TCA0372_05 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Output Current to 1.0 A
  • Slew Rate of 1.3 V//C0109s
  • Wide Bandwidth of 1.1 MHz
  • Internal Thermal Shutdown
  • Single or Split Supply Operation
  • Excellent Gain and Phase Margins
  • Common Mode Input Includes Ground
  • Zero Deadband Crossover Distortion
  • Pb−Free Packages are Available*

Figure 1. Representative Block Diagram section on page 6 of this data sheet. dimensions section on page 6 of this data sheet.

ORDERING INFORMATION

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

TCA0372, TCA0372B http://onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Supply Voltage (from VCC to VEE) VS 40 V Input Differential Voltage Range VIDR Note 1 V Input Voltage Range VIR Note 1 V Junction Temperature (Note 2) TJ +150 °C Operating Temperature Range TA −40 to +125 °C Storage Temperature Range Tstg −55 to +150 °C DC Output Current IO 1.0 A Peak Output Current (Nonrepetitive) I(max) 1.5 A Thermal Resistance, Junction−to−Air Case 626 Case 648 Case 751G R/C0113JA 137 °C/W Thermal Resistance, Junction−to−Case Case 626 Case 648 Case 751G R/C0113JC °C/W Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Either or both input voltages should not exceed the magnitude of V CC or VEE. 2. Power dissipation must be considered to ensure maximum junction temperature (T J) is not exceeded.

TCA0372, TCA0372B http://onsemi.com DC ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = −15 V, RL connected to ground, TA = −40° to +125°C.) Characteristics Symbol Min Typ Max Unit Input Offset Voltage (VCM = 0) TA = +25°C TA, Tlow to Thigh VIO 1.0 mV Average Temperature Coefficient of Offset Voltage /C0068VIO//C0068T − 20 − /C0109V/°C Input Bias Current (VCM = 0) IIB − 100 500 nA Input Offset Current (VCM = 0) IIO − 10 50 nA Large Signal Voltage Gain VO = ±10 V, RL = 2.0 k AVOL 30 100 − V/mV Output Voltage Swing (IL = 100 mA) TA = +25°C TA = Tlow to Thigh TA = +25°C TA = Tlow to Thigh VOH VOL 14.0 13.9 14.2 −14.2 −14.0 −13.9 V Output Voltage Swing (IL = 1.0 A) VCC = +24 V, VEE = 0 V, TA = +25°C VCC = +24 V, VEE = 0 V, TA = Tlow to Thigh VCC = +24 V, VEE = 0 V, TA = +25°C VCC = +24 V, VEE = 0 V, TA = Tlow to Thigh VOH VOL 22.5 22.5 22.7 1.3 1.5 1.5 V Input Common Mode Voltage Range TA = +25°C TA = Tlow to Thigh VICR VEE to (VCC −1.0) VEE to (VCC −1.3) V Common Mode Rejection Ratio (RS = 10 k) CMRR 70 90 − dB Power Supply Rejection Ratio (RS = 100 /C0087) PSRR 70 90 − dB Power Supply Current TA = +25°C TCA0372 TCA0372B TA = Tlow to Thigh TCA0372 TCA0372B ID 5.0 8.0 mA AC ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = −15 V, RL connected to ground, TA = +25°C, unless otherwise noted.) Characteristics Symbol Min Typ Max Unit Slew Rate (Vin = −10 V to +10 V, RL = 2.0 k, CL = 100 pF) AV = −1.0, TA = Tlow to Thigh SR 1.0 1.4 − V//C0109s Gain Bandwidth Product (f = 100 kHz, CL = 100 pF, RL = 2.0 k) TA = 25°C TA = Tlow to Thigh GBW 0.9 0.7 1.4 MHz Phase Margin TJ = Tlow to Thigh RL = 2.0 k, CL = 100 pF /C0102m − 65 − Degrees Gain Margin RL = 2.0 k, CL = 100 pF Am − 15 − dB Equivalent Input Noise Voltage RS = 100 /C0087, f = 1.0 to 100 kHz en − 22 − nV/ Hz√ Total Harmonic Distortion AV = −1.0, RL = 50 /C0087, VO = 0.5 VRMS, f = 1.0 kHz THD − 0.02 − % NOTE: In case VEE is disconnected before VCC, a diode between VEE and Ground is recommended to avoid damaging the device.

Figure 8. Sine Wave Response

5.0 V/DIV200 mV/DIV

Figure 9. Bidirectional DC Motor Control with Figure 10. Bidirectional Speed Control of DC Motors For circuit stability, ensure that Rx >/Em/Em/Em/Em/Emwhere, RM = internal resistance of motor. where, |Ro| =/Em/Em/Em/Em/Emand IM is the motor current.

TCA0372, TCA0372B http://onsemi.com Device Package Shipping† TCA0372DW SOIC−16W 47 Units / Rail TCA0372DWG SOIC−16W (Pb−Free) 47 Units / Rail TCA0372DWR2 SOIC−16W 1000 Tape & Reel TCA0372DWR2G SOIC−16W (Pb−Free) 1000 Tape & Reel TCA0372BDWR2 SOIC−16W 1000 Tape & Reel TCA0372BDWR2G SOIC−16W (Pb−Free) 1000 Tape & Reel TCA0372DP1 PDIP−8 50 Units / Rail TCA0372DP1G PDIP−8 (Pb−Free) 50 Units / Rail TCA0372BDP1 PDIP−8 50 Units / Rail TCA0372BDP1G PDIP−8 (Pb−Free) 50 Units / Rail TCA0372DP2 PDIP−16 25 Units / Rail TCA0372DP2G PDIP−16 (Pb−Free) 25 Units / Rail TCA0372DM2EL SOEIAJ−16 2500 Tape & Reel TCA0372DM2ELG SOEIAJ−16 (Pb−Free) 2500 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. PDIP−8 DP1 SUFFIX CASE 626 MARKING DIAGRAMS A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week 0372DP1 AWL YYWW 0372BDP1 AWL YYWW PDIP−16 DP2 SUFFIX CASE 648 TCA0372DP2 AWLYYWW SOIC−16W DW SUFFIX CASE 751G TCA0372DW AWLYYWW SOEIAJ−16 DM2 SUFFIX CASE 966 TCA0372 ALYW TCA0372BDW AWLYYWW

TCA0372, TCA0372B http://onsemi.com PIN CONNECTIONS (Top View) CASE 648 Output A VCC Output B VEE/GND Inputs B Inputs A GND GND GND GND GND GND GND GND /figure9 *Pins 4 and 9 to 16 are internally connected. CASE 751G VCC Output B NC VEE/GND NC Output A NC NC VEE/GND NC /figure9 (Top View) (Top View) Output A VEE/GND CASE 626 /figure5 VCC Output B Inputs A Inputs B Inputs B Inputs A +− + − CASE 966 VEE/GND NC Output A NC VEE/GND NC Inputs A /figure9 (Top View) VCC Output B NC VEE/GND Inputs B NC VEE/GND

TCA0372, TCA0372B http://onsemi.com PACKAGE DIMENSIONS PDIP−8 DP1 SUFFIX CASE 626−05 ISSUE L NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. F NOTE 2 −A− −B− −T− SEATING PLANE H J G D K N C L M MAM0.13 (0.005) B MT DIM MIN MAX MIN MAX INCHESMILLIMETERS A 9.40 10.16 0.370 0.400 B 6.10 6.60 0.240 0.260 C 3.94 4.45 0.155 0.175 D 0.38 0.51 0.015 0.020 F 1.02 1.78 0.040 0.070 G 2.54 BSC 0.100 BSC H 0.76 1.27 0.030 0.050 J 0.20 0.30 0.008 0.012 K 2.92 3.43 0.115 0.135 L 7.62 BSC 0.300 BSC N 0.76 1.01 0.030 0.040 /C0095/C0095 PDIP−16 DP2 SUFFIX CASE 648−08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. −A− B F C S H G D J L M 16 PL SEATING 916 K PLANE−T− MAM0.25 (0.010) T DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01 /C0095/C0095/C0095/C0095

TCA0372, TCA0372B http://onsemi.com PACKAGE DIMENSIONS SOIC−16W DW SUFFIX CASE 751G−03 ISSUE B D 14X B16X SEATING PLANE SAM0.25 B ST 16 9 h X 45/C0095 MBM0.25 H8X E B A e T A L C /C0113 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM MIN MAX MILLIMETERS A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 /C0113 0 7 /C0095/C0095 SOEIAJ−16 DM2 SUFFIX CASE 966−01 ISSUE O HE DIM MIN MAX MIN MAX INCHES MILLIMETERS 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.18 0.27 0.007 0.011 9.90 10.50 0.390 0.413 5.10 5.45 0.201 0.215 1.27 BSC 0.050 BSC 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0.70 0.90 0.028 0.035 A HE LE /C009510 /C00950 /C009510 /C0095 LE /C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M L DETAIL P VIEW P c A b e 16 9 D Z E A b c D E e L M Z

TCA0372, TCA0372B http://onsemi.com ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 TCA0372/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.