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2021-01-29 1 © 2017-2021 Toshiba Electronic Devices & Storage Corporation CDMOS Linear Integrated Circuit Silicon Monolithic TCB001FNG Maximum Power 45W BTL × 4-ch Audio Power IC 1. Outline The TCB001FNG is a power IC with built-in four-channel BTL amplifier developed for car audio applications. The maximum output power (P OUT MAX) is 45W using a pure complementary P-ch and N-ch DMOS output stage. It also includes a standby switch, mute function and various protection features. 2. Applications Power IC developed for car audio applications. 3. Features

  • High output power, low distortion, and low noise property (For details, refer to the Table 3.1 Typical characteristics.)
  • Built-in various mute functions (At low voltage, standby on/off)
  • Built-in standby switch (Pin 22)
  • Built-in mute switch (Pin 33)
  • Built-in various detection circuits (output offset voltage, output short, over voltage) (Pin 29)
  • 6V operations (Engine idle reduction capability)
  • Built-in various protection circuits (thermal shut down, over-voltage, short to GND, short to VDD, load short, and prevention of speaker damage) Table 3.1 Typical characteristics (Typical test conditions: VDD = 13.2 V, f = 1 kHz, RL = 4 Ω, GV = 26 dB, Ta = 25°C; unless otherwise specified.) Note: R g: signal source resistance Weight: 1.28 g (typ.) Condition Typ. Unit Output power (POUT) VDD = 15.2 V, JEITA max 45 W VDD = 14.4 V, JEITA max 40 VDD = 14.4 V, THD = 10% 26 THD = 10% 22 Total harmonic distortion (THD) POUT = 4 W 0.01 % Output noise voltage (VNO) (Rg = 0 Ω) (Note) BW = 20 Hz to 20 kHz 45 µV Operating Supply voltage range (VDD) RL = 4 Ω 6 to 18 V P-HSSOP36-1116-0.65-001
  1. Block Diagram Some of the functional blocks, circuits or constants may be omitted from the block diagram or simplified for explanatory purposes. Note: A "channel" is a circuit which consists of INx, OUTx (+), OUTx (-), and PW-GNDx. (x: 1 to 4) 5 V 19 13 2 17 VDD2 VDD1 TAB1 Ripple C2 +B

14 OUT1 (+) 12

OUT1 (−) IN1

20 OUT2 (+) 11

OUT2 (−) IN2

5 OUT3 (+) 8

OUT3 (−) IN3

35 OUT4 (+) 9

32 PW-GND4

OUT4 (−) IN4

22 Stby

33 Mute

  1. Pin Configuration (Top View) NC VDD1 OUT3(-) PW-GND3 OUT3(+) NC AC-GND IN3 IN4 Pre-GND IN2 IN1 Ripple OUT1(+) PW-GND1 OUT1(-) VDD2 NC NC OUT4(+) NC Mute PW-GND4 OUT4(-) OUT4(-) DET NC NC TAB2 OUT2(-) OUT2(-) PW-GND2 Stby NC OUT2(+) TAB1
  1. Pin Descriptions Pin No. Pin name I/O Description

1 NC ― ―

2 VDD1 VDD-IN Supply voltage 1

3 OUT3(-) OUT 3ch output-

4 PW-GND3 ― Ground for 3ch output

5 OUT3(+) OUT 3ch output+

6 NC ― ―

7 AC-GND ― Common reference voltage for all input

8 IN3 IN 3ch input

9 IN4 IN 4ch input

10 Pre-GND ― Signal ground

11 IN2 IN 2ch input

12 IN1 IN 1ch input

13 Ripple ― Ripple voltage

14 OUT1(+) OUT 1ch output+

15 PW-GND1 ― Ground for 1ch output

16 OUT1(-) OUT 1ch output-

17 VDD2 VDD-IN Supply voltage 2

18 NC ― ―

19 TAB1 ― TAB (Always connect with GND)

20 OUT2(+) OUT 2ch output+

21 NC ― ―

22 Stby VST-IN Standby voltage input

23 PW-GND2 ― Ground for 2ch output

OUT2(-) OUT 2ch output-

26 TAB2 ― TAB (Always connect with GND)

NC NC ―

29 DET OD (Note) Offset detector output / short detector / over voltage

OUT4(-) OUT 4ch output-

32 PW-GND4 ― Ground for 4ch output

33 Mute VmuteIN Mute voltage input

34 NC ― ―

35 OUT4(+) OUT 4ch output+

36 NC ― ―

Note: OD: Open drain.

  1. Detailed Description 7.1. Specifications of External Components Note1: When the unrecommended value is used, please examine it enough by system evaluation. Note2: Since “AC-GND” pin is a common reference voltage for all input, this product needs to set the ratio of an input capacitance (C1) and the AC-GND capacitance (C6) to 1:4. Note3: Please use the low leak current capacitor for C1 and C6. Component Name Recommended Value Pin Purpose Effect (Note1) Lower than Recommended Value Higher than Recommended Value C1 0.22 μF INx(x:1 to 4) To eliminate DC Cut-off frequency becomes higher Cut-off frequency becomes lower C2 10 μF Ripple To reduce ripple Turn on time shorter Turn on time longer C3 0.1 μF VDD1, VDD2 To provide sufficient oscillation margin Reduces noise and provides sufficient oscillation margin C4 1 μF Mute To reduce pop noise (Note2) High pop noise. Mute release time shorter Low pop noise. Mute release time longer C5 3900 μF VDD1, VDD2 Ripple filter For power supply hum and ripple filter C6 1 μF AC-GND Common reference voltage for all input Pop noise is suppressed when C1: C6 = 1:4. (Note3) R1 47 kΩ Mute To reduce pop noise High pop noise. Mute release time shorter Low pop noise. Mute release time longer 5 V 19 13 2 17 VDD2 VDD1 TAB1 Ripple C2 +B

OUT1 (−) IN1 OUT2 (−) IN2 OUT3 (−) IN3 OUT4 (−) IN4

7.3. Mute Switch Function The audio mute switch is enabled by setting Pin 33 to Low. R1 and C4 determine the time constant of the mute. The time constant affects pop noise generated when power or the mute is turned on or off; thus, it must be determined on a per-application basis. And this pin is designed on the control voltage of 5V. If it is used on voltage other than 5V, please set the constant of R1 after referring to the following formula. For example, when the control voltage is changed from 5 V to 3.3 V, the pull-up resistor should be:

3.3 V/5 V × 47 kΩ = 31 kΩ

Figure 7.3 Mute Function Figure 7.4 Mute Attenuation - VMUTE (V) Pin 33 control voltage: VMUTE (V) ATT – VMUTE Mute attenuation ATT ( dB) −120 −100 −80 −60 −40 −20 0.5 1 1.5 2 2.5 3 5 V 10 kΩ

(Pin 22) Mute (Pin 33) VSB t t t Ripple (Pin 13) t VM t Mute control voltage VM Output pin VDD/4 Out sound time 500 ms (max) VDD/2 7.4. Automatic Mute Function The mute modes in this product are an internal mute for low voltage and a mute at standby off.

7.4.1 Low Voltage Mute Function

When the supply voltage becomes lower than 5.5 V (typ.), it operates the mute circuit automatically. This function prevents the large audible transient noise which is generated by low VDD

7.4.2 Standby Off Mute Function

The standby off mute function is a function of which the mute operation when standby off, and keep it in a fixed period. This mute function is released after the ripple pin is charged and the voltage condition (Vripple ≥ 1/4VDD) is filled. Figure 7.5 Sequence when standby-off

(Pin 22) Mute (Pin 33) VSB t t t Ripple (Pin 13) t VM t Mute control voltage VM Output pin VDD/4 VDD/2

7.4.3 Mute off after standby off

After standby off, a pop noise is generated when the mute operation is turned off before capacitor of ripple, input, and AC-GND are finished to charge enough. Please set “Mute-off” that it is sufficient margin in considering enough charge time after the middle point potential stable. Figure 7.6 Mute off sequence after standby-off

Vos-det (on) Power Amp IC Capacitor leak or short Vin(dc) RS2 RS1 Vout (dc) (Reference) When based on a negative phase amplifier output Rs1 generates the abnormal positive offset voltage. Rs2 generates the abnormal negative offset voltage. Vout (dc) > Vin (dc) V29 Resistor Short LPF smoothing circuit To microcontroller 7.5. Self-Diagnosis Detection (DET Pin) Self-diagnosis detects various abnormal states in this IC -peripheral and the state is notified to outside of the IC by making a MOS transistor ON. This function makes it possible to achieve a high reliable set design, not only power IC but also overall device protection system. If this function is not used, use the Pin 29 (DET pin) to open.

7.5.1 DC Offset Detection Function

This function detects and notifies with Pin 29 an offset voltage to be generated in the amplifier output when an offset voltage exceeds the regulated threshold. When an abnormal offset voltage is generated in the output by leakage of input capacitor, the abnormal state is fed back to the circuit. Then, in order to perform safety operation, this function can be used as "(a) offset voltage detection" which is a part of the configured functions. (a) Offset detection -> (b) Judgement Normal / Abnormal -> (c) To reduce the speaker stress (Standby-ON, Mute-ON etc.) The result of detection does not judge the abnormal offset or not. This function detects only the offset voltage which is decided by specification. Figure 7.7 Generating mechanism of a bnormal output offset voltage Figure 7.8 Output waveform of Pin 2 9 Offset detection output +Vos-det(on) -Vos-det(on) Output waveform OUT(+) to OUT(-) Abnormal offset voltage Term of abnormal offset voltage t V29

7.5.2 Output Short Detection Function

In case of s horting output to V DD/GND or supplying over voltage, the MOS transistor is turned on and can be And in the case of load short, the MOS transistor repeats turning on and off corresponding to the output signal. (Refer to Figure 7.11.) Please set a pull-up resistor so that the Io is 500 μA or less. Figure 7.9 Generating mechanism of output short detection 7.6. Reduction Capability of Sound Cutting and Pop Sound by Lowered VDD Voltage This IC has an amplifier circuit to reduce a sound cutting and a pop sound when the VDD voltage is lowered. This function can reduce the sound cutting and the p op sound which have been generated in the conventional IC by switching the middle point potential to 1/4VDD at lowered voltage momentary. Figure 7.11 Pin 29 output waveform at load short Figure 7.10 Pin 29 output waveform VP t t Microcontroller Output short / Load short / Over voltage Detector V29 V 29pin voltage GND Load short detection Cancel Load short 20 μs (min) Cancel V29 V 29pin voltage GND Short detection Normal Operation Output pin short/ Over voltage IO Normal Operation

7.7. Protection Functions This product has internal protection circuits such as thermal shut down, over -voltage protection, short to V DD protection, short to GND protection, and load short protection. (1) Thermal shut down It operates when junction temperature exceeds 150°C (typ.). When it operates, it is protected in the following order. 1. An Attenuation of an output starts first and the amount of attenuation also increases according to a temperature rising. 2. All outputs become in a mute state, when temperature continues rising in spite of output attenuation. 3. Shutdown function starts, when a temperature rise continues through all outputs are in a mute state. In any case if temperature falls, it will return automatically. (2) Over-voltage It operates when voltage exceeding operating range is supplied to V DD pin. If voltage falls, it will return automatically. When it operates, output bias is turned off and an output is intercepted. (3) Short to VDD, Short to GND, and load short It operates when each pin is in irregular connection. If irregular connection is canceled, it will return automatically. When it operates, output bias of corresponding output is turned off and an output is intercepted. (4) Prevention of speaker damage (in case of a layer short-circuit of the speaker) When the DC resistance between the OUT (+) and OUT (-) pins falls below 1 Ω, the output current exceeds 4 A(Typ.). At this time, the protection circuit is activated to limit the current draw into the speaker. This feature prevents the speaker from being damaged, as follows: < Speaker damaging scenario > A DC current of over 4 A is applied to the speaker pins due to an external circuit failure (Note). (Abnormal DC output offset) The speaker impedance becomes 1 Ω or less due to a layer short. A current of over 4 A (Typ.) flows into the speaker, damaging the speaker. Note: An abnormal DC offset voltage is incurred when the input bias to the power IC is lost due to a leakage current from a coupling capacitor at the input or a short-circuit between the IN and adjacent lines. Figure 7.12 Prevention of speaker damage Current into the speaker Speaker Impedance Less than 4 A About 1 Ω 4 Ω The short-circuit protection is activated

  1. Absolute Maximum Ratings (Ta = 25°C unless otherwise specified) Characteristics Condition Symbol Rating Unit Supply voltage (surge) Max 0.2 s VDD (surge) 50 V Supply voltage (DC) ― VDD (DC) 30 V Supply voltage (operation) ― VDD (opr) 18 V Output current (peak) ― IO (peak) 9 A Power dissipation (Note) PD 125 W Operating temperature range ― Topr -40 to 105 °C Storage/Junction temperature ― Tstg/Tj -55 to 150 °C GND potential tolerance ― GNDmax -0.3 to 0.3 V Vin max voltage ― Vinmax -0.3 to 5.3 V Max Standby/Mute input voltage ― VSTBmax -0.3 to VDD+0.3 V AC-GND/ripple max input voltage ― VACGmax -0.3 to 5.3 V Note: Package thermal resistance Rth(j-t) = 1.3°C/W (typ.) (Ta = 25°C, with infinite heat sink) The maximum rating is the rating that should never be exceeded, even for a shortest of moments. If the maximum rating is exceeded, it could result in damage and/or deterioration of the IC as well as other devices beside the IC. Regardless of the operating conditions, please design so that the maximum rating is never exceeded. Please use within the specified operating range. 9. Power Dissipation (1) Infinite heat sink Rth(j-t) = 1.3°C/W (2) Heat sink (Rth(HS) = 3.5°C/W) Rth(j-t) + Rth(HS) = 4.8°C/W (3) No heat sink Rth(j-a) = 39°C/W
  1. Operating Ranges Characteristics Symbol Condition Min Typ. Max Unit Supply voltage VDD RL=4Ω 6 ― 18 V
  1. Electrical Characteristics (VDD = 13.2 V, f = 1 kHz, RL = 4 Ω, GV=26dB, Ta = 25°C unless otherwise specified) Characteristics Symbol Test Condition Min Typ. Max Unit Quiescent supply current ICCQ VIN = 0 Vrms ― 200 300 mA Output power POUT MAX (1) VDD = 15.2 V, max POWER ― 45 ― W POUT MAX (2) VDD = 14.4 V, max POWER ― 40 ― POUT (1) VDD = 14.4 V, THD = 10% ― 26 ― POUT (2) THD = 10% ― 22 ― Total harmonic distortion THD POUT = 4 W ― 0.01 0.07 % Voltage gain GV VOUT = 0.775 Vrms 25 26 27 dB Channel-to-channel voltage gain ∆GV VOUT = 0.775 Vrms −1.0 0 1.0 dB Output noise voltage VNO Rg = 0 Ω, BW = 20 Hz to 20 kHz ― 45 70 μVrms Ripple rejection ratio R.R. frip = 100 Hz, Rg = 620 Ω Vrip = 0.775 Vrms (Note1) 50 70 ― dB Crosstalk C.T. Rg = 620 Ω POUT = 4 W ― 80 ― dB Output offset voltage VOFFSET ― −90 0 90 mV Input resistance RIN ― ― 90 ― kΩ Standby current ISTBY Standby condition, V4 = 0, V22 = 0 ― 0.01 1 μA Standby control voltage VSB H POWER: ON 2.2 ― VDD V VSB L POWER: OFF 0 ― 0.8 Mute control voltage VM H Mute: OFF 2.2 ― VDD V VM L Mute: ON, R1 = 47 kΩ 0 ― 0.8 Mute attenuation ATT M Mute: ON, VOUT = 7.75 Vrms → Mute: OFF 85 100 ― dB DC offset threshold voltage Voff-set Io=500 μA, Out(+) - Out(-) ±1.0 ±1.5 ±2.0 V Voltage at each detection ON condition P29-Det Io=500 μA, (Pin 29 = low) at detection ― 100 500 mV Note: VSBH, VMH, P29-Det should be used with less than 18 V. Note1: f rip: Ripple frequency Vrip: Ripple signal voltage (Superimposes on a VDD power supply)
  1. Test Circuit 5 V 19 13 2 17 VDD2 VDD1 TAB1 Ripple C2 +B

OUT1 (−) IN1 OUT2 (−) IN2 OUT3 (−) IN3 OUT4 (−) IN4 Note: Components in the test circuits are only used to obtain and confirm the device characteristics.

  1. Characteristic Chart (Reference) 13.1. Total Harmonic Distortion vs. Output Power Figure 13.1 T otal Harmonic Distortion of Each Frequency (RL = 4 Ω) Output power POUT (W) THD – POUT (ch1) THD – POUT (ch2) Output power POUT (W) Total harmonic distortion THD (%) Total harmonic distortion THD (%) THD – POUT (ch3) THD – POUT (ch4) Output power POUT (W) Output power POUT (W) Total harmonic distortion THD (%) Total harmonic distortion THD (%) f = 1 kHz 100 Hz 10 kHz 20 kHz VDD = 13.2 V GV = 26dB RL = 4 Ω Filter

100 Hz : to 30 kHz

1 kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to 100 0.001 0.003 0.005 0.01 0.03 0.05 0.1 0.3 0.5 0.3 0.5 3 10 50 100 1 5 30 0.1 f = 1 kHz 100 Hz 10 kHz 20 kHz VDD = 13.2 V GV = 26dB RL = 4 Ω Filter 1 kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to 100 0.001 0.003 0.005 0.01 0.03 0.05 0.1 0.3 0.5 0.3 0.5 3 10 50 100 1 5 30 f = 1 kHz 100 Hz 10 kHz 20 kHz VDD = 13.2 V GV = 26dB RL = 4 Ω Filter 1 kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to 100 0.001 0.003 0.005 0.01 0.03 0.05 0.1 0.3 0.5 0.3 0.5 3 10 50 100 1 5 30 f = 1 kHz 100 Hz 10 kHz 20 kHz VDD = 13.2 V GV = 26dB RL = 4 Ω Filter 1 kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to 100 0.001 0.003 0.005 0.01 0.03 0.05 0.1 0.3 0.5 0.3 0.5 3 10 50 100 1 5 30 0.1

Figure 13.2 T otal Harmonic Distortion by Power-supply Voltage (RL = 4 Ω) THD – POUT (ch1) THD – POUT (ch2) Output power POUT (W) Output power POUT (W) Total harmonic distortion THD (%) Total harmonic distortion THD (%) THD – POUT (ch3) THD – POUT (ch4) Output power POUT (W) Output power POUT (W) Total harmonic distortion THD (%) Total harmonic distortion THD (%) 13.2 V 100 0.001 0.003 0.005 0.01 0.03 0.05 0.1 0.3 0.5 0.3 0.5 3 10 50 100 1 5 30 18 V GV = 26dB RL = 4 Ω f = 1 kHz Filter

400 Hz to 30 kHz

13.2 V 100 0.001 0.003 0.005 0.01 0.03 0.05 0.1 0.3 0.5 0.3 0.5 3 10 50 100 1 5 30 18 V GV = 26dB RL = 4 Ω f = 1 kHz Filter 13.2 V 100 0.001 0.003 0.005 0.01 0.03 0.05 0.1 0.3 0.5 0.3 0.5 3 10 50 100 1 5 30 18 V GV = 26dB RL = 4 Ω f = 1 kHz Filter 13.2 V 100 0.001 0.003 0.005 0.01 0.03 0.05 0.1 0.3 0.5 0.3 0.5 3 10 50 100 1 5 30 18 V GV = 26dB RL = 4 Ω f = 1 kHz Filter

13.3. Output Power Characteristics to Input Voltage Figure 13.7 Frequency Characteristics of Ripple Rejection POUT (ch1) – VIN POUT (ch2) – VIN Input voltage V IN (Vrms) Input voltage V IN (Vrms) Output power P OUT (W) Output power P OUT (W) POUT (ch3) – VIN POUT (ch4) – VIN Input voltage V IN (Vrms) Input voltage V IN (Vrms) Output power P OUT (W) Output power P OUT (W) 0 1 0.5 1.5 VDD = 13.2 V RL = 4 Ω Filter nothing 100 Hz 10 kHz f = 20 kHz 1 kHz 0 0.5 1 1.5 VDD = 13.2 V RL = 4 Ω Filter nothing f = 20 kHz 100 Hz 10 kHz 1 kHz 0 0.5 1 1.5 VDD = 13.2 V RL = 4 Ω Filter nothing f = 20 kHz 100 Hz 10 kHz 1 kHz 0 0.5 1 1.5 VDD = 13.2 V RL = 4 Ω Filter nothing f = 20 kHz 100 Hz 10 kHz 1 kHz

  1. Package Dimensions Weight: 1.28g (typ.)
  1. Land pattern dimensions (Reference) NOTES ・All linear dimensions are given in millimeters unless otherwise specified. ・This drawing is based on JEITA ET-7501 Level3 and should be treated as a reference only.TOSHIBA Electronic Devices & Storage Corporation is not responsible for any incorrect or incomplete drawings and information. ・You are solely responsible for all aspects of your own land pattern, including but not limited to soldering processes. ・The drawing shown may not accurately represent the actual shape or dimensions. ・Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA Electronic Devices &Storage Corporation information and the instructions for the application that Product will be used with or for.

(1) Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. (2) Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. (3) Timing Charts Timing charts may be simplified for explanatory purposes. (4) Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Providing these application circuit examples does not grant a license for industrial property rights. (5) Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. (6) Characteristic Chart This data is provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improp erly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate setting s, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built -in protection funct ions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by expl osion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.

[5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. Points to remember on handling of ICs (1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (T j) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF When a motor reverses the rotation direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back -EMF. If the current sink capability of the power supply is small, the device’ s motor power supply and output pins might be exposed to conditions beyond absolute max imum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.

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