TC72

TC72 MICROCHIP | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 24

Technical content

Features

• T emperature-to-Digital Converter
• SPI™ Compatible Interface
• 10-Bit Resolution (0.25°C/Bit)
• ±2°C (max.) Accuracy from -40°C to +85°C
• ±3°C (max.) Accuracy from -55°C to +125°C
• 2.65V to 5.5V Operating Range
• Low Power Consumption: - 250 µA (typ.) Continuous T emperature Conversion Mode - 1 µA (max.) Shutdown Mode
• Power Saving One-Shot Temperature Measurement
• Industry Standard 8-Pin MSOP Package
• Space Saving 8-Pin DFN (3x3 mm) Package Typical Applications
• Personal Computers and Servers
• Hard Disk Drives and Other PC Peripherals
• Entertainment Systems
• Office Equipment
• Datacom Equipment
• Mobile Phones
• General Purpose Temperature Monitoring Package Types General Description The TC72 is a digital temperature sensor capable of reading temperatures from -55°C to +125°C. This sen- sor features a serial interface that allows communica- tion with a host controller or other peripherals. The TC72 interface is compatible with the SPI protocol. The TC72 does not require any additional external compo- nents. However, it is recommended that a decoupling capacitor of 0.01 µF to 0.1 µF be provided between the V DD and GND pins. The TC72 can be used either in a Continuous Temper- ature Conversion mode or a One-Shot Conversion mode. The Continuous Conversion mode measures the temperature approximately every 150 ms and stores the data in the temperature registers. In con- trast, the One-Shot mode performs a single tempera- ture measurement and returns to the power saving shutdown mode. The TC72 features high temperature accuracy, ease- of-use and is the ideal solution for implementing ther- mal management in a variety of systems. The device is available in both 8-pin MSOP and 8-pin DFN space- saving packages. The TC72 also features a shutdown mode for low power operation. Block Diagram SCK CE GND NC SDI

5 SDO

Digital Temperature Sensor with SPI™ Interface

DS21743A-page 2  2002 Microchip Technology Inc. Typical Application AN0 SCK SDI CE SCK SDO TC72 0.1µF VDD GND VDD PICmicro® MCU SDOSDI

 2002 Microchip Technology Inc. DS21743A-page 3 TC72

1.0 ELECTRICAL

1.1 Maximum Ratings †

ESD protection on all pins: † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. PIN FUNCTION TABLE Name Function NC No Internal Connection CE Chip Enable Input, the device is selected when this input is high SCK Serial Clock Input GND Ground SDO Serial Data Output SDI Serial Data Input NC No Internal Connection V DD Power Supply DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply at V DD = 2.65V to 5.5V , TA = -55°C to +125°C. Parameters Sym Min Typ Max Units Conditions Power Supply Operating Voltage Range V DD 2.65 — 5.5 V Note 1 Operating Current: Normal Mode, ADC Active IDD-CON — 250 400 µA Continuous temp. conversion mode (Shutdown Bit = ‘0’) Shut-Down Supply Current I SHD — 0.1 1.0 µA Shutdown Mode (Shutdown Bit = ‘ 1’) Temperature Sensor and Analog-to-Digital Converter Temperature Accuracy (Note 1) T Resolution — 10 — Bits Note 4 ADC Conversion Time t CONV —1 5 0 2 0 0 m s Digital Input / Output High Level Input Voltage V IH 0.7 VDD ——V Low Level Input Voltage V IL — — 0.2 V DD V High Level Output Voltage V OH 0.7 VDD ——V I OH = 1 mA Low Level Output Voltage V OL — — 0.2 V DD VI OL = 4 mA Input Resistance R IN 1.0 — — M Ω Pin Capacitance C IN —1 5— p F COUT —5 0— TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V, 3.3V and 5.0V respectively. As V DD varies from the nominal operating value, the accuracy may be degraded. Refer to Figure 2-5 and Figure 2-6. 2: Measured with a load of CL = 50 pF on the SDO output pin of the TC72. 3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times. The rise and fall times are defined as the 10% to 90% transition time. 4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (2 10) = 256/1024 = 0.25°C/Bit

DS21743A-page 4  2002 Microchip Technology Inc. Serial Port AC Timing (Note 2, 3) Clock Frequency f CLK DC — 7.5 MHz SCK Low Time t CL 65 — — ns SCK High Time t CH 65 — — ns CE to SCK Setup t CC 400 — — ns SCK to Data Out Valid t CDD — — 55 ns CE to Output Tri-state t CDZ — — 40 ns SCK to Data Hold Time t CDH 35 — — ns Data to SCK Set-up Time t DC 35 — — ns SCK to CE Hold Time t CCH 100 — — ns SCK Rise Time t R —— 2 0 0 n s SCK Fall Time t F —— 2 0 0 n s CE Inactive Time t CWH 400 — — ns Thermal Package Resistance Thermal Resistance, MSOP-8 θ JA —2 0 6— ° C / W Thermal Resistance, DFN-8 θJA —6 0 . 5— ° C / W DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, all parameters apply at V DD = 2.65V to 5.5V , TA = -55°C to +125°C. Parameters Sym Min Typ Max Units Conditions TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V, 3.3V and 5.0V respectively. As VDD varies from the nominal operating value, the accuracy may be degraded. Refer to Figure 2-5 and Figure 2-6. 2: Measured with a load of CL = 50 pF on the SDO output pin of the TC72. 3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times. The rise and fall times are defined as the 10% to 90% transition time. 4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (2 10) = 256/1024 = 0.25°C/Bit

 2002 Microchip Technology Inc. DS21743A-page 5 TC72 FIGURE 1-1: Serial Port Timing Diagrams. CE 1/fCLK tCLtCH D7 D0 HIGH Z SDI SPI READ DATA TRANSFER CE 1/fCLK tCC A7 = 1 tCLtCH D7 D0SDI A0 tDC tCDH tF tR tDC tCDH tRtF SCK tCC (CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 0) (CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 1) tCDD SDO SCK tCCH tCWH tCDZ HIGH Z tCWH tCCH Note: The timing diagram is drawn with CP = 0. The TC72 also functions with CP = 1; however, the edges of SCK are reversed as defined in Table 3-3 and Figure 3-2. SPI WRITE DATA TRANSFER MSb LSb MSb LSb MSb LSb MSb LSb

DS21743A-page 6  2002 Microchip Technology Inc.

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, all parameters apply at V DD = 2.65V to 5.5V, TA = -55°C to +125°C. FIGURE 2-1: Accuracy vs. Temperature (TC72-X.XMXX). FIGURE 2-2: Supply Current vs. Supply Voltage. FIGURE 2-3: Supply Current vs. Temperature. FIGURE 2-4: Shutdown Current vs. Temperature. FIGURE 2-5: Temperature Accuracy vs. Supply Voltage (TC72-2.8MXX). FIGURE 2-6: Temperature Accuracy vs. Supply Voltage (TC72-5.0MXX). Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -3.5 -2.5 -1.5 -0.5 0.5 1.5 2.5 3.5 -55 -25 5 35 65 95 125 Reference Temperature (°C) Temperature Error (°C)Lower Specification Limit Upper Specification Limit Mean + 3V Mean - 3V Mean 200 210 220 230 240 250 260 Supply Voltage (V) Supply Current (µA) TA = +25°C TA = +125°C TA = -55°C TC72-X.XMXX 100 150 200 250 300 350 400 - 5 5 - 2 5 5 3 56 59 5 1 2 5 Temperature (°C) Supply Current (uA) TC72-5.0MXX VDD = 5.0V TC72-3.3MXX V DD = 3.3V TC72-2.8MXX V DD = 2.8V 0.00 0.05 0.10 0.15 0.20 -55 -25 5 35 65 95 125 Temperature (°C) Shutdown Current (µA) TC72-5.0MXX VDD = 5.0V TC72-5.0MXX V DD = 2.8V TC72-3.3MXX V DD = 3.3V -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 Supply Voltage (V) Temperature Change (°C) TA = +25°C TA = -25°C TA = +85°C TC72-2.8MXX -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 Supply Voltage (V) Temperature Change (°C)TA = +25°C TA = -25°C TA = +85°C TC72-5.0MXX

DS21743A-page 8  2002 Microchip Technology Inc.

3.0 FUNCTIONAL DESCRIPTION

The TC72 consists of a band-gap type temperature sensor, a 10-bit Sigma Delta Analog-to-Digital Con- verter (ADC), an internal conversion oscillator and a double buffer digital output port. The 10-bit ADC is scaled from -128°C to +127°C; therefore, the resolution is 0.25°C per bit. The ambient temperature operating range of the TC72 is specified from -55°C to +125°C. This device features a four-wire serial interface that is fully compatible with the SPI specification and, there- fore, allows simple communications with common microcontrollers and processors. The TC72 can be used either in a Continuous Temperature Conversion mode or a One-Shot Conversion mode. The TC72 tem- perature measurements are performed in the back- ground and, therefore, reading the temperature via the serial I/O lines does not affect the measurement in progress. The Continuous Conversion mode measures the tem- perature approximately every 150 ms and stores the data in the temperature registers. The TC72 has an internal clock generator that controls the automatic temperature conversion sequence. The automatic tem- perature sampling operation is repeated indefinitely until the TC72 is placed in a shutdown mode by a write operation to the Control register. The TC72 will remain in the shutdown mode until the shutdown bit in the Control register is reset. In contrast, the One-Shot mode performs a single tem- perature measurement and returns to the power-sav- ing shut down mode. This mode is especially useful for low power applications. FIGURE 3-1: Temperature-To-Digital Transfer Function (Non-linear Scale). TempTe mp Output Code +125°C-55°C +25°C -25°C +0.25°C -0.125°C 0111 1101 / 0000 0000 MSB LSB Note: The ADC converter is scaled from -128°C to -127°C, but the operating range of the TC72 is specified from -55°C to +125°C. 0001 1001 / 0000 0000 MSB LSB 0000 0000 / 0100 0000 MSB LSB 0000 0000 / 0000 0000 MSB LSB 1111 1111 / 1100 0000 MSB LSB 1110 0111 / 0000 0000 MSB LSB 1100 1001 / 0000 0000 MSB LSB 0°C

 2002 Microchip Technology Inc. DS21743A-page 9 TC72

3.1 Temperature Data Format

Temperature data is represented by a 10-bit two’s com- plement word with a resolution of 0.25°C per bit. The temperature data is stored in the Temperature registers in a two’s complement format. The ADC converter is scaled from -128°C to +127°C, but the operating range of the TC72 is specified from -55°C to +125°C. Example: Temperature = 41.5°C MSB Temperature Register= 00101001b 5 + 23 + 20 = 32 + 8 + 1 = 41 LSB Temperature Register = 10000000b = 2-1 = 0.5 TABLE 3-1: TC72 TEMPERATURE OUTPUT DATA TABLE 3-2: TEMPERATURE REGISTER

3.2 Power-Up And Power-Down

The TC72 is in the low power consumption shutdown mode at power-up. The Continuous Temperature Con- version mode is selected by performing a Write opera- tion to the Control register, as described in Section 4.0, “Internal Register Structure”. A supply voltage lower than 1.6V (typical) is considered a power-down state for the TC72. If the supply voltage drops below the 1.6V threshold, the internal registers are reset to the power-up default state.

3.3 Serial Bus Interface

The serial interface consists of the Chip Enable (CE), Serial Clock (SCK), Serial Data Input (SDI) and Serial Data Output (SDO) signals. The TC72 operates as a slave and is compatible with the SPI bus specifications. The serial interface is designed to be compatible with the Microchip PICmicro ® family of microcontrollers. The CE input is used to select the TC72 when multiple devices are connected to the serial clock and data lines. The CE is active-high, and data is written to or read from the device, when CE is equal to a logic high voltage. The SCK input is disabled when CE is low. The rising edge of the CE line initiates a read or write oper- ation, while the falling edge of CE completes a read or write operation. The SCK input is provided by the external microcontrol- ler and is used to synchronize the data on the SDI and SDO lines. The SDI input writes data into the TC72’s Control register, while the SDO outputs the tempera- ture data from the T emperature register and the status of Shutdown bit of the Control register. The TC72 has the capability to function with either an active-high or low SCK input. The SCK inactive state is detected when the CE signal goes high, while the polarity of the clock input (CP) determines whether the data is clocked and shifted on either the rising or falling edge of the system clock, as shown in Figure 3-2. Table 3-3 gives the appropriate clock edge used to transfer data into and out of the registers. Each data bit is transferred at each clock pulse, and the data bits are clocked in groups of eight bits, as shown in Figure 3-3. The address byte is transferred first, followed by the data. A7, the MSb of the address, determines whether a read or write operation will occur. If A7 = ‘ 0’, one or more read cycles will occur; otherwise, if A7 = ‘1’, one or more write cycles will occur. Data can be transferred either in a single byte or a multi-byte packet, as shown in Figure 3-3. In the 3-byte packet, the data sequence consists of the MSb temper- ature data, LSb temperature data, followed by the Con- trol register data. The multi-byte read feature is initiated by writing the highest address of the desired packet to registers. The TC72 will automatically send the register addressed and all of the lower address registers, as long as the Chip Enable pin is held active. Temperature Binary MSB / LSB Hex +125°C 0111 1101/0000 00007D00 +25°C 0001 1001/0000 00001900 +0.5°C 0000 0000/1000 00000080 +0.25°C 0000 0000/0100 00000040 0°C 0000 0000/0000 00000000 -0.25°C 1111 1111/1100 0000FFC0 -25°C 1110 0111/0000 0000E700 -55°C 1100 1001/0000 0000C900 D7 D6 D5 D4 D3 D2 D1 D0 Address/ Register Sign 2 6 25 24 23 23 21 20 02H Te m p. MS B 2-1 2-2 000000 01H Temp. LSB

DS21743A-page 10  2002 Microchip Technology Inc. TABLE 3-3: OPERATIONAL MODES

3.4 Read Operation

The temperature and control register data is outputted from the TC72 using the CE, SCK and SDO lines. Figure 3-3 shows a timing diagram of the read opera- tion. Communication is initiated by the chip enable (CE) going high. The SDO line remains at the voltage level of the LSb bit that is outputted and goes to the tri-state level when the CE line goes to a logic low level.

3.5 Write Operation

Data is clocked into the Control register in order to enable the TC72’s power saving shutdown mode. The write operation is shown in Figure 3-3 and is accomplished using the CE, SCK and SDI line. FIGURE 3-2: Serial Clock Polarity (CP) Operation. Mode CE SCK (Note 1) SDI SDO Disable L Input Disabled Input Disabled High Z Write (A7 = 1)H C P = 1, Data Shifted on Falling Edge, Data Clocked on Rising Edge Data Bit Latch High Z CP=0, Data Shifted on Rising Edge, Data Clocked on Falling Edge Read (A7 = 0)H C P = 1, Data Shifted on Falling Edge, Data Clocked on Rising Edge X Next data bit shift, Note 2 CP=0, Data Shifted on Rising Edge, Data Clocked on Falling Edge Note 1: CP is the Clock Polarity of the microcontroller system clock. If the inactive state of SCK is logic level high, CP is equal to ‘1’; otherwise, if the inactive state of SCK is low, CP is equal to ‘0’. 2: During a Read operation, SDO remains at a high impedance (High Z) level until the eight bits of data begin to be shifted out of the T emperature register. SHIFT EDGE CLOCK EDGE SHIFT EDGE CLOCK EDGE SCK CE CE SCK CP = 0 CP = 1

 2002 Microchip Technology Inc. DS21743A-page 11 TC72 FIGURE 3-3: Serial Interface Timing Diagrams (CP=0). A 1SCK SDI SDO High Z A7=1 CE Single Byte Write Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1) 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A A A A A A A D D D D D D D D 7654321076543210 MSb LSb Single Byte Read Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0) CE A 1SCK SDI A7=0 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A A A A A A A D DSDO High Z High Z 76543210 MSb LSb SPI Multiple Byte Transfer CE SCK Write Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1) SDI Address Byte = 80hex High ZSDO Control Byte A7 A0 D7 D0 Read Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0) SDI SDO High Z High ZMSB Temp. Byte LSB T emp. Byte Address Byte = 02hex Control Byte A7 A0 D7 D0 D7 D0 D7 D0

DS21743A-page 12  2002 Microchip Technology Inc.

4.0 INTERNAL REGISTER

The TC72 registers are listed below. TABLE 4-1: REGISTERS FOR TC72

4.1 Control Register

The Control register is both a read and a write register that is used to select either the Shutdown, Continuous or One-Shot Conversion operating mode. The Temper- ature Conversion mode selection logic is shown in Table 4-2. The Shutdown (SHDN) bit is stored in bit 0 of the Control register. If SHDN is equal to ‘1’, the TC72 will go into the power-saving shutdown mode. If SHDN is equal to ‘ 0’, the TC72 will perform a temperature conversion approximately every 150 ms. At power-up, the SHDN bit is set to ‘1’. Thus, the TC72 is in the shutdown operating mode at startup. The Con- tinuous Temperature Conversion mode is selected by writing a ‘0’ to the SHDN bit of the Control register. The Shutdown mode can be used to minimize the power consumption of the TC72 when active tempera- ture monitoring is not required. The shutdown mode disables the temperature conversion circuitry; how- ever, the serial I/O communication port remains active. A temperature conversion will be initialized by a Write operation to the Control register to select either the Continuous T emperature Conversion or the One-Shot operating mode. The temperature data will be available in the MSB and LSB Temperature registers approxi- mately 150 ms after the Control register Write operation. The One-Shot mode is selected by writing a ‘1’ into bit 4 of the Control register. The One-Shot mode performs a single temperature measurement and returns to the power-saving shutdown mode. After completion of the temperature conversion, the One-Shot bit (OS) is reset to ‘0’ (i.e. “OFF”). The user must set the One-Shot bit to ‘1’ to initiate another temperature conversion. Bits 1, 3, 5, 6 and 7 of the Control register are not used by the TC72. Bit 2 is set to a logic ‘1’. Any write opera- tion to these bit locations will have no affect on the operation of the TC72.

4.2 Temperature Register

The Temperature register is a read-only register and contains a 10-bit two’s complement representation of the temperature measurement. Bit 0 through Bit 5 of the LSB Temperature register are always set to a logic ‘0’. At Power-On Reset (POR) or a Brown-Out Reset (BOR) low voltage occurrence, the temperature regis- ter is reset to all zeroes, which corresponds to a tem- perature value of 0°C. A V DD power supply less than 1.6V is considered a reset event and will reset the Temperature register to the power-up state.

4.3 Manufacturer ID Register

The Manufacturer Identification (ID) register is a read- only register used to identify the temperature sensor as a Microchip component. TABLE 4-2: CONTROL REGISTER TEMPERATURE CONVERSION MODE SELECTION Register Read Address Write Address Bit Bit Bit Bit Bit Bit Bit Bit Value on POR/BOR Control 00hex 80hex 000 One-Shot (OS)

010 Shutdown

(SHDN) 05hex LSB Temperature 01hex N/A T1 T0 0 0 000 0 00hex MSB Temperature 02hex N/A T9 T8 T7 T6 T5 T4 T3 T2 00hex Manufacturer ID 03hex N/A 010 1 0 1 0 0 54hex Operational Mode One-Shot (OS) Bit 4 Shutdown (SHDN) Bit 0 Continuous T emperature Conversion 00 Shutdown 01 Continuous T emperature Conversion (One-Shot Command is ignored if SHDN = ‘0’) One-Shot 11

 2002 Microchip Technology Inc. DS21743A-page 13 TC72

5.0 APPLICATIONS INFORMATION

The TC72 does not require any additional components in order to measure temperature; however, it is recom- mended that a decoupling capacitor of 0.1mF to 1mF be provided between the V DD and GND pins. Although the current consumption of the TC72 is modest (250 mA, typical), the TC72 contains an on chip data acquisition with internal digital switching circuitry. Thus, it is considered good design practice to use an external decoupling capacitor with the sensor. A high frequency ceramic capacitor should be used and be located as close as possible to the IC power pins in order to provide effective noise protection to the TC72. The TC72 measures temperature by monitoring the voltage of a diode located on the IC die. The IC pins of the TC72 provide a low impedance thermal path between the die and the PCB, allowing the TC72 to effectively monitor the temperature of the PCB board. The thermal path between the ambient air is not as effi- cient because the plastic IC housing package functions as a thermal insulator. Thus the ambient air tempera- ture (assuming that a large temperature gradient exists between the air and PCB) has only a small effect on the temperature measured by the TC72. Note that the exposed metal center pad on the bottom of the DFN package is connected to the silicon sub- strate. The center pad should be connected to either the PCB ground plane or treated as a “No Connect” pin. The mechanical dimensions of the center pad are given in Section 6.0, “Packaging Information”, of this datasheet. A potential for self-heating errors can exist if the TC72 SPI communication lines are heavily loaded. Typically, the self-heating error is negligible because of the rela- tively small current consumption of the TC72. A tem- perature accuracy error of approximately 0.5°C will result from self-heating if the SPI communication pins sink/source the maximum current specified for the TC72. Thus to maximize the temperature accuracy, the output loading of the SPI signals should be minimized.

DS21743A-page 14  2002 Microchip Technology Inc.

6.0 PACKAGING INFORMATION

6.1 Taping Form

Tape and Reel information for the 8-Lead DFN package will be available TBD. PIN 1 PIN 1 Component Taping Orientation for 8-Pin MSOP Devices User Direction of FeedUser Direction of Feed Standard Reel Component Orientation for TR Suffix Device Reverse Reel Component Orientation for RT Suffix Device W P Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin MSOP 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size

 2002 Microchip Technology Inc. DS21743A-page 15 TC72

6.2 Package Marking Information

Legend: XX...X Customer specific information* YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. 8-Lead DFN Example: XXXXXXXX MYWW NNN 7228 8221 067 8-Lead MSOP Example: XXXXXX YWWNNN TC722M 221067

DS21743A-page 16  2002 Microchip Technology Inc. 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) p A D L c Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not .037.035FFootprint (Reference) exceed .010" (0.254mm) per side. Notes: Drawing No. C04-111 *Controlling Parameter Mold Draft Angle Top Mold Draft Angle Bottom Foot Angle Lead Width Lead Thickness β α c B φ .004 .010 .006 .012 (F) β Dimension Limits Overall Height Molded Package Thickness Molded Package Width Overall Length Foot Length Standoff § Overall Width Number of Pins Pitch A L D E .016 .114 .114 .022 .118 .118 .002 .030 .193 .034 MIN p n Units .026 NOM INCHES 1.000.950.90.039 0.15 0.30 .008 .016 0.10 0.25 0.20 0.40 MILLIMETERS* 0.65 0.86 3.00 3.00 0.55 4.90 .044 .122 .028 .122 .038 .006 0.40 2.90 2.90 0.05 0.76 MINMAX NOM 1.18 0.70 3.10 3.10 0.15 0.97 MAX α E B n 1 φ § Significant Characteristic

 2002 Microchip Technology Inc. DS21743A-page 17 TC72 8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN) D Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not Exposed Pad Width Exposed Pad Length Lead Length *Controlling Parameter Lead Width Drawing No. C04-062 Notes: Exposed pad dimensions vary with paddle size. exceed .010" (0.254mm) per side. Overall Width L b D .019.012 .007 .047 .055 .010 .118 BSC Number of Pins Standoff Lead Thickness Overall Length Overall Height Pitch A p n Units A E Dimension Limits .000 .001 .008 REF. .118 BSC .031 .026 BSC MIN INCHES NOM TOP VIEW EXPOSED METAL PAD 0.48 0.26

3.00 BSC

0.30.022 .069 .015 .096 0.23 1.20 1.39 0.55 0.37 1.75 2.45 0.02 0.80 0.20 REF.

0.65 BSC

MILLIMETERS* .002 .039 0.00 MINMAX NOM 0.05 1.00 MAX BOTTOM VIEW 2 1 ID INDEX PIN 1 E L p b n Package may have one or more exposed tie bars at ends.1. AREA Pin 1 visual index feature may vary, but must be located within the hatched area.2. (NOTE 2) TIE BAR (NOTE 1) EXPOSED 0.90.035 (Note 4) (Note 4) 5. JEDEC equivalent: Pending

DS21743A-page 18  2002 Microchip Technology Inc. 8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN) H Exposed Pad Length Thermal Via Diameter *Controlling Parameter Termal Via Pitch Drawing No. C04-2062 Exposed Pad Width H V .012 .130 .047 Terminal Land Pattern I.D. Terminal Land Width Terminal Land Length Terminal Land Pattern O.D. Terminal Pitch p Units Z Y X Dimension Limits .057 .134 .026 BSC MIN INCHES NOM 0.30 1.20 3.30 3.40 MILLIMETERS* .060 .157 1.45 MINMAX NOM 1.53 4.00 MAX Y pX CPZ G THERMAL VIAS ON 4 LAYER PC BOARD DFN LAND PATTERN OPTIONAL TWO LAYER PCB LAND PATTERN PCB LAND PATTERN OPTIONAL FOUR LAYER 0.420.35.014 .017 .033 .035 0.85 0.88 1.501.45.059.057 Exposed Pad Clearance .006 CP 0.15 (Note 1) Exposed pad dimensions vary with paddle size.1. Notes: Interior Lead Clearance Z .071 1.80 Optional Exposed Pad Length .130 H2 3.30 TYPCAL SOLDER MASKS Minimum Solder Mask Clearance M .002 0.05 M (TYP)

 2002 Microchip Technology Inc. DS21734A-page19 TC72 SYSTEMS INFORMATION AND UPGRADE HOT LINE The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive the most current upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. T o view the site, the user must have access to the Internet and a web browser, such as Netscape ® or Microsoft ® Internet Explorer. Files are also available for FTP download from our FTP site. Connecting to the Microchip Internet Web Site The Microchip web site is available at the following URL: www.microchip.com The file transfer site is available by using an FTP ser- vice to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development T ools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A vari- ety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is:

• Latest Microchip Press Releases
• T echnical Support Section with Frequently Asked Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to Microchip Products
• Conferences for products, Development Systems, technical information and more
• Listing of seminars and events 092002

DS21734A-page20  2002 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod- uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? To : T echnical Publications Manager RE: Reader Response From: Name Company Address City / State / ZIP / Country Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: DS21734ATC72

 2002 Microchip Technology Inc. DS21743A-page21 TC72 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. T o determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. PART NO. -X.X XX PackageVoltage Range Device Device: TC72: Digital Temperature Sensor w/SPI Interface Voltage Range: 2.8 = Accuracy Optimized for 2.8V 3.3 = Accuracy Optimized for 3.3V 5.0 = Accuracy Optimized for 5.0V Temperature Range: M = -55°C to +125°C Package: MF = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead MFTR = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead UATR = Plastic Micro Small Outline (MSOP), 8-lead (Tape and Reel) Examples: a) TC72-2.8MUA: Digital Temperature Sensor, 2.8V, 8LD MSOP package. b) TC72-2.8MUATR: Digital Temperature Sen- sor, 2.8V, 8LD MSOP (tape and reel) package. c) TC72-2.8MMF: Digital Temperature Sensor, 2.8V, 8LD DFN package. d) TC72-3.3MUA: Digital Temperature Sensor, 3.3V, 8LD MSOP package. e) TC72-3.3MMF: Digital Temperature Sensor, 3.3V, 8LD DFN package. f) TC72-5.0MUA: Digital Temperature Sensor, 5.0V, 8LD MSOP package. g) TC72-5.0MMF: Digital Temperature Sensor, 5.0V, 8LD DFN package. h) TC72-5.0MMFTR: Digital Temperature Sen- sor, 5.0V, 8LD DFN (tape and reel) package. X Temperature Range

DS21743A-page 22  2002 Microchip Technology Inc. NOTES:

 2002 Microchip Technology Inc. DS21743A - page 23 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, K EELOQ, MPLAB, PIC, PICmicro, PICSTART and PRO MATE are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, micro ID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and T otal Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.

DS21743A-page 24  2002 Microchip Technology Inc. M AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com Rocky Mountain 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338 Atlanta

500 Sugar Mill Road, Suite 200B

Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Boston

2 Lan Drive, Suite 120

Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 Chicago

333 Pierce Road, Suite 180

Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas

4570 Westgrove Drive, Suite 160

Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 Detroit Tri-Atria Office Building

32255 Northwestern Highway, Suite 190

Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles

18201 Von Karman, Suite 1090

Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 New York

150 Motor Parkway, Suite 202

Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 San Jose Microchip Technology Inc.

2107 North First Street, Suite 590

San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Toronto

6285 Northam Drive, Suite 108

Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan T ai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 China - Hong Kong SAR Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza

223 Hing Fong Road

Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India Microchip Technology Inc. India Liaison Office Divyasree Chambers

1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd.

200 Middle Road

#07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE Austria Microchip Technology Austria GmbH Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 France Microchip Technology SARL Parc d’Activite du Moulin de Massy

43 Rue du Saule Trapu

91300 Massy, France

D-85737 Ismaning, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1

20041 Agrate Brianza

Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Microchip Ltd.

505 Eskdale Road

Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 08/01/02 WORLDWIDE SALES AND SERVICE