TC7662A_02 MICROCHIP | Alldatasheet
Document overview
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Technical content
Features
- Wide Operating Range - 3V to 18V Increased Output Current (40mA) Pin Compatible with ICL7662/SI7661/TC7660/ LTC1044 No External Diodes Required Low Output Impedance @ I L = 20mA -4 0 Ω Typ. No Low-Voltage Terminal Required CMOS Construction Available in 8-Pin PDIP and 8-Pin CERDIP Packages
Applications
Laptop Computers Disk Drives Process Instrumentation µP-based Controllers Device Selection Table Package Type General Description The TC7662A is a pin-compatible upgrade to the industry standard TC7660 charge pump voltage converter. It converts a +3V to +18V input to a corresponding -3V to -18V output using only two low- cost capacitors, eliminating inductors and their associated cost, size and EMI. In addition to a wider power supply input range (3V to 18V versus 1.5V to 10V for the TC7660), the TC7662A can source output currents as high as 40mA. The on-board oscillator operates at a nominal frequency of 12kHz. Operation below 12kHz (for lower supply current applications) is also possible by connecting an external capacitor from OSC to ground. The TC7662A directly is recommended for designs requiring greater output current and/or lower input/ output voltage drop. It is available in 8-pin PDIP and CERDIP packages in commercial and extended temperature ranges. Part Number Package Operating Temp. Range TC7662ACPA 8-Pin PDIP 0 °C to +70°C TC7662AEPA 8-Pin PDIP -40 °C to +85°C TC7662AIJA 8-Pin CERDIP -25 °C to +85°C TC7662AMJA 8-Pin CERDIP -55 °C to +125°C TC7662A NC GND C– VOUT NC OSC VDD 8-Pin PDIP 8-Pin CERDIP Charge Pump DC-to-DC Converter
DS21468B-page 2 2002 Microchip Technology Inc. Functional Block Diagram Comparator with Hysteresis C F/F Q Q VREF Level Shift VDD P SW1 CAP CP EXT N SW4 N SW2 N SW3 CAP CR EXT RL VOUT I OSC GND OUT TC7662A Level Shift Level Shift Level Shift
2002 Microchip Technology Inc. DS21468B-page 3 TC7662A
1.0 ELECTRICAL
Absolute Maximum Ratings* Package Power Dissipation (T A ≤ 70°C) Package Thermal Resistance Operating Temperature Range Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC7662A ELECTRICAL SPECIFICATIONS Electrical Characteristics: VDD = 15V, TA = +25°C, Test circuit (Figure 3-1) unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions VDD Supply Voltage 3 — 18 V IS Supply Current — 510 560 650 190 210 210 700 µAR L = ∞ VDD = +15V 0°C ≤ TA ≤ +70°C VDD = +5V 0°C ≤ TA ≤ +70°C RO Output Source Resistance — 100 125 Ω IL = 20mA, VDD = +15V IL = 40mA, VDD = +15V IL = 3mA, VDD = +5V FOSC Oscillator Frequency — 12 — kHz PEFF Power Efficiency 93 %V DD = +15V RL = 2kΩ VEFF Voltage Efficiency 99 99.9 %V DD = +15V RL = ∞ Over operating temperature range.
DS21468B-page 4 2002 Microchip Technology Inc.
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP, CERDIP) Symbol Description 1 NC No connection. 2C + Charge pump capacitor positive terminal. 3 GND Ground terminal. 4C - Charge pump capacitor negative terminal. 5V OUT Output voltage. 6 NC No connection. 7 OSC Oscillator control input. Bypass with an external capacitor to slow the oscillator. 8V DD Power supply positive voltage input.
2002 Microchip Technology Inc. DS21468B-page 5 TC7662A
3.0 DETAILED DESCRIPTION
The TC7662A is a capacitive charge pump (sometimes called a switched-capacitor circuit), where four MOSFET switches control the charge and discharge of a capacitor. The functional block diagram shows how the switching action works. SW1 and SW2 are turned on simulta- neously, charging C P to the supply voltage, V DD. This assumes that the ON resistance of the MOSFETs in series with the capacitor produce a charging time (3 time constants) less than the ON time provided by the oscillator frequency, as shown: 3 (R DS(ON) CP) <CP/(0.5 fOSC). In the next cycle, SW1 and SW2 are turned OFF and, after a very short interval with all switches OFF (preventing large currents from occurring due to cross conduction), SW3 and SW4 are turned ON. The charge in C P is then transferred to C R, but with the polarity inverted. In this way, a negative voltage is derived. An oscillator supplies pulses to a flip-flop that is fed to a set of level shifters. These level shifters then drive each set of switches at one-half the oscillator frequency. The oscillator has a pin that controls the frequency of oscillation. Pin 7 can have a capacitor added that is connected to ground. This will lower the frequency of the oscillator by adding capacitance to the internal timing capacitor of the TC7662A. (See Typical Characteristics – Oscillator Frequency vs. C OSC.) FIGURE 3-1: TC7662A TEST CIRCUIT
3.1 Theoretical Power Efficiency
In theory, a voltage converter can approach 100% efficiency if certain conditions are met: 1. The drive circuitry consumes minimal power. 2. The output switches have extremely low ON resistance and virtually no offset. 3. The impedances of the pump and reservoir capacitors are negligible at the pump frequency. The TC7662A approaches these conditions for negative voltage conversion if large values of C P and CR are used. Note: Energy is lost only in the transfer of charge between capacitors if a change in voltage occurs. The energy lost is defined by: E = 1/2 CP (V1 2 – V2 V1 and V2 are the voltages on CP during the pump and transfer cycles. If the impedances of C P and C R are relatively high at the pump frequency (refer to Figure 3- 1), compared to the value of R L, there will be a substantial difference in voltages V1 and V2. Therefore, it is desirable not only to make CR as large as possible to eliminate output voltage ripple, but also to employ a correspondingly large value for C P in order to achieve maximum efficiency of operation.
3.2 Dos and Don’ts
Do not exceed maximum supply voltages. Do not short circuit the output to V+ supply for voltages above 5.5V for extended periods; however, transient conditions including start-up are okay. When using polarized capacitors in the inverting mode, the + terminal of C P must be connected to pin 2 of the TC7662A and the + terminal of CR must be connected to GND (pin 3). If the voltage supply driving the TC7662A has a large source impedance (25-30 ohms), then a 2.2µF capacitor from pin 8 to ground may be required to limit the rate of rise of the input voltage to less than 2V/µsec. TC7662A 10µF 10µF VDD (+5V)NC NC6+ CP CR VOUT (-5V) COSC RL IS IL
DS21468B-page 6 2002 Microchip Technology Inc.
4.0 TYPICAL APPLICATIONS
4.1 Simple Negative Voltage
The majority of applications will undoubtedly utilize the TC7662A for generation of negative supply voltages. Figure 4-1 shows typical connections to provide a negative supply where a positive supply of +3V to +18V is available. FIGURE 4-1: SIMPLE NEGATIVE CONVERTER AND ITS OUTPUT EQUIVALENT The output characteristics of the circuit in Figure 4-1 are those of a nearly ideal voltage source in series with a resistance as shown in Figure 4-1b. The voltage source has a value of -(V DD). The output impedance (RO) is a function of the ON resistance of the internal MOS switches (shown in the Functional Block Diagram), the switching frequency, the value of CP and CR, and the ESR (equivalent series resistance) of C P and CR. A good first order approximation for RO is: Combining the four RSWX terms as RSW, we see that: RSW, the total switch resistance, is a function of supply voltage and temperature (See Section 5.0, Typical Characteristics “Output Source Resistance ” graphs), typically 23Ω at +25°C and 5V. Careful selection of C P and CR will reduce the remaining terms, minimizing the output impedance. High value capacitors will reduce the 1/(f PUMP x C P) component, and low ESR capacitors will lower the ESR term. Increasing the oscillator frequency will reduce the 1/(fPUMP x CP) term, but may have the side effect of a net increase in output impedance when C P > 10 µF and there is not enough time to fully charge the capacitors every cycle. In a typ- ical application when f OSC = 12kHz and C = CP = CR = 10µF: Since the ESRs of the capacitors are reflected in the output impedance multiplied by a factor of 5, a high value could potentially swamp out a low 1/(f PUMP x CP) term, rendering an increase in switching frequency or filter capacitance ineffective. Typical electrolytic capacitors may have ESRs as high as 10Ω. TC7662A10µF VDD +10µF VOUT = -V+ VOUT RO VDDVDDVDDVDD AB RO ≅ 2(RSW1 + RSW2 + ESRCP) + 2(RSW3 + RSW4 + ESRCP) + + ESRCR fPUMP x CP (fPUMP = , RSWX = MOSFET switch resistance)fOSC RO ≅ 2 x RSW + + 4 x ESRCP + ESRCRΩ1 fPUMP x CP RO ≅ 2 x 23 + + 4 x ESR CP + ESRCR (5 x 123 x 10 x 10-6) RO ≅ (46 + 20 + 5 x ESRC)Ω
2002 Microchip Technology Inc. DS21468B-page 7 TC7662A
4.2 Output Ripple
ESR also affects the ripple voltage seen at the output. The total ripple is determined by 2 voltages, A and B, as shown in Figure 4-2. Segment A is the voltage drop across the ESR of C R at the instant it goes from being charged by C P (current flowing into C R) to being dis- charged through the load (current flowing out of C R). The magnitude of this current change is 2 x IOUT, hence the total drop is 2 x IOUT x ESRCR volts. Segment B is the voltage change across CR during time t2, the half of the cycle when C R supplies current to the load. The drop at B is IOUT x t2/CR volts. The peak-to-peak ripple voltage is the sum of these voltage drops: FIGURE 4-2: OUTPUT RIPPLE
4.3 Paralleling Devices
Any number of TC7662A voltage converters may be paralleled to reduce output resistance (Figure 4-3). The reservoir capacitor, C R, serves all devices, while each device requires its own pump capacitor, C P. The resultant output resistance would be approximately:
4.4 Cascading Devices
The TC7662A may be cascaded as shown (Figure 4-4) to produce larger negative multiplication of the initial supply voltage. However, due to the finite efficiency of each device, the practical limit is 10 devices for light loads. The output voltage is defined by: V OUT = – n (VIN) where n is an integer representing the number of devices cascaded. The resulting output resistance would be approximately the weighted sum of the individual TC7662A R OUT values. FIGURE 4-3: PARALLELING DEVICES LOWERS OUTPUT IMPEDANCE FIGURE 4-4: INCREASED OUTPUT VOLTAGE BY CASCADING DEVICES 2 x fPUMP x CRVRIPPLE ≅ ( + 2 x ESRCR x IOUT) t2 t1 B A V -(VDD) ROUT = ROUT (of TC7662A) n (number of devices) TC7662A VDD TC7662A RL "n" "1" VDD 10µF 10µF "n" "1" 10µF VOUT* TC7662A TC7662A *VOUT = -nVDD 10µF
DS21468B-page 8 2002 Microchip Technology Inc.
4.5 Changing the TC7662A Oscillator
It is possible to increase the conversion efficiency of the TC7662A at low load levels by lowering the oscillator frequency. This reduces the switching losses, and is shown in Figure 4-5. However, lowering the oscillator frequency will cause an undesirable increase in the impedance of the pump (C P) and reservoir (CR) capacitors; this is overcome by increasing the values of CP and CR by the same factor that the frequency has been reduced. For example, the addition of a 100pF capacitor between pin 7 (OSC) and V DD will lower the oscillator frequency to 2kHz from its nominal frequency of 12kHz (multiple of 6), and thereby necessitate a corresponding increase in the value of C P and CR (from 10µF to 68µF). FIGURE 4-5: LOWERING OSCILLATOR FREQUENCY
4.6 Positive Voltage Doubling
The TC7662A may be employed to achieve positive voltage doubling using the circuit shown in Figure 4-6. In this application, the pump inverter switches of the TC7662A are used to charge C P to a voltage level of VDD – VF (where V DD is the supply voltage and V F is the forward voltage on CP plus the supply voltage (VDD) applied through diode D2 to capacitor CR). The voltage thus created on CR becomes (2 VDD) – (2 VF), or twice the supply voltage minus the combined forward voltage drops of diodes D 1 and D2. The source impedance of the output (VOUT) will depend on the output current, but for V DD = 5V and an output current of 10 mA, it will be approximately 60Ω. FIGURE 4-6: POSITIVE VOLTAGE MULTIPLIER
4.7 Combined Negative Voltage
Conversion and Positive Supply Multiplication Figure 4-7 combines the functions shown in Figure 4-1 and Figure 4-6 to provide negative voltage conversion and positive voltage doubling simultaneously. This approach would be, for example, suitable for generat- ing +9V and -5V from an existing +5V supply. In this instance, capacitors C 1 and C3 perform the pump and reservoir functions, respectively, for the generation of the negative voltage, while capacitors C 2 and C 4 are pump and reservoir, respectively, for the doubled positive voltage. There is a penalty in this configuration which combines both functions, however, in that the source impedances of the generated supplies will be somewhat higher due to the finite impedance of the common charge pump driver at pin 2 of the device. FIGURE 4-7: COMBINED NEGATIVE CONVERTER AND POSITIVE DOUBLER
4.8 Voltage Splitting
The same bidirectional characteristics can be used to split a higher supply in half, as shown in Figure 4-8. The combined load will be evenly shared between the two sides. Because the switches share the load in parallel, the output impedance is much lower than in the standard circuits, and higher currents can be drawn from the device. By using this circuit, and then the circuit of Figure 4-4, +15V can be converted (via +7.5V and -7.5V) to a nominal -15V, though with rather high series resistance (~250Ω). FIGURE 4-8: SPLITTING A SUPPLY IN HALF VOUT COSC TC7662A 10µF 10µF VDD VOUT = (2 VDD) – (2 VF) CR CP TC7662A VDD VDD VOUT = (2 VDD) – (2 VF)C1 D1 + VOUT = -(VDD – VF) TC7662A RL1 RL2 VOUT = VDD – V – 50µF µF VDD V – 50µF TC7662A
2002 Microchip Technology Inc. DS21468B-page 9 TC7662A
5.0 TYPICAL CHARACTERISTICS
Circuit of Figure 3-1, CP = CR = 10µF, CESRCP ≈ CESRCR ≈ 1Ω, TA = 25°C unless otherwise noted. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 700 600 500 400 300 200 100 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (°C) SUPPLY CURRENT (µA) VDD = 15V VDD = 5V Supply Current vs. Temperature -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (°C) FREQUENCY (kHz) Frequency vs. Temperature 100 LOAD CURRENT (mA) POWER CONVERSION EFFICIENCY (%) Power Conversion Efficiency vs. ILOAD 16 32 48 64 80 82 4 4 05 6 7 20 150 120 135 105 SUPPLY CURRENT (mA) Efficiency Supply Current 110 TA = +25°C 165 100 1 10 100 1000 10,000 CAPACITANCE (pF) FREQUENCY (Hz) Oscillator Frequency vs. COSC 10k TAT = +25°C 160 140 120 100 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (°C) OUTPUT RESISTANCE ( ) VDD = 15V, IL = 20mA Output Resistance vs. Temperature VDD = 5V, IL = 3mA Ω 100 INPUT VOLTAGE (V) OUTPUT RESISTANCE ( ) Output Resistance vs. Input Voltage 4 8 12 16 20 2 6 10 14 18 Ω 110 IL = 20mA TA = +25°C
DS21468B-page 10 2002 Microchip Technology Inc.
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Package marking data not available at this time.
6.2 Package Dimensions
3° MIN. PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm) .400 (10.16) .370 (9.40) .300 (7.62) .230 (5.84) .065 (1.65) .045 (1.14) PIN 1 .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18) .110 (2.79) .090 (2.29) .020 (0.51) .016 (0.41) .040 (1.02) .020 (0.51) .320 (8.13) .290 (7.37) .150 (3.81) MIN. 3° MIN. 8-Pin CDIP (Narrow) .015 (0.38) .008 (0.20) .400 (10.16) .320 (8.13) Dimensions: inches (mm)
2002 Microchip Technology Inc. DS21468B-page11 TC7662A Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21468B-page12 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21468B-page 13 TC7662A Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, K EELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Tech- nology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
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