TC56 MICROCHIP | Alldatasheet
Document overview
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Technical content
Features
- Low Dropout Voltage: 200mV typ. at 80mA, 380mV typ. at 160mA High Output Current: 180mA (V OUT = 5.0V) High Accuracy Output Voltage (±2%) Low Power Consumption: 11 µA (Oper.), 0.1µA (Shutdown) Low Temperature Drift (±100ppm/°C typ.) Excellent Line Regulation (0.2%/V typ.) Space Saving 5-Pin SOT-23A Package Short Circuit Protection Standard 2.5V, 3.0V and 3.3V Output Voltages
Applications
Battery Powered Devices Cameras and Portable Video Equipment Pagers and Cellular Phones Solar Powered Instruments Consumer Products Device Selection Table *Other output voltages are available. Please contact Microchip Technology Inc. for details. Package Type General Description The TC56 is a low supply current (11 µA typical at VOUT = 3V), low dropout CMOS linear regulator, with a 10V maximum input voltage range. CMOS construction eliminates wasted ground current, typical of bipolar regulators, for greater system efficiencies and longer operating time in battery-powered systems. The TC56 enters shutdown mode when the shutdown control input (SHDN ) is low. During shutdown, the regulator is shut off, and supply current falls to 0.1 µA maximum. Normal operation is restored when SHDN is returned to a logic high. Low current consumption, 10V supply tolerance and space-saving 5-Pin SOT-23A packaging makes the TC56 ideal for a wide variety of applications. Functional Block Diagram Part Number Output Voltage (V)* Package Temperature Range TC562502ECT 2.5 5-Pin SOT-23A -40°C to +85°C TC563002ECT 3.0 5-Pin SOT-23A -40 °C to +85°C TC563302ECT 3.3 5-Pin SOT-23A -40 °C to +85°C VOUT VSS SHDN 5-Pin SOT-23A TC56 NC VIN TC56 5 4 1 2 3 10µF Tantalum VOUT (NC) VSS VIN SHDN VOUT ON OFF Shutdown Control 4.7µF Tantalum VIN 150mA, 10V LDO with Shutdown
DS21436B-page 2 2002 Microchip Technology Inc.
1.0 ELECTRICAL
Absolute Maximum Ratings* *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC56 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT +1V, TA = 25°C, CIN = 4.7µF, COUT = 10µF, unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions VIN Input Voltage —— 10 V VOUT Output Voltage 0.98 x V R VR ±0.5% 1.02 x V R VI OUT = 40mA (Note 1) IOUTMAX Maximum Output Current 150 180 mA V R ≥ 2.7V, VOUT = 3V (Note 1) VR ≥ 4.5V, VOUT = 5V (Note 1) ∆VOUT Load Regulation — mV 1mA ≤ IOUT ≤ 80mA, VOUT = 3V 1mA ≤ IOUT ≤ 80mA, VOUT = 5V VIN - VOUT Dropout Voltage — 200 380 165 330 395 770 330 660 mV I OUT = 80mA, VOUT = 3V IOUT = 160mA, VOUT = 3V IOUT = 100mA, VOUT = 5V IOUT = 200mA, VOUT = 5V (Note 2) IDD Supply Current — µAV SHDN = VIN = 4V VSHDN = VIN = 6V ISHDN Shutdown Supply Current —— 0.1 µAV SHDN = GND ∆VOUT/∆VIN Line Regulation — 0.2 0.3 %/V I OUT = 40mA, 4V ≤ VIN ≤ 10V ∆VOUT/∆TV OUT Temperature Coefficient — ±100 — ppm/°CI OUT = 10mA, -40°C < TJ < +85°C VIH SHDN Input High Logic Threshold 1.5 —— V VIL SHDN Input Low Logic Threshold —— 0.25 V IIH SHDN Input Current @VIH —— 5.0 µAV SHDN = VIN IIL SHDN Input Current @VIL -0.2 -0.05 0 µAV SHDN = GND Note 1: VR is the regulator output voltage setting. 2: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value mea sured at a 1V differential.
2002 Microchip Technology Inc. DS21436B-page 3 TC56
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE
3.0 DETAILED DESCRIPTION
The TC56 is a precision, fixed output LDO. Unlike bipolar regulations, the TC56 supply current does not increase with load current.
3.1 Output Capacitor
A 10 µF tantalum capacitor from V OUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1 Ω and less than 5.0Ω, and a resonant frequency above 1MHz. It is recommended that a 4.7 µF capacitor be connected from V IN to GND. When operating from sources other than batteries, supply noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
3.2 Shutdown Input
The TC56 enters a low power shutdown mode when the shutdown control input (SHDN ) is low. During shutdown, the regulator is disabled and supply current is reduced to 0.1 µA (max). Normal operation is restored when SHDN is driven high. If not required, the SHDN input can be tied to VIN. Pin No. (5-Pin SOT-23A) Symbol Description 1V SS Ground. 2V IN Supply voltage input. 3S H D N Shutdown input. 4 (NC) No connection. 5V OUT Regulated voltage output.
DS21436B-page 4 2002 Microchip Technology Inc.
4.0 THERMAL CONSIDERATIONS
4.1 Power Dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation. EQUATION 4-1: The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (T AMAX), the maximum allowable die temperature (T JMAX) and the thermal resistance from junction-to-air (θJA). The 5-Pin SOT-23A package has a θJA of approximately 220°C/Watt. EQUATION 4-2: Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX =3 . 0 V ± 1 0 % VOUTMIN =2 . 7 V – 2% ILOADMAX = 98mA TJMAX = 125 °C TAMAX =5 5 °C Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: P D ≈ (VINMAX – VOUTMIN)ILOADMAX =6 4 m W Maximum allowable power dissipation: In this example, the TC56 dissipates a maximum of 64mW; below the allowable limit of 318mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits.
4.2 Layout Considerations
The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θ JA and therefore, increase the maximum allowable power dissipation limit. Where: PD ≈ (VINMAX – VOUTMIN)ILOADMAX PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Minimum regulator output voltage = Maximum output (load) current = Maximum voltage on VIN PDMAX = (TJMAX – TAMAX) θJA Where all terms are previously defined. PDMAX = (TJMAX – TAMAX) θJA = (125 – 55) 220 = 318mW
2002 Microchip Technology Inc. DS21436B-page 5 TC56
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0 20 40 60 100 140 OUTPUT CURRENT IOUT (mA) 0 40 80 120 140 180 OUTPUT CURRENT IOUT (mA) OUTPUT VOLTAGE VOUT (V) TC563002 (3V) 5.1 OUTPUT VOLTAGE VOUT (V) TC565002 (5V) 4.7 4.8 4.9 5.0 20 60 100 160 TOOPR = 25°C 80°C-30°C VIN = 6V CIN = 4.7µF, CL = 10µF (Tantalum) 2.7 2.8 2.9 3.0 3.1 80 120 160 180 TOPR = 25°CC -30°C 80°CC 1. OUTPUT VOLTAGE vs. OUTPUT CURRENT VIN = 4V CIN = 4.7µF, CL = 10µ 2.5 3.0 3.5 OUTPUT VOLTAGE VOUT (V) TC563002 (3V) OUTPUT VOLTAGE VOUT (V) 5 6 7 10 INPUT VOLTAGE VIN (V) TC565002 (5V) 4.8 4.6 4.4 4.2 4.5 5.5 INPUT VOLTAGE VIN (V) INPUT VOLTAGE VIN (V)INPUT VOLTAGE VIN (V) TC565002 (5V) 5.0 5.2 OUTPUT VOLTAGE VOUT (V) 3.05 2.85 3 5 7 10 OUTPUT VOLTAGE VOUT (V) TC563002 (3V) 2.95 3.10 5 8 9 4.85 4.90 4.95 5.00 5.05 5.10 40mA 2.2 2.4 2.6 2.8 3.0 3.2 3.00 2.90 4 6 8 9 40mA IOUT AA= 1mA 10mA 10mA 40mA IOUT = 1mA IOUT AA= 1mA IOUT mA = 1mA, 10m 2. OUTPUT VOLTAGE vs. INPUT VOLTAGE 40mA TOPR = 25°C CIN = 4.7µF, CL = 10µF (Tantalum) TOPR = 25°C CIN = 4.7µF, CL µ TOPR = 25°C CIN = 4.7µF, CL µ TOPR = 25°C CIN = 4.7µF, CL = 10µ
DS21436B-page 6 2002 Microchip Technology Inc.
5.0 TYPICAL CHARACTERISTICS (CONTINUED)
OUTPUT CURRENT IOUT (mA) 0 40 80 120 140 180 OUTPUT CURRENT IOUT (mA) INPUT/OUTPUT DIFF. VDIF (V) INPUT/OUTPUT DIFF. VDIF (V) 0.0 0.2 0.4 0.8 20 60 100 160 TTOPR = 25°C 80°C -30°C 0.0 0.2 0.4 0.6 1.0 80 120 160 180 TTOPR = 25°C -30°C 880°C 0.6 0.8 3. INPUT/OUTPUT VOLTAGE DIFFERENTIAL vs. OUTPUT CURRENT 1.0 CIN = 4.7µF, CL = 10µF (Tantalum) CIN = 4.7µF, CL = 10µF (Tantalum) SHDN PIN THRE. VOL. VIH, VIL (V) 0 2 4 10 INPUT VOLTAGE VIN (V) TC563002 (3V) 0.5 0.4 0.3 0.2 0 10 INPUT VOLTAGE VIN (V) TC565002 (5V) 0.6 0.7 SHDN PIN THRE. VOL.VIH, VIL (V) 6 8 0.2 0.3 0.4 0.5 0.6 0.7 2 4 6 8 80°C 25°C ""L" Level Voltage TOOPR = 30°C """H" Level Voltage TOOPR = 30°C 25°C 80°C 4. SHDN PIN THRESHOLD VOLTAGE vs. INPUT VOLTAGE "L" Level Voltage """H" Level Voltage 0 4 8 10 SUPPLY CURRENT IDD (µA) TC565002 (5V) 5 6 7 10 SUPPLY CURRENT IDD (µA) TC565002 (5V) 5.0 8 9 TOOPR = 80°CC INPUT VOLTAGE VIN (V)INPUT VOLTAGE VIN (V) 5. SUPPLY CURRENT vs. INPUT VOLTAGE TOOPR = 80°CC 25°C-30°C 25°C -30°C
2002 Microchip Technology Inc. DS21436B-page 7 TC56 SUPPLY CURRENT IDD (µA) 3 5 7 10 INPUT VOLTAGE VIN (V) TC563002 (3V) 5.0 0 10 INPUT VOLTAGE VIN (V) TC563002 (3V) SUPPLY CURRENT IDD (µA) 6 8 9 6.0 8.0 25°C 2 4 8 80°C -30°C 25°C -30°C 5. SUPPLY CURRENT vs. INPUT VOLTAGE (CONT.) 80°C -40 -20 20 AMBIENT TEMP. TOPR (°C) -40 0 40 80 AMBIENT TEMP. TOPR (°C) OUTPUT VOLTAGE VOUT (V) TC563002 (3V) 5.10 OUTPUT VOLTAGE VOUT (V) TC565002 (5V) 4.90 4.95 5.00 5.05 -20 20 60 2.90 2.95 3.00 3.05 3.10 0 40 60 80 6. OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE 40mA IOUT A = 10mA IOUT = 10mA 40mA VIN = 6V CIN = 4.7µF, CL = 10µF (Tantalum) VIN = 4V CIN = 4.7µF, CL = 10µ -40 20 80 SUPPLY CURRENT IDD (µA) TC563002 (3V) 8.0 6.0 -40 80 AMBIENT TEMP. TOPR (°C) TC565002 (5V) SUPPLY CURRENT IDD (µA) VIN = 6V 6.0 8.0 7. SUPPLY CURRENT vs. AMBIENT TEMPERATURE -20 20 40 60 AMBIENT TEMP. TOPR (°C) VIN = 4V -20 0 40 60
DS21436B-page 8 2002 Microchip Technology Inc. TC563002 (3V)TC563002 (3V) TIME: (0.1 msec/div) TC565002 (5V) INPUT VOLTAGE VIN (V) 8. INPUT TRANSIENT RESPONSE 1 TIME: (0.1 msec/div) OUT (V) INPUT VOLTAGE VIN (V) OUTPUT VOLTAGE VOUT (V)4 TIME: (0.1 msec/div) TIME: (0.1 msec/div) Input Voltage Output Voltage IN (V)IN (V) OUTPUT VOLTAGE VOUT (V)OUTPUT VOLTAGE VOUT (V) IOUT = 10mA, CL = 10µF (Tantalum) Input Voltage Output Voltage Input Voltage OOutput Voltage IOUT = 1mA, CL = 10µF (Tantalum) IOUT = 10mA, CL = 10µF (Tantalum) Input Voltage OOutput Voltage IOUT = 1mA, CL = 10µF (Tantalum) TC565002 (5V) 9. INPUT TRANSIENT RESPONSE 2 INPUT VOLTAGE VIN (V) OUTPUT VOLTAGE VOUT (V) TIME: (0.1 msec/div) TIME: (0.1 msec/div) 4.9 5.0 5.1 5.2 5.3 5.4 4.9 5.0 5.1 5.2 5.3 5.4 INPUT VOLTAGE VIN (V) OUTPUT VOLTAGE VOUT (V) Input Voltage OOutput Voltage Input Voltage OOutput Voltage IOUT = 1mA, CL = 10µF (Tantalum) IOUT = 10mA, CL = 10µF (Tantalum)
2002 Microchip Technology Inc. DS21436B-page 9 TC56 TC563002 (3V)TC563002 (3V) 9. INPUT TRANSIENT RESPONSE 2 (CONT.) INPUT VOLTAGE VIN (V) OUTPUT VOLTAGE VOUT (V) TIME (1 msec/div) TIME (1 msec/div) 3.15 3.10 3.05 2.90 3.20 3.00 2.95 IN (V) OUTPUT VOLTAGE VOUT (V)5 3.15 3.10 3.05 2.90 3.20 3.00 2.95 Input Voltage Output Voltage Input Voltage OOutput Voltage IOUT = 1mA, CL = 10µF (Tantalum) IOUT = 10mA, CL = 10µF (Tantalum) TIME (2 msec/div) OUTPUT VOLTAGE VOUT (V) 10. LOAD TRANSIENT RESPONSE OUTPUT CURRENT IOUT (mA) OUTPUT VOLTAGE VOUT (V) OUTPUT CURRENT IOUT (mA) TIME (2 msec/div) VIN = 6V, CL = 10µF (Tantalum) 3.1 3.0 2.9 2.6 3.2 2.8 2.7 VIN = 4V, CL = 10µF (Tantalum) 5.1 5.0 4.9 4.6 5.2 4.8 4.7 200 160 120 240 200 160 120 240 40mA Output Current40mA Output Current 1mA OOutput Voltage 40mA Output Current40mA Output Current 1mA OOutput Voltage TC565002 (5V) TC565002 (5V) OUTPUT VOLTAGE VOUT (V) TIME (0.1 msec/div) TIME (0.1 msec/div) OUTPUT VOLTAGE VOUT (V) VIN = 6V IOUT = 1mA, CL = 10µF (Tantalum) VIN = 6V IOUT = 10mA, CL = 10µF (Tantalum) V = 1.5V IHIH VILIL = 0.25V OOutput Voltage VILIL = 0.25V OOutput Voltage 11. SHDN PIN TRANSIENT RESPONSE
DS21436B-page 10 2002 Microchip Technology Inc. TIME: (0.1 msec/div) TC563002 (3V) OUTPUT VOLTAGE VOUT (V) TC563002 (3V) TIME: (0.1 msec/div) OUTPUT VOLTAGE VOUT (V) SHDN Pin Input VoltageHDN Pin Input Voltage OOutput Current OOutput Current 11. SHDN PIN TRANSIENT RESPONSE (CONT.) SHDN Pin Input VoltageHDN Pin Input Voltage VIN = 4V IOUT = 1mA, CL = 10µF (Tantalum) VIN = 4V IOUT = 10mA, CL = 10µF (Tantalum) VIHIH = 1.5V VIHIHIH = 1.5V VILIL = 0.25V VILIL = 0.25V TC563002 (3V)TC565002 (5V) RIPPLE REJECTION RATE RR (dB) RIPPLE FREQUENCY f (kHz) 12. RIPPLE REJECTION RATE RIPPLE FREQUENCY f (kHz) 0.01 0.1 1 10 0.01 0.1 1 10 V DC +1V p–pAC, IOUT = 40mA, L µ V = 6VDC +1V p–pAC, IOUT = 40mA, CL µ
2002 Microchip Technology Inc. DS21436B-page 11 TC56
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
6.2 Taping Form
A0 . B1 . C2 . D3 . E4 . F5 . H6 . 1 represents the integer of the output voltage Symbol Voltage Symbol Voltage A. 0F. 5 B. 1H. 6 C. 2K. 7 D. 3L. 8 E. 4M. 9 Symbol — REGULAR 2 represents the integer of the output voltage 3 represents the transition response 4 represents assembly lot code Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 5-Pin SOT-23A 8 mm 4 mm 3000 7 in Carrier Tape, Number of Components Per Reel and Reel Size User Direction of Feed Device Marking PIN 1 Standard Reel Component Orientation TR Suffix Device (Mark Right Side Up) W P
DS21436B-page 12 2002 Microchip Technology Inc.
6.3 Package Dimensions
.071 (1.80) .059 (1.50) .122 (3.10) .098 (2.50) .075 (1.90) REF. .020 (0.50) .012 (0.30) PIN 1 .037 (0.95) REF. .122 (3.10) .106 (2.70) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) .024 (0.60) .004 (0.10) .004 (0.09) SOT-23A-5 Dimensions: inches (mm)
2002 Microchip Technology Inc. DS21436B-page13 TC56 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21436B-page14 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21436B-page 15 TC56 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, K EELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Tech- nology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
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