TC622 MICROCHIP | Alldatasheet
Document overview
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Technical content
Features
- T emperature Set Point Easily Programs with a Single External Resistor Operates with 2.7V Power Supply (TC624) TO-220 Package for Direct Mounting to Heatsink (TC622XAT) or Standard 8-Pin PDIP and SOIC
Applications
Power Supply Over-Temperature Detection Consumer Electronics Fire/ Heat Detection UPSs, Amplifiers, Motors CPU Thermal Management in PCs General Description The TC622 and TC624 are programmable solid-state temperature sensors designed to replace mechanical switches in sensing and control applications. Both devices integrate the temperature sensor with a voltage reference and all required detector circuitry. The desired temperature set point is set by the user with a single external resistor. Ambient temperature is sensed and compared to the programmed set point. The OUT and OUT outputs are driven to their active state when the measured temperature exceeds the programmed set point. The TC622 has a power supply voltage range of 4.5V to 18.0V while the TC624 operates over a power supply range of 2.7V to 4.5V. Both devices are usable over a temperature range of -40°C to +125°C (TC622VXX, TC624VXX). Both devices feature low supply current making them suitable for portable applications. Eight-pin through-hole and surface mount packages are available. The TC622 is also offered in a 5-pin TO-220 package. The TC622 and TC624 are single point temperature detectors ideal for use in a wide variety of applications. Device Selection Table Part Number Voltage Operation Package Ambient Temperature TC622COA 4.5V to 18V 8-Pin SOIC 0°C to +70°C TC622CPA 4.5V to 18V 8-Pin PDIP 0°C to +70°C TC622EAT 4.5V to 18V 5-PinTO-220 -40°C to +85°C TC622EOA 4.5V to 18V 8-Pin SOIC -40°C to +85°C TC622EPA 4.5V to 18V 8-Pin PDIP -40°C to +85°C TC622VAT 4.5V to 18V 5-Pin TO-220 -40°C to +125°C TC622VOA 4.5V to 18V 8-Pin SOIC -40°C to +125°C TC622VPA 4.5V to 18V 8-Pin PDIP -40°C to +125°C TC624COA 2.7V to 4.5V 8-Pin SOIC 0°C to +70°C TC624CPA 2.7V to 4.5V 8-Pin PDIP 0°C to +70°C TC624EOA 2.7V to 4.5V 8-PinSOIC -40°C to +85°C TC624EPA 2.7V to 4.5V 8-Pin PDIP -40°C to +85°C TC624VOA 2.7V to 4.5V 8-Pin SOIC -40°C to +125°C TC624VPA 2.7V to 4.5V 8-PinPDIP -40°C to +125° Low Cost Single Trip Point Temperature Sensor
DS21440B-page 2 2002 Microchip Technology Inc. Package Type Functional Block Diagram GND NC OUT OUT NC NC VDDVDD GND NC TSET TSET NC OUT OUT NC GND NC OUT OUT NC NC VDD TSET GND NC OUT OUT NC NC VDD TSET VDD TSET OUT OUT GND 12345 TC622EAT TC622VAT 1 8 2 7 3 6 4 5 1 8 2 7 3 6 4 5 TC622CPA TC622EPA TC622VPA TC624CPA TC624EPA TC624VPA TC622COA TC622EOA TC622VOA TC624COA TC624EOA TC624VOA PDIP SOT-220SOIC Note: For TO-220 Package, Pin 3 is connected to case heatsink. TC622 RSET +9V TSET GND VDD OUT NC OUT NC NC Microcontrollers ALARM Horn Battery TC624
2002 Microchip Technology Inc. DS21440B-page 3 TC622/TC624
1.0 ELECTRICAL
Absolute Maximum Ratings* Input Voltage Any Input.. (GND – 0.3V) to (V DD +0.3V) Stresses above those listed under "Absolute Maximum Rat- ings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Expo- sure to Absolute Maximum Rating conditions for extended periods may affect device reliability TC622/TC624 ELECTRICAL SPECIFICATIONS Electrical Characteristics: Over operating temperature range, unless otherwise specified. Symbol Parameter Device Min Typ Max Unit Test Conditions VDD Supply Voltage Range TC622 TC624 4.5 2.7 4.5 V IDD Supply Current TC622 TC624 200 170 600 300 µA5 . 0 V ≤ VDD ≤ 18V 2.7V ≤ VDD ≤ 4.5V VOH Output Voltage (High) TC622 0.90 x V DD 0.80 x VDD IOH =2 5 0µA IOH =5 0 0µA VOL Output Voltage (Low) TC622 — 0.15 x V DD 0.30 x VDD 0.35 x VDD V- 4 0 ° C ≤ TA ≤ +85°C, IOL =5 0 0µA IOL =1 m A -40°C ≤ TA ≤ +125°C, IOL =1 m A VOH Output Voltage (High) TC624 — 0.90 x VDD 0.80 x VDD V 2.7V ≤ VDD ≤ 4.5V -40°C ≤ TA ≤ +125°C, IOH =2 5 0µA IOH =5 0 0µA VOL Output Voltage (Low) TC624 — 0.1 x V DD 0.2 x VDD 0.25 x VDD V- 4 0 ° C ≤ TA ≤ +85°C, IOL =5 0 0µA IOL =1 m A -40°C ≤ TA ≤ +125°C, IOL =1 m A TC624 T-5 T-5 T±1 T±1 T+5 T+5 °C T SET = Programmed Temperature TSET = Programmed Temperature OUT Trip Point Hysteresis TC622 TC624
DS21440B-page 4 2002 Microchip Technology Inc.
2.0 PIN DESCRIPTION
T h ed e s c r i p t i o n so ft h ep i n sa r el i s t e di nT a b l e2 - 1 . TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin SOIC) (8-Pin PDIP) Symbol Description 1 NC No Internal Connection. 2O U T Active low output. 3 OUT Active high output. 4 GND Ground T erminal. SET Temperature set point. Connect an external 1% resistor from TSET to VCC to set trip point. 6 NC No Internal Connection. 7V DD Power supply input. 8 NC No Internal Connection. Pin No. (5-Pin SOT-220) Symbol Description 1O U T Active low output. 2 OUT Active high output. 3V DD Power supply input. 4 GND Ground T erminal. SET Temperature set point. Connect an external 1% resistor from TSET to VCC to set trip point.
2002 Microchip Technology Inc. DS21440B-page 5 TC622/TC624
3.0 DETAILED DESCRIPTION
3.1 Trip Point Programming
When the temperature of the device exceeds the pro- grammed temperature trip point, T SET,t h eO U Ta n d OUT outputs are driven into their active states. The desired trip point temperature is programmed with a single external resistor connected between the T SET input and V CC. The relationship between the resistor value and the trip point temperature is given by Equation 3-1. EQUATION 3-1: For example, as shown in Figure 3-1, to program the device to trip at 50°C, the programming resistor is: FIGURE 3-1: PROGRAMMING RESISTOR VALUES VS. TEMPERATURE
3.2 Hysteresis
To prevent output “chattering” at the trip point tempera- ture, the temperature detector in the TC622/TC624 has 2°C hysteresis (see Figure 3-2). The outputs are driven active when the temperature crosses the set point determined by the external resistor. As temperature declines below the set point, the hysteresis action will hold the outputs true until the temperature drops 2°C below the threshold. FIGURE 3-2: TC622/TC624 HYSTERESIS RTRIP = 0.5997 x T 2.1312 Where: RTRIP = Programming resistor value in Ohms T = Desired trip temperature in degrees Kelvin. RTRIP = 0.5997 x ((50 + 273.15)2.1312) = 133.65kΩ TEMPERATURE (˚C) RESISTANCE, RTRIP (kΩ) -55 -35 -15 5 25 45 65 85 105 125 100 150 200 250 Set Point Temperature OUT (Set Point – 2 Degrees C) OUT
DS21440B-page 6 2002 Microchip Technology Inc.
4.0 TYPICAL APPLICATIONS
4.1 Over-Temperature Shutdown
T h eT C 6 2 2c a nb eu s e dt oc r e a t eas i m p l eo v e r - t e m - perature shutdown circuit. In this circuit, temperature is sensed within the system enclosure (internal system ambient) or at the heatsink itself. When measured temperature exceeds a preset limit, a fault is indicated and the system shuts down. Figure 4-1 illustrates an over-temperature shutdown circuit using the TC622 sensor in a single TO-220 package, allowing direct attachment to the heatsink surface. As shown, the TC622 outputs are driven active when the heatsink temperature equals the trip point temperature set by R TRIP. When this happens, the crowbar circuit is activated, causing the supply output to fold back to zero. The TC622 outputs remain active until the heatsink temperature falls a minimum of 2°C (built-in hysteresis) below the trip point temperature, at which time the device again allows normal supply operation.
4.2 Cooling and Heating Applications
The TC622/TC624 can be used to control a DC fan as shown in Figure 4-2. The fan turns on when the sensed temperature rises above T SET and remains on until the temperature falls below T SET -2 ° C . Figure 4-3 shows the TC622 acting as a heater thermostat. Circuit operation is identical to that of the cooling fan application. FIGURE 4-1: TC622 POWER SUPPLY OVER-TEMPERATURE SHUTDOWN Heatsink Circuit Board TC622 Heatsink Mounting TC622 TC622 RTRIP VCC Output Device Heatsink Surface Power Good Signal OVERTEMP Crowbar Circuit TSET GND VDD VOUT OUT OUT Output Device
DS21440B-page 8 2002 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Package marking data not available at this time.
5.2 Taping Form
5.3 Package Dimensions
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size Standard Reel Component Orientation for TR Suffix Device PIN 1 User Direction of Feed P W 3° MIN. PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm)
2002 Microchip Technology Inc. DS21440B-page 9 TC622/TC624
5.4 Package Dimensions (Continued)
.050 (1.27) TYP. 8° MAX. PIN 1 .244 (6.20) .228 (5.79) .157 (3.99) .150 (3.81) .197 (5.00) .189 (4.80) .020 (0.51) .013 (0.33) .010 (0.25) .004 (0.10) .069 (1.75) .007 (0.18) .050 (1.27) .016 (0.40) 8-Pin SOIC Dimensions: inches (mm) 5-Pin TO-220 .273 (6.93) .263 (6.68) .037 (0.95) .025 (0.64) .117 (2.97) .103 (2.62) .415 (10.54) .390 (9.91) .156 (3.96) .140 (3.56) DIA. .293 (7.44) .204 (5.18) .590 (14.99) .482 (12.24) .072 (1.83) .062 (1.57) PIN 1 .185 (4.70) .165 (4.19) .055 (1.40) .045 (1.14) .613 (15.57) .569 (14.45) .115 (2.92) .087 (2.21) .025 (0.64) .012 (0.30) 3° - 7.5° 5 PLCS. Dimensions: inches (mm)
DS21440B-page 10 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21440B-page 9 TC622/TC624 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. T o determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21440B-page 10 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21440B-page 11 TC622/TC624 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip T echnology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, K EELOQ,m i c r o I D ,M P L A B ,P I C ,P I C m i c r o ,P I C M A S T E R , PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Tech- nology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
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