL [esse TAA | BL] | I | scsom NOT S ~ J TTT tT ttt nN >i PEPE TTT TN Fit T tt tity pit ttt ttt ty ao LET TT TT tT ot ttt tt TT Litt ttt tit Pitt T ey trey w LETT Ty ttt | w-LTTTTTt tt I 0 02 04 06 08 1.0 0 0.2 04 06 08 10 NORMALIZED SPATIAL FREQUENCY NORMALIZED SPATIAL FREQUENCY 1997-04-07 9/13
TYPICAL PERFORMANCE CURVES DC OUTPUT VOLTAGE - DC OUTPUT VOLTAGE -
10 AMBIENT TEMPERATUER 10 POWER SUPPLY VOLTAGE
CT =] om |] Poe), EE a a a a ebPrpprpr) & pepper eo} § Peer i en 3 a ee ia | }-t+-t—- a | = a a a a 2 ie nel eats eaten ohio ee ee ee ee a | COE AMBIENT TEMPERATUER Ta (°C) : POWER SUPPLY VOLTAGE Vop wo DARK SIGNAL VOLTAGE - INTEGRATION TIME 1000 oP OA bea ZA TT ul. A st Eee $ $ eee Mall Il ° AC YM Tt Ty] 72aniN INTEGRATION TIME tint (5) TOTO 9-04-07 «10773
+5V ope ° | Do {sa SHR = 4kQ (TYP) H H H | H tas ict i o— He * i i Meena SS SH NC g2 NC NC NC NC NC NC NC TCD1252AP OS DOS OD RS NC #41 NC NC NC NC NC TEST ve ee «| ute ST FS . $3 22000 1500 TRI : 25A1015-Y Re TR2 : 2SA1015-Y os 1997-04-07 11/13
- Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry Nz. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. 3. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 4. Lead Frame Forming Since this package is not strong against mechanical stress, you should not reform the lead frame. We recommend to use a |C-inserter when you assemble to PCB. 1997-04-07 12/13
WDIP22-G-400-2.54A Unit : mm (Note 1) 2 0.740.1 i to a] ((G g| os 8 8 2 © Ls + (ote 4) lI al = 0.440.8 I. Py er 41.640.5 <3 OF 4 rr ATM i bt} 2.5440.25 0.4740.15 FSI (Note 1) No.1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. (Note 2) TOP OF CHIP TO BOTTOM OF PACKAGE. (Note 3) GLASS THICKNES (n=1.5) (Note 4) No.1 SENSOR ELEMENT (S1) TO CENTER OF No.1 PIN. Weight : 2.7g (Typ.) 1997-04-07 13/13