TC7652_13 MICROCHIP | Alldatasheet
Document overview
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Technical content
Features
- Low Offset Over Temperature Range: 10V
- Ultra Low Long Term Drift: 150nV/Month
- Low Temperature Drift: 100nV/C
- Low DC Input Bias Current: 15pA
- High Gain, CMRR and PSRR: 110dB Min
- Low Input Noise Voltage: 0.2Vp-p (DC to 1Hz)
- Internally Compensated for Unity Gain Operation
- Clamp Circuit for Fast Overload Recovery
Applications
- Instrumentation
- Medical Instrumentation
- Embedded Control
- Temperature Sensor Amplifier
- Strain Gage Amplifier Device Selection Table Package Type General Description The TC7652 is a lower noise version of the TC7650, sacrificing some input specifications (bias current and bandwidth) to achieve a 10x reduction in noise. All the other benefits of the chopper technique are present, (i.e, freedom from offset adjust, drift and reliability prob- lems from external trim components). Like the TC7650, the TC7652 requires only two noncritical external caps for storing the chopped null potentials. There are no significant chopping spikes, internal effects or over- range lockup problems. Part Number Package Temperature Range TC7652CPA 8-Pin Plastic DIP 0°C to +70°C TC7652CPD 14-Pin Plastic DIP 0°C to +70°C C A Output TC7652CPA -Input +Input VSS VDD CB Output Clamp VSS VDD NC NC = No Internal Connection (May Be Used As Input Guard) INT/EXT EXT CLK In INT CLK Out Output Output Clamp CRETN -Input +Input NC TC7652CPD CB CA 8-Pin DIP 14-Pin DIP TC7652 Low Noise, Chopper Stabilized Operational Amplifier
DS21464C-page 2 2001-2012 Microchip Technology Inc. Functional Block Diagram TC7652 NULL NULL Output BB A CA CB CRETN (1) NULL Amplifier Main Amplifier Output Clamp Circuit Intermod Comparator Oscillator BA INT/EXT EXT CLK IN CLK OUT 14-Pin DIP Only BA Inputs Output Clamp (Not On "Z" Pinout) NOTE 1: For 8-pin DIP connect to VSS, or to CRET on "Z" pinout. VSS
2001-2012 Microchip Technology Inc. DS21464C-page 3 TC7652
1.0 ELECTRICAL
ABSOLUTE MAXIMUM RATINGS* Package Power Dissipation (T A < 70°C Operating Temperature Range *Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indi- cated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods my affect device reliability. TC7652 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VDD = +5V, VSS = -5V, TA = +25°C, unless otherwise indicated. Symbol Parameter Min Typ Max Units Test Conditions VOS Input Offset Voltage — ±2 ±5 VT A = +25°C TCVOS Average Temperature Co-efficient of Input Offset Voltage VOS/DT Offset Voltage vs Time — 150 — nV/mo IBIAS Input Bias Current (CLK On) — 100 250 100 1000 pA T A = +25°C 0°C < TA < +70°C -25°C < TA < +85°C IBIAS Input Bias Current (CLK Off) — 100 1000 pA T A = +25°C 0°C < TA < +70°C -25°C < TA < +85°C IOS Input Offset Current — 25 150 pA RIN Input Resistance — 10 12 — OL Large Signal Voltage Gain 120 150 — dB R L = 10k, VOUT = ±4V VOUT Output Voltage Swing (Note 2)± 4 . 7 ±4.85 ±4.95 VR L = 10k RL = 100k CMVR Common Mode Voltage Range -4.3 — +3.5 V MRR Common Mode Rejection Ratio 120 140 — dB CMVR = -4.3V to +3.5V PSRR Power Supply 120 140 — dB ±3V to ±8V e N Input Noise Voltage — 0.2 0.7 1.5 VP-P VP-P RS = 100, DC to 1Hz DC to 10Hz IN Input Noise Current — 0.01 — pA/ Hz f= 10Hz GBW Unity Gain Bandwidth — 0.4 — MHz SR Slew Rate — 1 — V/ sec C L = 50pF, RL = 10k Overshoot — 15 — % VDD, VSS Operating Supply Range 5 — 16 V Note 1: Limiting input current to 100A is recommended to avoid latch-up problems. Ty pically 1mA is safe however, this is not guaranteed. 2: Output clamp not connected. See typical characteristics curv es for output swing versus clamp current characteristics. 3: See “Output Clamp” under detailed description.
DS21464C-page 4 2001-2012 Microchip Technology Inc. IS Supply Current — 1 3 mA No Load fCH Internal Chopping Frequency 100 275 — Hz Pins 12 – 14 Open (DIP) Clamp ON Current (Note 3) 25 100 — AR L = 100k Clamp OFF Current (Note 3)— 1 — p A - 4 V VOUT < +10V TC7652 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: VDD = +5V, VSS = -5V, TA = +25°C, unless otherwise indicated. Symbol Parameter Min Typ Max Units Test Conditions Note 1: Limiting input current to 100A is recommended to avoid latch-up problems. Ty pically 1mA is safe however, this is not guaranteed. 2: Output clamp not connected. See typical characteristics curv es for output swing versus clamp current characteristics. 3: See “Output Clamp” under detailed description.
2001-2012 Microchip Technology Inc. DS21464C-page 5 TC7652
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin Number Symbol Description 8-pin DIP 14-pin DIP 1,8 2,1 C A, CB Nulling capacitor pins 2 4 -INPUT Inverting Input 3 5 +INPUT Non-inverting Input
47 V SS Negative Power Supply
59 O U T P U T
61 0 O U T P U T O u t p u t 71 1 V DD Positive Power Supply — 3,6 NC No internal connection —8C RETN Capacitor current return pin — 12 INT CLK OUT Internal Clock Output — 13 EXT CLK IN External Clock Input — 14 INT/EXT Select Internal or External Clock
DS21464C-page 6 2001-2012 Microchip Technology Inc.
3.0 DETAILED DESCRIPTION
3.1 Capacitor Connection
Connect the null storage capacitors to the C A and CB pins with a common connection to the CRET pin (14-pin TC7652) or to VSS (8-pin TC7652). When connecting to VSS, avoid injecting load current IR drops into the capacitive circuitry by making this connection directly via a separate wire or PC trace.
3.2 Output Clamp
In chopper stabilized amplifiers, the output clamp pin reduces overload recovery time. When a connection is made to the inverting input pin (summing junction), a current path is created between that point and the out- put pin, just before the device output saturates. This prevents uncontrolled differential input voltages and charge build-up on correction storage capacitors. Out- put swing is reduced.
3.3 Clock
The TC7652 has a 550Hz internal oscillator, which is divided by two before clocking the input chopper switches. The 275Hz chopping frequency is available at INT CLK OUT (Pin 12) on 14-pin devices. In normal operation, INT/EXT (Pin 14), which has an internal pull- up, can be left open. An external clock can also be used. To disable the internal clock and use an external one, the INT/EXT pin must be tied to V SS. The external clock signal is then applied to the EXT CLK IN input (Pin 13). An internal divide-by-two provides a 50% switching duty cycle. The capacitors are only charged when EXT CLK IN is high, so a 50% to 80% positive duty cycle is recommended for higher clock frequencies. The external clock can swing between V DD and V SS, with the logic threshold about 2.5V below VDD. The output of the internal oscillator, before the divide- by-two circuit, is available at EXT CLK IN when INT/ EXT is high or unconnected. This output can serve as the clock input for a second TC7652 (operating in a master/slave mode), so that both op amps will clock at the same frequency. This prevents clock intermodula- tion effects when two TC7652's are used in a differen- tial amplifier configuration. FIGURE 3-1: TEST CIRCUIT If the TC7652's output saturates, error voltages on the external capacitors will slow overload recovery. This condition can be avoided if a strobe signal is available. The strobe signal is applied to EXT CLK IN and the overload signal is applied to the amplifier while the strobe is LOW. In this case, neither capacitor will be charged. The low leakage of the capacitor pins allow long measurements to be made within eligible errors (typical capacitor drift is 10V/sec).
4.0 TYPICAL APPLICATIONS
4.1 Component Selection
CA and CB (external capacitors)should be in the 0.1F to 1F range. For minimum clock ripple noise, use a 1F capacitor in broad bandwidth circuits. For limited bandwidth applications where clock ripple is filtered out, use a 0.1F capacitor for slightly lower offset volt- age. High quality, film type capacitors (polyester or polypropylene) are recommended, although a lower grade ceramic may work in some applications. For quickest settling after initial turn-on, use low dielectric absorption capacitors (e.g., polypropylene). With ceramic capacitors, settling to 1 V takes several sec- onds.
4.2 Static Protection
Although input diodes static protect all device pins, avoid strong electrostatic fields and discharges that can cause degraded diode junction characteristics and produce increased input-leakage currents. Output 0.1µF 0.1µF TC7652 C R C 1kΩ 1MΩ
2001-2012 Microchip Technology Inc. DS21464C-page 7 TC7652
4.3 Output Stage/Load Driving
The output circuit is high impedance (about 18k ). With lesser loads, the chopper amplifier behaves somewhat like a transconductance amplifier with an open-loop gain proportional to load resistance. (For example, the open-loop gain is 17dB lower with a 1k. load than with a 10k load.) If the amp is used only for DC, the DC gain is typically greater than 120dB (even with a 1k load), and this lower gain is inconsequential. For wide band, the best frequency response occurs with a load resistor of at least 10k . This produces a 6dB/octave response from 0.1Hz to 2MHz, with phase shifts of less than 2 degrees in the transition region, where the main amplifier takes over from the null ampli- fier. FIGURE 4-1: CONNECT ION OF INPUT GUARDS
4.4 Thermoelectric Effects
The thermoelectric (Seebeck) effects in thermocouple junctions of dissimilar metals, alloys, silicon, etc. limit ultra high precision DC amplifiers. Unless all junctions are at the same temperature, thermoelectric voltages around 0.1V/C (up to tens of V/C for some materi- als) are generated. To realize the low offset voltages of the chopper, avoid temperature gradients. Enclose components to eliminate air movement, especially from power dissipating elements in the system. Where pos- sible, use low thermoelectric co-efficient connections. Keep power supply voltages and power dissipation to a minimum. Use high impedance loads and seek maxi- mum separation from surrounding heat disipating ele- ments.
4.5 Guarding
To benefit from TC7652 low input currents, take care assembling printed circuit boards. Clean boards with alcohol or TCE and blow dry with compressed air. To prevent contamination, coat boards with epoxy or sili- cone rubber. Even if boards are cleaned and coated, leakage cur- rents may occur because input pins are next to pins at supply potentials. To reduce this leakage, use guarding to lower the voltage difference between the inputs and adjacent metal runs. The guard (a conductive ring sur- rounding inputs) is connected to a low impedance point at about the same voltage as inputs. The guard absorbs leakage currents from high voltage pins. The 14-pin dual-in-line arrangement simplifies guard- ing. Like the LM108 pin configuration (but unlike the 101A and 741), pins next to inputs are not used. Input + Output R2R1 Inverting Amplifier Input + Output Follower Input + Output Noninverting Amplifier TC7652 TC7652 TC7652
DS21464C-page 8 2001-2012 Microchip Technology Inc.
4.6 Pin Compatibility
Where possible, the 8-pin device pinout conforms to such industry standards as the LM101 and LM741. Null storing external capacitors connect to Pins 1 and 8, which are usually for offset null or compensation capac- itors. Output clamp (Pin 5) is similarly used. For OP05 and OP07 devices, replacement of the offset null potentiometer (connected between Pins 1 and 8 and V DD by two capacitors from those pins to VSS) provides compatibility. Replacing the compensation capacitor between Pins 1 and 8 by two capacitors to V SS is required. The same operation (with the removal of any connection to Pin 5) works for LM101, A748 and sim- ilar parts. Because NC pins provide guarding between input and other pins, the 14-pin device pinout conforms closely to the LM108. Because this device does not use any extra pins and does not provide offset nulling (but requires a compensation capacitor), some layout changes are necessary to convert to the TC7652.
4.7 Some Applications
Figures 4-2 and 4-3 show basic inverting and nonin- verting amplifier circuits using the output clamping cir- cuit to enhance overload recovery performance. The only limitations on replacing other op amps with the TC7652 are supply voltage (±8V maximum) and output drive capability (10k load for full swing). Overcome these limitations with a booster circuit (Figure 4-4) to combine output capabilities of the LM741 (or other standard device) with input capabilities of the TC7652. These two form a composite device, therefore, when adding the feedback network, the monitor loop gains stability. FIGURE 4-2: NONINVERTING AMPLIFIER WITH OPTIONAL CLAMP FIGURE 4-3: INVERTING AMPLIFIER WITH OPTIONAL CLAMP FIGURE 4-4: USING 741 TO BOOST OUTPUT DRIVE CAPABILITY Figure 4-5 shows the clamp circuit of a zero offset com- parator. Because the clamp circuit requires the invert- ing input to follow the input signal, problems with a chopper stabilized op amp are avoided. The threshold input must tolerate the output clamp current V IN/R without disrupting other parts of the system. Figure 4-6 shows how the TC7652 can offset null high slew rate and wideband amplifiers. Mixing the TC7652 with circuits operating at ±15V requires a lower supply voltage divider with the TC7660 voltage converter circuit operated "backwards." Figure 4-7 shows an approximate connection. FIGURE 4-5: LOW OFFSET COMPARATOR TC7652 Output Clamp Input 0.1µF 0.1µF Output Input R1 Clamp 0.1µF 0.1µF TC7652 +15V -15V -7.5V 0.1 µF In Out -7.5V 0.1 µF 10kΩ TC7652 741 TC7652 VOUT Clamp VIN 0.1µF 0.1µF 200kΩ to 2mΩ VTH
DS21464C-page 10 2001-2012 Microchip Technology Inc.
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 2345678 ± SUPPLY VOLTAGE (V) 1400 1200 1000 800 600 400 200 SUPPLY CURRENT (µA) Supply Current vs ± Supply Voltage OUTPUT VOLTAGE (V) 1 mA 0.1mA 0.01mA 1µA 0.1µA 0.01µA 1nA 0.1nA 0.01nA 1pA CLAMP CURRENT Positive Clamp Current SOURCE SINK Output Resistance vs Output Voltage 100 OUTPUT RESISTANCE (W) -3.0 OUTPUT VOLTAGE (V) 1k 10k 100k 1M -5.0 -4.0 1 sec/DIV 2 µV/DIV Noise at 0.1Hz to 10Hz OUTPUT VOLTAGE (V) 1mA 0.1mA 0.01mA 1µA 0.1µA 0.01µA 1nA 0.1nA 0.01nA 1pA CLAMP CURRENT Negative Clamp Current 1 sec/DIV 1 µV/DIV Noise at 0.1Hz to 100Hz 1 sec/DIV 1 µV/DIV Noise at 0.1Hz to 1Hz 1 10 100 1k 10k 100k 1M FREQUENCY (Hz) GAIN -20 -10 60GAIN (dB) Phase Gain (Bode Plot)* *NOTE: ±5V, ±2.5V supplies; no load to 10k load. -180 -120 -60 +60 +120 +180 +240 PHASE (deg) 5 µsec/DIV 0.5V/DIV Slew Rate PHASE
2001-2012 Microchip Technology Inc. DS21464C-page 11 TC7652 -6 -4 -2 0 2 4 COMMON MODE VOLTAGE (V) Input Offset Voltage vs Common Mode Voltage 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 INPUT OFFSET VOLTAGE (µV)
DS21464C-page 12 2001-2012 Microchip Technology Inc.
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Package marking information not available at this time.
2001-2012 Microchip Technology Inc. DS21464C-page 13 TC7652
6.2 Package Dimensions
3˚MIN. PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging .260 (6.60) .240 (6.10) .770 (19.56) .745 (18.92) .310 (7.87) .290 (7.37) .040 (1.02) .020 (0.51) .070 (1.78) .045 (1.14) .022 (0.56) .015 (0.38) .110 (2.79) .090 (2.29) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) PIN 1 14-Pin PDIP (Narrow) .015 (0.38) .008 (0.20) 3˚MIN. .400 (10.16) .310 (7.87) Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
DS21464C-page 14 2001-2012 Microchip Technology Inc.
7.0 REVISION HISTORY
Revision C (December 2012) Added a note to each package outline drawing.
2001-2012 Microchip Technology Inc. DS21464C-page 15 TC7652 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an e rrata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21464C-page 16 2001-2012 Microchip Technology Inc. NOTES:
2001-2012 Microchip Technology Inc. DS21464C-page 17 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768419 Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions.
- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
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- Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are co mmitted to continuously improvin g the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT S YSTEM CERTIFIED BY DNV == ISO/TS 16949 ==
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