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1 2020-09-25 © 2018-2020 Toshiba Electronic Devices & Storage Corporation CDMOS Linear Integrated Circuit Silicon Monolithic TCB701FNG Maximum Power 49 W BTL × 4-ch Audio Power IC with Built-in Self-Diagnostics 1. Outline The TCB701FNG is a power IC with built-in linear high efficiency 4-channel BTL amplifier developed for car audio applications. The amplifier system uses our original high efficiency, class TB (Tied BTL), which enables saving heat generation to 1/5 (at POUT =0.8 W) as compared with conventional class AB amplifier, and realizes reducing internal temperature rise of car audio applications. The power loss with output power equivalent to a class D system (digital amplifier) in about 4 W or less is acquired. Additionally, this product can realize high efficiency system without peripheral parts (which are used for LPF and EMI protection) of class D system. Built-in self-diagnostics allows the data reception and control through I2C bus. The maximum output power POUT is 49 W using a pure complementary Higher P-ch and Lower N-ch DMOS output stage. It also includes a standby function, a mute function, and each protection circuit necessary for car audio. 2. Applications Power IC for car audio applications. 3. Features Our original high efficiency amplifier; class TB(Tied BTL) Built-in fulltime output offset detection Built-in +B low voltage detection (6 modes by I2C control) Built-in standalone control mode (power ON / OFF and a mute control can be controlled without I2C BUS) Built-in output clip detection Built-in cross output connection detection (Output short detection between different voltage) Built-in various mute functions (at low voltage, standby ON / OFF, fast, and I2C control) 6 V operations (Engine idle reduction capability) Built-in hardware standby function Built-in various protection circuits (thermal shut down, over voltage, short to VCC, short to GND, and output to output short) The short-circuit protection can operate per channel. Control function via I2C bus Standby ON / OFF operation Front / Rear separate mute operation and fast mute operation setting Changing the time constants of mute (30 ms / 15 ms (typ.)) Front / Rear separate 2-step gain adjustment (26 dB / 16 dB) Changing Power amplifier mode / Line driver mode Changing clip detection (THD = 2% / 5 % / 10%) Setting of output offset detection operation Setting and startup of self-diagnostics Setting parameters and startup of current detection Setting rare short propriety Information capable to acquire via I2C bus Each output detection per channel (irregular connection, offset, and current detection for tweeter) Information which is immediately before startup of over temperature protection, and acquisition of each setting state Note: Typical test conditions: VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, GV = 26 dB, Ta = 25°C; unless otherwise specified. Note: Since static electricity serge intensity has a weak part according to conditions, please ask us with the detailed conditions of a static electricity serge examination. Weight: 1.28 g (typ.) Table 3.1 Typical characteristics (Note) Condition Typ. Unit Output power (POUT) VCC = 15.2 V, Po max 49 W VCC = 14.4 V, Po max 45 VCC = 14.4 V, THD = 10% 27 THD = 10% 25 Output power (POUT) (RL = 2 Ω) VCC = 14.4 V, Po max 70 W VCC = 14.4 V, THD = 10% 45 Total harmonic distortion (THD) POUT = 0.4 W 0.01 % Output noise voltage (VNO) (Rg = 600 Ω) BW = DINAUDIO 60 µVrms Operating Supply voltage range (VCC(opr)) Amplifier circuit (RL = 4 Ω) 6 to 18 V Amplifier circuit (RL = 2 Ω) 6 to 16 Self-diagnostics circuit 7 to 18 V P-HSSOP36-1116-0.65-001
- Block Diagram Some of the functional blocks, circuits or constants may be omitted from the block diagram or simplified for explanatory purposes. Note: A "channel" is a circuit which consists of INx, OUTx(+), OUTx(-), and PW-GNDx. (x: 1 to 4) PW-GND3 PW-GND2 Ripple VCC2 VCC1 3900 μF 0.1 μF IN1 0.22 μF 10 μF OUT1(+) PW-GND1 OUT1(−) IN2 0.22 μF OUT2(+) OUT2(−) IN3 0.22 μF OUT3(+) OUT3(−) Pre-GND IN4 OUT4(+) PW-GND4 OUT4(−) SCL SDA ACGND 1 μF Stby ClipDET1 Protector BIAS RL RDET 10 kΩ Vdet Vstby VCC3 VCC4 ClipDET2 Mute Vmute VREF25 0.22 μF ADSEL OFFSETDET BuDET TAB RADSEL For values, refer to section 6.3 I2C Bus Diagnostics RCL 2.2 kΩ RDA 2.2 kΩ RL RL RL 1 μF Power ON Power OFF Play Mute Standby/Mute
- Pin Configuration 5.1. Pin Configuration Diagram (Top View) ClipDET1 VCC3 OUT3(-) PW-GND3 OUT3(+) VREF25 ACGND IN3 IN4 Pre-GND IN2 IN1 Ripple OUT1(-) PW-GND1 OUT1(+) VCC1 ClipDET2 BuDET OUT4(-) VCC4 OFFSETDET PW-GND4 OUT4(+) OUT4(+) SCL SDA ADSEL Mute OUT2(-) OUT2(-) PW-GND2 Stby VCC2 OUT2(+) TAB
5.2. Pin Descriptions Pin No. Pin name I/O Description
1 ClipDET1 Vdet-OUT Clip detection output (Front)
2 VCC3 VCC-IN Power supply 3
3 OUT3(-) OUT OUT3 (-) output
4 PW-GND3 ― GND pin for OUT3
5 OUT3(+) OUT OUT3 (+) output
6 VREF25 ― Internal bias (2.5 V)
7 ACGND ― Common reference voltage for all input
8 IN3 IN OUT3 input
9 IN4 IN OUT4 input
10 Pre-GND ― Signal ground
11 IN2 IN OUT2 input
12 IN1 IN OUT1 input
13 Ripple ― Ripple voltage
14 OUT1(-) OUT OUT1 (-) output
15 PW-GND1 ― GND pin for OUT1
16 OUT1(+) OUT OUT1 (+) output
17 VCC1 VCC-IN Power supply 1
18 ClipDET2 Vdet-OUT Clip detection output (Rear)
19 TAB ― TAB (Always connect with GND)
20 OUT2(+) OUT OUT2 (+) output
21 VCC2 VCC-IN Power supply 2
22 Stby Vstby-IN Standby voltage input
23 PW-GND2 ― GND pin for OUT2
24 OUT2(-) OUT OUT2 (-) output
25 OUT2(-) OUT OUT2 (-)output
26 Mute Vmute-IN Mute voltage input
27 ADSEL ― Slave address selection
28 SDA IN/OUT I2C serial data IO
29 SCL IN I2C serial clock input
30 OUT4(+) OUT OUT4 (+) output
31 OUT4(+) OUT OUT4 (+) output
32 PW-GND4 ― GND pin for OUT4
33 OFFSETDET Vdet-OUT Offset detection output
Short detection output (only for standalone control mode)
34 VCC4 VCC-IN Power supply 4
35 OUT4(-) OUT OUT4 (-) output
36 BuDET Vdet-OUT +B voltage detection
- Absolute Maximum Ratings (Unless otherwise specified, Ta = 25 °C) Characteristics Condition Symbol Rating Unit Instantaneous power supply voltage Within 0.2 s VCC (surge) 50 V Quiescent power supply voltage ― VCC (DC) 25 V Operating power supply voltage ― VCC (opr) 18 V Output current (peak) ― IO (peak) 9 A Power dissipation (Note 1). PD 50 W Operating temperature ― Topr -40 to 85 °C Storage temperature ― Tstg -55 to 150 °C Jumpstart (Note 2). VCC-jump(DC) 28 V Junction temperature ― Tj 150 °C Voltage difference between pins VCC1 to VCC2 △VCC1-2 ― ±0.3 V Pre-GND to PW-GND △GNDPRE-PW ― ±0.3 Input pin voltage ― Stby Gnd-0.3 to VCC(opr) Mute Gnd-0.3 to VCC(opr) IN(1 to 4) Gnd-0.3 to 5.3 ACGND Gnd-0.3 to 5.3 Ripple Gnd-0.3 to VCC(opr) ClipDET1/2 Gnd-0.3 to VCC(opr) OFFSETDET Gnd-0.3 to VCC(opr) VREF25 Gnd-0.3 to 5.3 BuDET Gnd-0.3 to VCC(opr) SCL/SDA Gnd-0.3 to 5.3 ADSEL Gnd-0.3 to 5.3 Note 1: Ta=25°C , Package thermal resistance under the infinite heat sinking use condition (Rth(j-t) = 1.3 °C/W) Note 2: +B (Battery) voltage is changed from 12 V to 28 V with rising SR 8.6 V/ms, Ta=25°C, for 1 minute applied. The maximum rating is the rating that should never be exceeded, even for a shortest of moments. If the maximum rating is exceeded, it could result in damage and/or deterioration of the IC as well as other devices beside the IC. Regardless of the operating conditions, please design so that the maximum rating is never exceeded. Please use within the specified operating range.
- Operating Range Characteristics Symbol Condition Min Typ. Max Unit Operating voltage range Amplifier circuit VCC RL=4 Ω (Note 1) 6 ― 18 V RL=2 Ω (Note 1) 6 ― 16 V Self-diagnostic circuit VCC (SD) ― 7 ― 18 V Connected load range Power amplifier mode 1 RL1 VCC = 6 to 18 V 4 ― ― Ω Power amplifier mode 2 RL2 VCC = 6 to 16 V 2 ― ― Ω Line driver mode RL3 IB2-D3=1 8 ― ― Ω Note 1: When the low voltage mute is operating, the operation starts from 7.5 V.
- Package Dimension Weight: 1.28g (typ.) “Unit : mm”
(1) Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. (2) Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. (3) Timing Charts Timing charts may be simplified for explanatory purposes. (4) Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Providing these application circuit examples does not grant a license for industrial property rights. (5) Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. (6) Customer inquiries: Automotive Marketing Group I Tel: +81-3-3457-3361 https://toshiba.semicon-storage.com/ap-en/contact.html IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterior ation, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, app ropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built -in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may resul t injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
[5] Carefully select external components (such as inputs and negative feedback c apacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection ty pe IC that inputs output DC voltage to a speaker directly. Points to remember on handling of ICs (1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage condition s, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (T j) a t any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into conside rate the effect of IC heat radiation with peripheral components. (4) Back-EMF When a motor reverses the rotation direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back -EMF. If the current sink ca pability of the power supply is small, the device ’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
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