TC911A_05 MICROCHIP | Alldatasheet

Document overview

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Technical content

Features

  • First Monolithic Chopper-Stabilized Amplifier with On-Chip Nulling Capacitors
  • Low Offset Voltage: 5μV
  • Low Offset Voltage Drift: 0.05µV/°C
  • Low Supply Current: 350μA
  • High Common-Mode Rejection: 116dB
  • Single Supply Operation: 4.5V to 16V
  • High Slew Rate: 2.5V/μsec
  • Wide Bandwidth: 1.5MHz
  • High Open-Loop Voltage Gain: 120dB
  • Low Input Noise Voltage: 0.65μVP-P (0.1Hz to 1Hz)
  • Pin Compatible With ICL7650
  • Lower System Parts Count

Applications

  • Instrumentation
  • Portable/Battery Powered
  • Embedded Control
  • Temperature Sensor Amplifier
  • Strain Gage Amplifier Package Type Device Selection Table Part Number Package Temperature Range Offset Voltage TC911ACOA 8-Pin SOIC 0°C to +70°C 15μV TC911ACPA 8-Pin PDIP 0°C to +70°C 15μV TC911BCOA 8-Pin SOIC 0°C to +70°C 30μV TC911BCPA 8-Pin PDIP 0°C to +70°C 30μV Output NC + Input TC911ACPA TC911BCPA - Input NC NC VSS VSS VDD VDD NC = No Internal Connection Output NC + Input TC911ACOA TC911BCOA - Input NC NC 8-Pin SOIC 8-Pin PDIP Monolithic Auto-Zeroed Operational Amplifiers Obsolete Device

© 2005 Microchip Technology Inc. General Description The TC911 CMOS auto-zeroed operational amplifier is the first complete monolithic chopper stabilized ampli- fier. Chopper operational amplifiers like the ICL7650/ 7652 and LTC1052 require user supplied, external off- set compensation storage capacitors. External capac- itors are not required with the TC911. Just as easy to use as the conventional OP07 type amplifier, the TC911 significantly reduces offset voltage errors. Pinout matches the OP07/741/7650 8-pin mini-DIP configuration. Several system benefits arise by eliminating the exter- nal chopper capacitors: lower system parts count, reduced assembly time and cost, greater system reli- ability, reduced PC board layout effort and greater board area utilization. Space savings can be significant in multiple amplifier designs. Electrical specifications include 15μV maximum offset voltage and 0.15μV/°C maximum offset voltage tem- perature co-efficient. Offset voltage error is five times lower than the premium OP07E bipolar device. The TC911 improves offset drift performance by eight times. The TC911 operates from dual or single power sup- plies. Supply current is typically 350μA. Single 4.5V to 16V supply operation is possible, making single 9V bat- tery operation possible. The TC911 is available in 2 package types: 8-pin plastic DIP and SOIC. Functional Block Diagram VDD VSS TC911A TC911B -Input +Input A B A B Main Amplifier Low Impedance Output Buffer Internal Oscillator (FOSC 200HZ) VOS Correction Amplifier Output Note: Internal capacitors. No external capacitors required.

© 2005 Microchip Technology Inc. DS21481C-page 3 TC911A/TC911B 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* + 0.3V) to (VSS – 0.3V) Package Power Dissipation (TA - 70°C) Operating Temperature Range *Stresses above those listed under "Absolute Maxi- mum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC911A AND TC911B ELECTRICAL SPECIFICATIONS Electrical Characteristics: VS = ±5V, TA = +25°C, unless otherwise indicated. TC911A TC911B Symbol Parameter Min Typ Max Min Typ Max Unit Test Conditions VOS Input Offset Voltage μV TA = +25°C TCVOS Average Temp. Coefficient of Input Offset Voltage 0.05 0.05 0.15 0.15 0.1 0.1 0.25 0.25 μV/°C μV/°C 0°C ≤ TA ≤ +70°C -25°C ≤ TA ≤ +85°C (Note 1) IB Average Input Bias Current 120 pA nA nA TA = +25°C 0°C ≤ TA ≤ +70°C -25°C ≤ TA ≤ +85° IOS Average Input Offset Current pA nA TA = +25°C TA = +85°C eN Input Voltage Noise 0.65 0.65 μVP-P μVP-P 0.1 to 1Hz, RS ≤ 100Ω 0.1 to 10Hz, RS ≤ 100Ω CMRR Common Mode Rejection Ratio 110 116 105 110 dB VSS ≤ VCM ≤ VDD - 2.2 CMVR Common Mode Voltage Range VSS VDD – 2 VSS VDD – 2 V AOL Open-Loop Voltage Gain 115 120 110 120 dB RL = 10kΩ, VOUT = ±4V VOUT Output Voltage Swing VSS + 0.3 VDD – 0.9 VSS + 0.3 VDD – 0.9 V RL = 10kΩ BW Closed Loop Bandwidth 1.5 1.5 MHz Closed Loop Gain = +1 SR Slew Rate 2.5 2.5 V/μsec RL = 10kΩ, CL = 50pF PSRR Power Supply Rejection Ratio 112 105 dB ±3.3V to ±5.5V VS Operating Supply Voltage Range ±3.3 6.5 ±3.3 6.5 V V Split Supply Single Supply IS Quiescent Supply Current 350 600 800 μA VS = ±5V Note 1: Characterized; not 100% tested.

© 2005 Microchip Technology Inc. 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in <Blue References>Table 2-1. TABLE 2-1: PIN FUNCTION TABLE 3.0 DETAILED DESCRIPTION 3.1 Pin Compatibility The CMOS TC911 is pin compatible with the industry standard ICL7650 chopper stabilized amplifier. The ICL7650 must use external 0.1μF capacitors con- nected at pins 1 and 8. With the TC911, external off- set voltage error canceling capacitors are not required. On the TC911 pins 1, 8 and 5 are not con- nected internally. The ICL7650 uses pin 5 as an optional output clamp connection. External chopper capacitors and clamp connections are not necessary with the TC911. External circuits connected to pins 1, 8 and 5 will have no effect. The TC911 can be quickly evaluated in existing ICL7650 designs. Since external capacitors are not required, system part count, assem- bly time and total system cost are reduced. Reliability is increased and PC board layout eased by having the error storage capacitors integrated on the TC911 chip. The TC911 pinout matches many existing op amps: 741, LM101, LM108, OP05–OP08, OP-20, OP-21, ICL7650 and ICL7652. In many applications operating from +5V supplies, the TC911 offers superior electrical performance and can be a functional pin compatible replacement. Offset voltage correction potentiometers, compensation capacitors, and chopper stabilization capacitors can be removed when retro-fitting existing equipment designs. 3.2 Thermocouple Errors Heating one joint of a loop made from two different metallic wires causes current flow. This is known as the Seebeck effect. By breaking the loop, an open circuit voltage (Seebeck voltage) can be measured. Junction temperature and metal type determine the magnitude. Typical values are 0.1μV/°C to 10μV/°C. Thermal induced voltages can be many times larger than the TC911 offset voltage drift. Unless unwanted thermo- couple potentials can be controlled, system perfor- mance will be less than optimum. Unwanted thermocouple junctions are created when leads are soldered or sockets/connectors are used. Low thermo-electric coefficient solder can reduce errors. A 60% Sn/36% Pb solder has 1/10 the thermal voltage of common 64% Sn/36% Pb solder at a copper junction. The number and type of dissimilar metallic junctions in the input circuit loop should be balanced. If the junc- tions are kept at the same temperature, their summa- tion will add to zero-canceling errors (Figure 3-1). Shielding precision analog circuits from air currents - especially those caused by power dissipating compo- nents and fans - will minimize temperature gradients and thermocouple induced errors. FIGURE 3-1: UNWANTED THERMOCOUPLE ERRORS ELIMINATED BY REDUCING THERMAL GRADIENTS AND BALANCING JUNCTIONS Pin Number Symbol

Description

1, 5, 8 NC No Internal Connection. -INPUT Inverting Input +INPUT Non-inverting Input VSS Negative Power Supply OUTPUT Output VDD Positive Power Supply Package Pin J3 = J4 J2 = J5 J1 = J6 No Temperature Differential and same Metallic Connection VT = 0 VT = V1 + V2 + V3 – V4 – V5 – V6 = 0

© 2005 Microchip Technology Inc. DS21481C-page 5 TC911A/TC911B 3.3 Avoiding Latchup Junction isolated CMOS circuits inherently contain a parasitic p-n-p-n transistor circuit. Voltages exceeding the supplies by 0.3V should not be applied to the device pins. Larger voltages can turn the p-n-p-n device on, causing excessive device power supply cur- rent and excessive power dissipation. TC911 power supplies should be established at the same time or before input signals are applied. If this is not possible, input current should be limited to 0.1mA to avoid trig- gering the p-n-p-n structure. 3.4 Overload Recovery The TC911 recovers quickly from the output saturation. Typical recovery time from positive output saturation is 20msec. Negative output saturation recovery time is typically 5msec.

© 2005 Microchip Technology Inc. DS21481C-page 7 TC911A/TC911B 5.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 450 Supply Current (µA) -100 Ambient Temperature (˚C) 400 350 300 250 200 -50 100 150 Supply Current vs. Temperature VS = ±5V Input Offset Voltage (µV) Input Common Mode Voltage (V) Input Offset Voltage vs. Common-Mode Voltage VS = ±5V TA = +25˚C 700 600 500 400 300 200 100 Supply Current (µA) ± Supply Voltage (V) TA = +25˚C Supply Current vs. ± Supply Voltage Horizontal Scale = 2µs/DIV Large Signal Output Switching Waveform RL = 10k TA = +25˚C Input Vertical Scale = 2 V/DIV Output Vertical Scale = 1 V/DIV Closed Loop Gain (dB) 10k Frequency (Hz) Gain and Phase vs. Frequency -10 -20 -30 -40 100k 10M PHASE GAIN VS = ±5V TA = +25˚C RL = 10kΩ 225 PHASE (deg) 180 135 -45 -90 -135 -180 ± Output Voltage (V) 100 Load Resistance (Ω) Output Voltage Swing vs. Load Resistance 5.0 VS = ±5V TA = +25˚C –Swing +Swing 4.2 3.4 2.6 1.8 1.0 10k 100k 5.8

© 2005 Microchip Technology Inc. 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Package marking data not available at this time. 6.2 Taping Form Component Taping Orientation for 8-Pin SOIC (Narrow) Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size Standard Reel Component Orientation for TR Suffix Device PIN 1 User Direction of Feed P W

© 2005 Microchip Technology Inc. DS21481C-page 9 TC911A/TC911B 6.3 Package Dimensions .050 (1.27) TYP. 8° MAX. PIN 1 .244 (6.20) .228 (5.79) .157 (3.99) .150 (3.81) .197 (5.00) .189 (4.80) .020 (0.51) .013 (0.33) .010 (0.25) .004 (0.10) .069 (1.75) .053 (1.35) .010 (0.25) .007 (0.18) .050 (1.27) .016 (0.40) 8-Pin SOIC Dimensions: inches (mm) Dimensions: inches (mm) 3° MIN. PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm)

© 2005 Microchip Technology Inc. NOTES:

© 2005 Microchip Technology Inc. DS21481C-page 11 TC911A/911B SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

© 2005 Microchip Technology Inc. NOTES:

© 2005 Microchip Technology Inc. DS21481C-page 13 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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