TCA62724FMG

TCA62724FMG_15 COMCHIP | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 15

Technical content

Features

• Power supply voltage range : 2.8 to 5.5 V
• Constant current range : 5 to 150 mA
• Low consumption current Supply current at operation (Iout = 20 mA / DC) : 700 μA (Max) Supply current at standby : 10 μA (Max)
• For anode common LED
• I 2C interface
• Package : SON10-P-0303-0.50 Weight: 0.018 g (typ.)

TCA62724FMG(O,S,EL 2010-06-24 2 Pin Assignment (top view) Terminal Description Pin No. Pin Name Function

1 SHDN

The shutdown signal input terminal. In the case of "L" level input, the IC becomes the power-saving mode. In the case of "H" level input, the IC becomes the operation mode. 2 SDA Serial data input / output terminal. 3 SCL Serial clock input terminal.

4 RESET

The data reset signal input terminal. In the case of "L" level input, data is reset. In the case of "H" level input, the IC becomes the operation mode. 5 GND Grand terminal.

6 REXT

The output current setting resistor connection terminal. Resistance is connected with this terminal between GND. The output current does not flow when this terminal is opened. Excessive output current will destroy the IC if this terminal is connected to GND.

7 OUT2

8 OUT1

9 OUT0

Constant current output terminal. 10 VIN Supply voltage input terminal. VIN OUT0 OUT1 OUT2 REXT VIN OUT0 OUT1 OUT2 REXT SDA SCL RESET GND Ass’ly in first half of year (The 26th week from the first week) Ass’ly in latter half of year (The 53rd week from the 27th week) SHDN SDA SCL RESET GND SHDN

TCA62724FMG(O,S,EL 2010-06-24 3 Block Diagram Example Applications : Cellular Phone Application as Camera Light (Primary-color red, green and blue LEDs combine to emit good-quality white light for color reproducibility.) SCL SDA REXT OUT2 OUT1 OUT0 PWM LOGIC I2C Interface LOGIC VIN Constant Current Circuit SHDN RESET GND SCL Bus Line 2.8 to 5.5 V SDA Bus Line SHDN SDA SCL RESET GND VIN OUT 0 OUT 1 OUT 2 REXT TCA62724FMG SDA SCL Microcontroller VOUT VIN 150 mA VIN REXT = 3.7 kΩ RED GREEN BLUE 150 mA 150 mA Camera light *I SDA will recommend 3 mA. ISDA

TCA62724FMG(O,S,EL 2010-06-24 4 I/O Equivalent Pin Circuits 1. SHDNTerminal 2. SDA Terminal 3. SCL Terminal 4. RESET Terminal 5. VIN,GND Terminal

10 VIN

5 GND

TCA62724FMG(O,S,EL 2010-06-24 5 I2C Interface *DATA transfer format S Slave address 7 bits R/W A Sub-address 8 bits A DATA byte 8 bits A P *START condition (S), STOP condition (P) START condition : A HIGH to LOW transition on the SDA line while SCL is HIGH. STOP condition : A LOW to HIGH transition on the SDA line while SCL is HIGH. *DATA validity Please do not change SDA, when SCL is "H". SDA can be changed, when SCL is "L". *Acknowledge (A) Whenever it receives the 1-byte data from a transmitter, a receiver has to generate acknowledge .The receiver is obliged to generate an Acknowledge after each byte has been received. S P START condition STOP condition SCL SDA SDA can't be changed. SDA change is possible. SCL SDA S 1 8 9 Clock for acknowledge Acknowledge SDA from Transmitter SDA from Receiver SCL from Master SDA can't be changed. SDA change is possible. SDA change is possible.

TCA62724FMG(O,S,EL 2010-06-24 6 *Slave address TCA62724FMG Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 0 1 0 1 0 1 R/W R/W: When this bit is set to “H”, READ mode applies; when it is set to “L”, WRITE mode applies. *Sub-address PWM0 (PWM Duty Data Setup of OUT0) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 AI 0 0 0 0 0 0 1 PWM1 (PWM Duty Data Setup of OUT1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 AI 0 0 0 0 0 1 0 PWM2 (PWM Duty Data Setup of OUT2) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 AI 0 0 0 0 0 1 1 ENABLE / SHDN (Data Setup of ENABLE / SHDN) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 AI 0 0 0 0 1 0 0 AI: When this bit is set to “H”, auto-increment is OFF; when it is set to “L”, auto-increment is ON. *DATA byte PWM0, PWM1, and PWM2 DATA PWM ON Duty DATA (0/15 to 15/15) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Don’t use PWM ON Duty DATA (default =”0000”) Bit 3 Bit 2 Bit 1 Bit 0 DATA PWM ON Duty 1 1 1 1 15/15 1 1 1 0 14/15 1 1 0 1 13/15 1 1 0 0 12/15 1 0 1 1 11/15 1 0 1 0 10/15 1 0 0 1 9/15 1 0 0 0 8/15 0 1 1 1 7/15 0 1 1 0 6/15 0 1 0 1 5/15 0 1 0 0 4/15 0 0 1 1 3/15 0 0 1 0 2/15 0 0 0 1 1/15 0 0 0 0 0/15 ENABLE / SHDN DATA Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Don’t use X X ENABLE SHDN (default = ”00000000”) ENABLE DATA H : Output blinks at PWM0, PWM1, and PWM2 rate L : Output is OFF SHDN data H : Output blinks at PWM0, PWM1, and PWM2 rate L : Power-saving mode

TCA62724FMG(O,S,EL 2010-06-24 7 *WRITE mode Auto-increment OFF Auto-increment ON S Slave Address R/W (0) A Sub- address A DATA A DATA A - - - P The data of the immediately following Sub-address can be written in. *READ mode S Slave Address R/W (1) A First Byte A Second Byte P First byte (ENABLE / SHDN DATA and PWM2 DATA) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 x x ENABLE SHDN PWM2 DATA Second byte (PWM1 DATA and PWM0 DATA) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 PWM1 DATA PWM0 DATA S Slave Address R/W (0) A Sub- address AD A T A A Sub- address A DATA - - - P

TCA62724FMG(O,S,EL 2010-06-24 8 Setting of Output Current (Reference Data) The output current is set by the resistance connected between terminal REXT and GND. The output current can be set according to the following expression. Output Voltage – Output Current (Reference Data) Note1: These application examples are prov ided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. VDS vs. IOUT 100 120 140 160 180 V DS (V) IOUT (mA) IOUT vs. R EX T 100 125 150 02 0 4 0 6 0 8 0 1 0 0 REX T(Ω) IOUT (mA) REXT = 3.6 kΩ REXT = 11 kΩ REXT = 110 kΩ IOUT (mA) = 1.17 (V) REXT (kΩ) × 460 Ta=25°C VDS=1.0 V

TCA62724FMG(O,S,EL 2010-06-24 9 Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Ratings *1 Unit Supply voltage VIN −0.3 ~ +6.0 V Output voltage VOUT −0.3 ~ +6.0 V Input voltage (SDA/SCL/ SHDN / RESET Terminal) Vin −0.3 ~ VIN+0.3 *2 V 0.36 (free air) Power dissipation PD 0.79(on PCB) *3,4 W 340 (free air) Thermal resistance Rth (j-a) 158 (on PCB) *3 °C/W Operating temperature Topr −40 ~ +85 °C Storage temperature Tstg −55 ~ +150 °C Maximum junction temperature T j 150 °C Note1: Voltage is ground referenced. Note2: Do not exceed 6.0V. Note3: PCB condition 40 mm x 40 mm x 1.6 mm, Cu = 10 % Note4: The power dissipation decreases the reciprocal of the saturated thermal resistance (1/ Rth(j-a)) for each degree (1°C) that the ambient temperature is exceeded (Ta = 25°C). Recommended Operating Condition Characteristic Symbol Condition Min Typ. Max Unit Supply voltage V IN - 2.8 3.6 5.5 V Constant current output I OUT OUT0 to OUT2 5 - 150 mA/ch REXT resistance R EXT - 3.7 - 109 kΩ Electrical Characteristics (unless otherwise specified, Ta = 25°C, VIN = 3.6V) Characteristic Symbol Condition Min Typ Max Unit Supply voltage VIN - 2.8 3.6 5.5 V Supply current (IC operation) I IN (On) R EXT = 27.6 kΩ, VIN = 3.6 V - - 700 μA Supply current (IC standby) I IN (Off) SHDN = L - - 10 μA High level V IH 0.7V IN - V IN+0.15V Input voltage Low level V IL Measuring terminal is SDA, SCL, SHDN , RESET −0.15 - 0.3V IN V High level I IH −1.0 - 1.0 Input current Low level IIL Measuring terminal is SCL, SHDN ,RESET −1.0 - 1.0 μA Gain (I OUT /I REXT ) GAIN R EXT=11kΩ 359 460 560 A/A REXT terminal voltage VREXT V IN=3.6V, REXT=11kΩ 1.09 1.17 1.25 V Output leakage current IOZ SHDN =“L”, VOUT=5.5V - - 0.1 μA Constant current accuracy between bits dI OUT V IN = 3.6 V, REXT = 11 kΩ - ±1 ±7.5 % PWM frequency fPWM - - 3.0 - kHz Time from SHDN release to start of operation tRE - - - 5 ms

TCA62724FMG(O,S,EL 2010-06-24 10 Characteristics of the SDA and SCL Bus Lines for I2C-bus Devices Standard Mode Characteristic Symbol Min Max Unit SCL clock frequency f SCL 0 100 kHz Bus free time between STOP and START condition tBUF 4.7 - μs Hold time (repeated) START condition t HD;STA 4.0 - μs Setup time for repeated START condition t SU;STA 4.7 - Setup time for STOP condition t SU;STO 4.0 - μs μs Data hold time t HD;DAT 0 - ns Data setup time t SU;DAT 250 - ns LOW period of the SCL clock t LOW 4.7 - μs HIGH period of the SCL clock t HIGH 4.0 - μs Rise time of both SDA and SCL signals t f - 1000 ns Fall time of both SDA and SCL signals t r - 300 ns tf tHD;STA tLOW tr tHD;DAT tSU;DAT tHIGH tSU;STA tHD;STA tSU;STO tBUF SDA SCL

TCA62724FMG(O,S,EL 2010-06-24 11 Package Dimensions Weight: 0.018 g (typ.)

TCA62724FMG(O,S,EL 2010-06-24 12 Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial prop erty rights by providing th ese examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtai n and confirm the device charac teristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device ar e a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdow n, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current re sulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs wi th built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device break down, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. [5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Ti ed Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.

TCA62724FMG(O,S,EL 2010-06-24 13 Points to remember on handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EM F. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.

TCA62724FMG(O,S,EL 2010-06-24 14 About solderability, following conditions were confirmed Solderability (1) Use of Sn-37Pb solder Bath solder bath temperature: 230 °C dipping time: 5 seconds the number of times: once use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath solder bath temperature: 245 °C dipping time: 5 seconds the number of times: once use of R-type flux

TCA62724FMG(O,S,EL 2010-06-24 15 RESTRICTIONS ON PRODUCT USE

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