TC77 MICROCHIP | Alldatasheet

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Technical content

Features

  • Digital Temperature Sensing in 5-Pin SOT-23A and 8-Pin SOIC Packages
  • Outputs Temperature as a 13-Bit Digital Word
  • SPI and MICROWIRE™ Compatible Interface
  • Solid State Temperature Sensing
  • ±1°C (max.) accuracy from +25°C to +65°C
  • ±2°C (max.) accuracy from -40°C to +85°C
  • ±3°C (max.) accuracy from -55°C to +125°C
  • 2.7V to 5.5V Operating Range
  • L o w P o w e r - 250 µA (typ.) Continuous Conversion Mode - 0.1 µA (typ.) Shutdown Mode Typical Applications
  • Thermal Protection for Hard Disk Drives and Other PC Peripherals
  • PC Card Devices for Notebook Computers
  • Low Cost Thermostat Controls
  • Industrial Control
  • Office Equipment
  • Cellular Phones
  • Thermistor Replacement Block Diagram

Description

The TC77 is a serially accessible digital temperature sensor particularly suited for low cost and small form- factor applications. Temperature data is converted from the internal thermal sensing element and made avail- able at anytime as a 13-bit two’s compliment digital word. Communication with the TC77 is accomplished via a SPI and MICROWIRE compatible interface. It has a 12-bit plus sign temperature resolution of 0.0625°C per Least Significant Bit (LSb). The TC77 offers a tem- perature accuracy of ±1.0°C (max.) over the tempera- ture range of +25°C to +65°C. When operating, the TC77 consumes only 250 µA (typ.). The TC77’s Con- figuration register can be used to activate the low power Shutdown mode, which has a current consump- tion of only 0.1 µA (typ.). Small size, low cost and ease of use make the TC77 an ideal choice for implementing thermal management in a variety of systems. Package Types Typical Application TC77 Diode Temperature Sensor VDD SCK CSSerial Port Interface SI/O 13-Bit Sigma Delta A/D Converter Register Temperature Register Internal Configuration Manufacturer ID Register VSS SOT-23-5 SOIC

1 VDD

0.1µF VDD VSS VDD PICmicro® MCU Thermal Sensor with SPI™ Interface

DS20092A-page 2  2002 Microchip Technology Inc.

1.0 ELECTRICAL

1.1 Absolute Maximum Ratings †

ESD protection on all pins: † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. PIN FUNCTION TABLE Name Function SI/O Serial Data Pin SCK Serial Clock VSS Ground CS Chip Select (Active-Low) NC No Connection V DD Power Supply DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply at V DD = 2.7V to 5.5V and TA = -55°C to +125°C. Parameters Sym Min Typ Max Units Conditions Power Supply Operating Voltage Range V DD 2.7 — 5.5 V Note 1 Operating Current I DD — 250 400 µA Continuous Temperature Conversion Mode Power-On Reset Threshold V POR 1.2 1.6 2.2 V V DD falling or rising edge Standby Supply Current I DD- STANDBY — 0.1 1.0 µA Shutdown Mode Temperature to Bits Converter Resolution — 13 — Bits ADC LSb = 0.0625°C/bit (Note 4) T emperature Conversion Time t CT — 300 400 ms T emperature Accuracy (Note 1) TERR -1.0 -2.0 -3.0 +1.0 +2.0 +3.0 °C +25°C < T A < +65°C -40°C < TA < +85°C TC77-3.3MXX: VDD = 3.3V TC77-5.0MXX: VDD = 5.0V perature accuracy of the TC77-3.3MXX and TC77-5.0MXX is specified at the nominal operating voltages of 3.3V and 5.0V, respectively. As VDD varies from the nominal operating value, the accuracy may be degraded (Refer to Figures 2-6 and 2-7). 2: All time measurements are measured with respect to the 50% point of the signal. 3: Load Capacitance, CL = 80 pF, is used for AC timing measurements of output signals. 4: Resolution = Temperature Range/No. of Bits = (+255°C – -256°C) / (2 13) Resolution = 512/8192 = 0.0625°C/Bit

 2002 Microchip Technology Inc. DS20092A-page 3 TC77 Digital Input/Output High Level Input Voltage V IH 0.7 VDD —V DD + 0.3 V Low Level Input Voltage V IL -0.3 — 0.3 V DD V High Level Output Voltage V OH 2.4 — — V I OH = -400 µA Low Level Output Voltage V OL —— 0 . 4 V I OL = +2 mA Input Current I IN(0), IIN(1) -1.0 -1.0 +1.0 +1.0 µA V IN = GND VIN = VDD Input Hysteresis 0.35 0.8 — V SI/O, SCK Pin Capacitance C IN, COUT —2 0 — p F Tri-state Output Leakage Current IO_LEAK -1.0 +1.0 µA V O = GND VO = VDD Serial Port AC Timing (Notes 2, 3) Clock Frequency f CLK DC — 7.0 MHz CS Fall to First Rising SCK Edge tCS-SCK 100 — — ns CS Low to Data Out Delay t CS-SI/O —— 7 0 n s SCK Fall to Data Out Delay t DO —— 1 0 0n s CS High to Data Out Tri-state tDIS —— 2 0 0n s SCK High to Data In Hold Time t HD 50 — — ns Data In Set-up Time t SU 30 — — ns Thermal Package Resistance Thermal Resistance, SOT23-5 θ JA — 230 — °C/W Thermal Resistance, 8L-SOIC θJA — 163 — °C/W DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, all parameters apply at V DD = 2.7V to 5.5V and TA = -55°C to +125°C. Parameters Sym Min Typ Max Units Conditions perature accuracy of the TC77-3.3MXX and TC77-5.0MXX is specified at the nominal operating voltages of 3.3V and 5.0V, respectively. As V DD varies from the nominal operating value, the accuracy may be degraded (Refer to Figures 2-6 and 2-7). 2: All time measurements are measured with respect to the 50% point of the signal. 3: Load Capacitance, CL = 80 pF, is used for AC timing measurements of output signals. 4: Resolution = Temperature Range/No. of Bits = (+255°C – -256°C) / (2 13) Resolution = 512/8192 = 0.0625°C/Bit

DS20092A-page 4  2002 Microchip Technology Inc. FIGURE 1-1: Timing Diagrams. CS SCK 1/fCLK SI/O tDO LSb tDIS HI-Z Data Output Timing MSb tCS-SI/O tHD tSU SI/O SCK CS HI-Z SI/O SCK CS HI-Z tHD tSU HI-Z tCS-SCK SI/O Data Input Set-up and Hold Timing (Data is clocked on the rising edge of SCK)

 2002 Microchip Technology Inc. DS20092A-page 5 TC77

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, all parameters apply at VDD = 3.3V for the TC77-3.3MXX and VDD = 5.0V for the TC77- to 5.5V. However, the temperature accuracy of the TC77-3.3MXX and TC77-5.0MXX is specified at the nominal oper- ating voltages of 3.3V and 5.0V, respectively. FIGURE 2-1: Accuracy vs. Temperature (TC77-XXMXX). FIGURE 2-2: Supply Current vs. Supply Voltage (TC77-XXMXX). FIGURE 2-3: Supply Current vs. Temperature. FIGURE 2-4: Shutdown Current vs. Temperature. FIGURE 2-5: Power-On Reset Voltage vs. Temperature (TC77-XXMXX). FIGURE 2-6: Temperature Accuracy vs. Supply Voltage (TC77-3.3MXX). Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -3.5 -2.5 -1.5 -0.5 0.5 1.5 2.5 3.5 -55 -35 -15 5 25 45 65 85 105 125 Reference Temperature (°C) Temperature Error (°C) Upper Specification Limit Lower Specification Limit Mean + 3V Mean - 3V Mean 200 210 220 230 240 250 Supply Voltage (V) Supply Current (µA) TA = +25°C TA = +125°C TA = -55°C 100 150 200 250 300 350 400 - 5 5 - 2 55 3 56 59 5 1 2 5 Temperature (°C) Supply Current (µA) TC77-5.0MXX VDD = 5.0 V TC77-3.3MXX VDD = 3.3 V 0.0 0.1 0.2 0.3 - 5 5 - 2 55 3 56 59 5 1 2 5 Temperature (°C) Shutdown Current (µA) TC77-5.0MXX VDD = 5.0 VTC77-3.3MXX V DD = 3.3 V 0.0 0.5 1.0 1.5 2.0 2.5 -55 -25 5 35 65 95 125 Temperature (°C) Power-On Reset Voltage (V) -0.4 -0.3 -0.2 -0.1 0.1 0.2 0.3 0.4 Supply Voltage (V) Temperature Change (°C) TC77-3.3MXX TA = -25°C TA = +25°CTA = +85°C

 2002 Microchip Technology Inc. DS20092A-page 7 TC77 FIGURE 2-13: Histogram of Temperature Accuracy at +125 Degrees C (TC77-XXMXX). Temperature Error (°C) Percentage of Occurances (%) Sample Size = 108 TA = +125°C

DS20092A-page 8  2002 Microchip Technology Inc.

3.0 FUNCTIONAL DESCRIPTION

The TC77 consists of a band-gap type temperature sensor, a 12-bit plus sign (13-bit) Sigma-Delta Analog- to-Digital Converter (ADC), an internal conversion oscillator (~30 kHz) and a serial input/output port. These devices feature a three-wire serial interface that is fully compatible with SPI and MICROWIRE specifica- tions and, therefore, allows simple communications with common microcontrollers and processors. The Shutdown mode can be used to reduce supply current for power sensitive applications. A Manufacturer’s ID register identifies the TC77 as a Microchip Technology product. FIGURE 3-1: Temperature To Digital Transfer Function (Non-linear Scale). TempTemp Output Code +125°C-55°C +25°C -25°C +0.0625°C -0.0625°C 0+0111 1101 0000 0+0001 1001 0000 0+0000 0000 0001 0+0000 0000 0000 1+1111 1111 1111 1+1110 0111 0000 1+1100 1001 0000 0°C

 2002 Microchip Technology Inc. DS20092A-page 9 TC77

3.1 Temperature Data Format

A 13-bit two’s complement digital word is used to rep- resent the temperature. The Least Significant Bit (LSb) is equal to 0.0625°C. Note that the last two LSb bits (Bit 0 and 1) are tri-stated and are represented as a logic ‘1’ in the table. Bit 2 is set to logic ‘1’ after the completion of the first temperature conversion following a power- up or voltage reset event. TABLE 3-1: TC77 OUTPUT An over-temperature condition can be determined by reading only the first few Most Significant Bits (MSb) of the temperature data. For example, the microproces- sor could read only the first four bits of the Temperature register in order to determine that an over-temperature condition exists.

3.2 Power-Up And Power-Down

The TC77 is in the Continuous Temperature Conver- sion mode at power-up. The first valid temperature con- version will be available approximately 300 ms (refer to “T emperature to Bits Converter” section listed in the DC characteristics table) after power-up. Bit 2 of the Tem- perature register is set to a logic ‘1’ after the completion of the first temperature conversion following a power- up or voltage reset event. Bit 2 is set to logic ‘0’ during the time needed to complete the first temperature con- version. Thus, the status of bit 2 can be monitored to indicate the completion of the first temperature conver- sion. A supply voltage lower than 1.6V (typ.) is considered a power-down state for the TC77. The device will reset itself and continue its normal Continuous Conversion mode of operation when the supply voltage rises above the nominal 1.6V. A minimal supply voltage of 2.7V is required in order to ensure proper operation of the device.

3.3 Serial Bus Interface

The serial interface consists of the Chip Select (CS ), Serial Clock (SCK) and Serial Data (SI/O) signals. The TC77 meets the SPI and MICROWIRE bus specifica- tions, with the serial interface designed to be compati- ble with the Microchip PICmicro ® family of microcontrollers. The CS input is used to select the TC77 when multiple devices are connected to the serial clock and data lines. The CS line is also used to synchronize the data, which is written to, or read from, the device when CS is equal to a logic ‘0’ voltage. The SCK input is disabled when CS is a logic ‘1’. The falling edge of the CS line initiates communication, while the rising edge of CS completes the communication. The SCK input is provided by the external microcontrol- ler and is used to synchronize the data on the SI/O line. The T emperature and Manufacturer ID registers are read only while the Configuration register is a read/ write register. Figure 3-2 provides a timing diagram of a read opera- tion of the T emperature register. Communication with the TC77 is initiated when the CS goes to a logic ‘ 0’. The Serial I/O signal (SI/O) then transmits the first bit of data. The microcontroller serial I/O bus master clocks the data in on the rising edge of SCK. The falling edge of SCK is then used to clock out the rest of the data. After 14 bits of data (thirteen temperature bits and Bit 2) have been transmitted, the SI/O line is then tri-stated. Note that CS can be taken to a logic ‘1’ at any time dur- ing the data transmission if only a portion of the temper- ature data information is required. The TC77 will complete the conversion, and the output shift register will be updated, if CS goes to the inactive state while in the middle of a conversion. Figure 3-3 provides a timing diagram of a multi-byte communication operation consisting of a read of the Temperature Data register, followed by a write to the Configuration register. The first 16 SCK pulses are used to transmit the TC77's temperature data to the microcontroller. The second group of 16 SCK pulses are used to receive the microcontroller command to place the TC77 either in Shutdown or Continuous Tem- perature Conversion mode. Note that the TC77 is in the Continuous Temperature Conversion mode at power- up. The data written to the TC77’s Configuration register should be either all 0’s or all 1’s, corresponding to either the Continuous T emperature Conversion or Shutdown mode, respectively. The TC77 is in Shut- down mode when Bits C0 to C7 are all equal to 1’s. The TC77 will be in the Continuous Conversion mode if a ‘0’ in any bit location from C0 to C7 is written to the Configuration register. Temperature Binary MSB / LSB Hex +125°C 0011 1110 1000 01113E 87h +25°C 0000 1100 1000 01110B 87h +0.0625°C 0000 0000 0000 111100 0Fh 0°C 0000 0000 0000 011100 07h -0.0625°C 1111 1111 1111 1111FF FFh -25°C 1111 0011 1000 0111F3 87h -55°C 1110 0100 1000 0111E4 87h

 2002 Microchip Technology Inc. DS20092A-page 11 TC77

4.0 INTERNAL REGISTER

The TC77 Internal register structure consists of three registers. The Temperature and Manufacturer’s Identi- fication registers are read only, while the Configuration register is write only. TABLE 4-1: REGISTERS FOR TC77

4.1 Configuration Register (CONFIG)

The Configuration register is write only. This register selects either Shutdown, Continuous Conversion or Test modes:

  • C15:C0 = XXXX/XXXX 1111/1111 (Shutdown mode)
  • C15:C0 = XXXX/XXXX 0000/0000 (Continuous Conversion mode)
  • The TC77 is in Shutdown mode when bits C0 to C7 are all equal to ‘1’s. The TC77 will be in the Continuous Conversion mode if a ‘0’ in any bit location from C0 to C7 is written to the Configura- tion register. The TC77 is in the Continuous Conversion mode at power-up. It is recommended that the user write all ‘0’s or all ‘1’s to the Configuration register because other bit codes may put the TC77 in a test mode used for calibration and production verification tests. Section 3.3 lists the Configuration register bit codes that can be written to the TC77 without having the device enter a production test mode. During Shutdown mode, the serial bus is still active. The current consumption of the TC77 will be less than 1 µA during the time between serial communication.

4.2 Temperature Register (TEMP)

The T emperature register is read only and holds the temperature conversion data. Bits 0 and 1 are unde- fined and will be tri-state outputs during a read sequence. Bit 2 is set to a logic ‘ 1’ after completion of the first temperature conversion following a power-up or reset event. Bit 2 is set to a logic ‘0’ during the time needed to complete the first temperature conversion. Therefore, the status of bit 2 can be monitored to indi- cate that the TC77 has completed the first temperature conversion. Bits 15:3 contain the 13 bit two’s comple- ment data from the temperature conversion.

4.3 Manufacturer’s ID Register (M_ID)

The Manufacturer’s Identification code is contained in this read only register. The Manufacturer ID register is only available for a read operation when the TC77 is in Shutdown mode. The Manufacturer’s ID code is con- tained in bits 15:8 and is equal to 54 hex to indicate a Microchip device. Bits 1:0 are undefined and will be tri- state outputs during a read sequence, while bits 7:2 are set to ‘0’. Name Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit

0 Value at Powerup/Reset

CONFIG C15 C14 C13 C12 C11 C10 C9 C8 C7 C6 C5 C4 C3 C2 C1 C0 XXXX/XXXX 0000/0000 T E M P T 1 2 T 1 1 T 1 0T 9 T 8 T 7T 6T 5T 4T 3T 2T 1T 0 * x x 1111/1111 0000/0*XX M _ I D 0 1 0 1 0 100000000xx 0101/0100 0000/00XX * Bit 2 = 0 during power-up; otherwise, bit 2 =1

DS20092A-page 12  2002 Microchip Technology Inc.

5.0 APPLICATION INFORMATION

The TC77 does not require any additional components in order to measure temperature. However, it is recom- mended that a decoupling capacitor of 0.1 µF to 1 µF be provided between the V DD and VSS (Ground) pins (a high frequency ceramic capacitor should be used). It is necessary for the capacitor to be located as close as possible to the integrated circuit (IC) power pins in order to provide effective noise protection to the TC77. The TC77 measures temperature by monitoring the voltage of a diode located on the IC die. A low-imped- ance thermal path between the die and the printed cir- cuit board (PCB) is provided by the IC pins of the TC77. Therefore, the TC77 effectively monitors the tempera- ture of the PCB board. The thermal path between the ambient air is not as efficient because the plastic IC housing package functions as a thermal insulator. Thus, the ambient air temperature (assuming that a large temperature gradient exists between the air and PCB) has only a small effect on the temperature measured by the TC77. A potential for self-heating errors can exist if the TC77 SPI communication lines are heavily loaded. Typically, the self-heating error is negligible because of the rela- tively small current consumption of the TC77. A tem- perature accuracy error of approximately 0.5°C will result from self-heating if the SPI communication pins sink/source the maximum current specified for the TC77. Therefore, to maximize the temperature accu- racy, the output loading of the SPI signals should be minimized.

 2002 Microchip Technology Inc. DS20092A-page 13 TC77

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

Legend: XX...X Customer specific information* Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard marking consists of Microchip part number, year code, week code, and traceability code. Please check with your Microchip Sales Office. 5-Lead SOT-23 Example: XXNN CP57 TC77-3.3MCTTR = CN TC77-5.0MCTTR = CP 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN TC77-33 I/SN0222 057

DS20092A-page 14  2002 Microchip Technology Inc. 5-Lead Plastic Small Outline Transistor (OT) (SOT23) 10501050βMold Draft Angle Bottom 10501050αMold Draft Angle Top 10501050φFoot Angle 1.90.075p1Outside lead pitch (basic) 0.95.038pPitch 55nNumber of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units p D B n E L c β φ α A2A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MO-178 Drawing No. C04-091 § Significant Characteristic

 2002 Microchip Technology Inc. DS20092A-page 15 TC77 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) Foot Angle φ 048048 1512015120βMold Draft Angle Bottom 1512015120αMold Draft Angle Top 1.27.050pPitch 88nNumber of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units D n p B E h Lβ c 45° φ α A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 § Significant Characteristic

DS20092A-page 16  2002 Microchip Technology Inc. NOTES:

 2002 Microchip Technology Inc. DS20092A-page 17 TC77 SYSTEMS INFORMATION AND UPGRADE HOT LINE The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive the most current upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. T o view the site, the user must have access to the Internet and a web browser, such as Netscape ® or Microsoft ® Internet Explorer. Files are also available for FTP download from our FTP site. Connecting to the Microchip Internet Web Site The Microchip web site is available at the following URL: www.microchip.com The file transfer site is available by using an FTP ser- vice to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development T ools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A vari- ety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is:

  • Latest Microchip Press Releases
  • T echnical Support Section with Frequently Asked Questions
  • Design Tips
  • Device Errata
  • Job Postings
  • Microchip Consultant Program Member Listing
  • Links to other useful web sites related to Microchip Products
  • Conferences for products, Development Systems, technical information and more
  • Listing of seminars and events 092002

DS20092A-page 18  2002 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod- uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? To : T echnical Publications Manager RE: Reader Response From: Name Company Address City / State / ZIP / Country Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: DS20092ATC77

 2002 Microchip Technology Inc. DS20092A-page19 TC77 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. T o determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. PART NO. X XX PackageTemperature Range Device Device: TC77: Thermal Sensor with SPI Interface Supply Voltage: 3.3 = V DD = Accuracy optimized for 3.3V 5.0 = V DD = Accuracy optimized for 5.0V Temperature Range: M = -55 °C to +125°C Package: CTTR = Plastic Small Outline Transistor (SOT-23), 5-lead (Tape and Reel only) OA = Plastic SOIC, (150 mil Body), 8-lead Examples: a) TC77-3.3MOA: 3.3V Thermal Sensor in SOIC package. b) TC77-5.0MOA: 5.0V Thermal Sensor in SOIC package. c) TC77-3.3MOATR: 3.3V Thermal Sensor in SOIC package, Tape and Reel. d) TC77-5.0MOATR: 5.0V Thermal Sensor in SOIC package, Tape and Reel. e) TC77-3.3MCTTR: 3.3V Thermal Sensor in SOT-23 package, Tape and Reel. f) TC77-5.0MCTTR: 5.0V Thermal Sensor in SOT-23 package, Tape and Reel. -X.X Supply Voltage

DS20092A-page 20  2002 Microchip Technology Inc. NOTES:

 2002 Microchip Technology Inc. DS20092A - page 21 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, K EELOQ, MPLAB, PIC, PICmicro, PICSTART and PRO MATE are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, micro ID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and T otal Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.

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Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan T ai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 China - Hong Kong SAR Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza

223 Hing Fong Road

Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India Microchip Technology Inc. India Liaison Office Divyasree Chambers

1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd.

200 Middle Road

#07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE Austria Microchip Technology Austria GmbH Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 France Microchip Technology SARL Parc d’Activite du Moulin de Massy

43 Rue du Saule Trapu

91300 Massy, France

D-85737 Ismaning, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1

20041 Agrate Brianza

Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Microchip Ltd.

505 Eskdale Road

Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 08/01/02 WORLDWIDE SALES AND SERVICE