TC520A MICROCHIP | Alldatasheet
Document overview
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Technical content
Features
- Converts TC500/TC500A/TC510/TC514 to Serial Operation Programmable Conversion Rate and Resolution for Maximum Flexibility Supports up to 17-Bits of Accuracy Plus Polarity Bit Low Power Operation: Typically 7.5m Ω 14-Pin PDIP or 16-Pin SOIC Packages Polled or Interrupt Mode Operation
Applications
Computer Peripheral Interface Portable Instruments Data Acquisition System Interface Device Selection Table Package Type General Description The TC520A serial interface adapter provides logic control for Microchip's TC500/TC500A/TC510/TC514 family of dual slope, integrating A/D converters. It directly manages TC500 converter phase control sig- nals A, B and CMPTR, thereby reducing host processor task loading and software complexity. Com- munication with the TC520A is accomplished over a 3 wire serial port. Key converter operating parameters are programmable for complete user flexibility. Data conversion is initiated when the CE input is brought low. The converted data (plus overrange and polarity bits) are held in an 18-bit shift register until read by the processor or until the next conversion is completed. Data may be clocked out of the TC520A at any time, and at any rate, the user prefers. A Data Valid (DV )o u t - put is driven active at the start of each conversion cycle, indicating the 18-bit shift register update has just been completed. This signal may be polled by the pro- cessor or can be used as data ready interrupt. The TC520A timebase can be derived from an external fre- quency source of up to 6MHz or can operate from its own external crystal. It requires a single 5V logic supply and dissipates less than 7.5mΩ. Part Number Package Temperature Range TC520ACOE 16-Pin SOIC (Wide) 0 °Ct o+ 7 0°C TC520ACPD 14-Pin PDIP 0 °Ct o+ 7 0°C B CMPTR DGND VDD A DIN OSCOUT DCLK OSCIN DOUT 11 4 21 3 31 2 41 1 51 0 TC520A CE DV LOAD READ 14-Pin PDIP 16-Pin SOIC TC520A DINB LOAD DV CE DCLKA D OUT READ N/C CMPTR DGND VDD OSCOUT OSCIN N/C Serial Interface Adapter for TC500 A/D Converter Family
DS21431B-page 2 2002 Microchip Technology Inc. Functional Block Diagram Logic Control Gate 8-Bit Counter ÷ 256 8-Bit Shift Reg. ÷4 Gate Pinout of 14-Pin Package SYSCLK A B CMPTR CE DV Gate Timeout Force Auto Zero Polarity Bit Clear Count 2VDD GND 16-Bit Counter 18-Bit Shift Register Gate Overrange Bit DCLK DOUT DIN LOAD READ OSCIN OSCOUT
2002 Microchip Technology Inc. DS21431B-page 3 TC520A
1.0 ELECTRICAL
Absolute Maximum Ratings* *Stresses above those listed under "Absolute Maximum Rat- ings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Expo- sure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC520A ELECTRICAL SPECIFICATIONS Electrical Characteristics: VDD =5 V ,FOSC =1 M H z ,TA = +25°C, unless otherwise specified. Symbol Parameters Min Typ Max Unit Test Conditions Supply VDD Operating Voltage Range 4.5 5 5.5 V IDD Supply Current — 0.8 1.5 mA Input Characteristics VIL Low Input Voltage — — 0.8 V VIH High Input Voltage 2.0 — — V IIL Input Leakage Current — — 10 µA IPD Pull-down Current (CE)— 5 — µA IPU Pull-up Current (READ,L O A D)— 5 — µA Output Characteristics (IOUT =2 5 0µA, VDD =5 V ) VOL Low Output Voltage — 0.2 0.3 V VOH High Output Voltage 3.5 4.3 — V TR,T F CL = 10pF, Rise/Fall Times — — 250 nsec Oscillator (OSCIN,O S COUT) FXTL Crystal Frequency — 1.0 4.0 MHz FOSC External Frequency (OSCIN)— — 6 . 0 M H z Timing Characteristics TRD READ Delay Time 250 — — nsec TRS Data Read Setup Time 1 — — µsec TDRS DCLK to DOUT Delay 450 — — nsec TLS LOAD Setup Time 1 — — µsec TDLS Data Load Setup Time 50 — — nsec TPWL DCLK Pulse Width Low Time 150 — — nsec TPWH DCLK Pulse Width High Time 150 — — nsec TLDL Load Default Low Time 250 — — nsec TLDS Load Default Setup Time 250 — — nsec Parameter TIZ Integrator ZERO Time — 0.5 — msec TAZI Auto zero (RESET) Time at Power-Up — 100 — msec
DS21431B-page 4 2002 Microchip Technology Inc.
2.0 PIN DESCRIPTIONS
T h ed e s c r i p t i o n so ft h ep i n sa r el i s t e di nT a b l e2 - 1 TABLE 2-1: PIN FUNCTION TABLE Pin Number 14-Pin PDIP Pin Number 16-Pin SOIC Symbol Description 11 V DD Input. +5V ±10% power supply input with respect to DGND. 2 2 DGND Input. Digital Ground. 3 3 CMPTR Input, active high or low (depending on polarity of the voltage input to A/D converter). This pin connects directly to the zero crossing comparator output (CMPTR) of the TC5XX A/D converter. A high-to-low state change on this pin causes the TC520A to terminate the de-integrate phase of conversion. 4 4 B Output, active high. The A and B outputs of the TC520A connect directly to the A and B inputs of the TC5XX A/D converter connected to the TC520A. The binary code on A, B determines the conversion phase of the TC5XX A/D converter: (A, B) = 01 places the TC5XX A/D converter into the Auto Zero phase; (A, B) =10 for Integrate phase (INT); (A, B) =11 for De-integrate phase (DINI) and (A, B) = 00 for Integrator Zero phase (IZ). Please see the TC500/TC500A/TC510/TC514 family data sheets for a complete description of these phases of operation. 5 5 A Output, active high. See pin 4 description above.
66 O S C
OUT Input. This pin connects to one side of an AT-cut crystal having a effective series resis- tance of 100Ω (typ.) and a parallel capacitance of 20pF (typ.). If an external frequency source is used to clock the TC520A, this pin must be left floating. 77 O S C IN Input. This pin connects to the other side of the crystal described in pin 6 above. The TC520A may also be clocked from an external frequency source connected to this pin. The external frequency source must be a pulse train having a duty cycle of 30% (mini- mum); rise and fall times of 15nsec and a min/max amplitude of 0 to V IH.I fa ne x t e r n a l frequency source is used, pin 6 must be left floating. A maximum operating frequency of 4MHz (crystal) or 6MHz (external clock source) is permitted. 8 N/C No connection on 16 pin package version. 9 N/C No connection on 16 pin package version. 8 10 READ Input, active low, level and negative edge triggered. A high-to-low transition on READ loads serial port output shift register with the most recent converted data. Data is loaded such that the first bit transmitted from the TC520A to the processor is the OVERRANGE bit (OVR), followed by the POLARITY bit (POL) (high = input positive; low = input negative). This is followed by a 16-bit data word (MSB first). OVR is avail- able at the D OUT as soon as READ is brought low. This bit may be used as the 17th data bit, if so desired. The DOUT pin of the serial port is enabled only when READ is held low. Otherwise, DOUT remains in a high impedance state. A serial port read access cycle is terminated at any time by bringing READ high. 91 1 D OUT Output, logic level. Serial port output pin. This pin is enabled only when READ is low (see READ pin description). 10 12 D CLK Input, positive and negative edge triggered. Serial port clock. With READ low, serial data is clocked into the TC520A at each low-to-high transition of DCLK, and clocked out of the TC520A on each high-to-low transition of D CLK.Am a x i m u ms e r i a lp o r tDCLK frequency of 3MHz is permitted. 11 13 D IN Input, logic level. Serial port input pin. The TC5XX A/D converter integration time (TINT) and Auto Zero time (TAZ) values are determined by the LOAD VALUE byte clocked into this pin. This initialization must take place at power up and can be rewritten (or modified and rewritten) at any time. The LOAD VALUE is clocked into D IN MSB first.
2002 Microchip Technology Inc. DS21431B-page 5 TC520A 12 14 LOAD Input, active low; level and edge triggered. The LOAD VALUE is clocked into the 8-bit shift register on board the TC520A while LOAD is held low. The LOAD VALUE is then transferred into the TC520A internal timebase counter (and becomes effective) when LOAD is returned high. If so desired, LOAD can be momentarily pulsed low, eliminating t h en e e dt oc l o c kaL O A DV A L U Ei n t oDIN. In this case, the current state of DIN is clocked into the TC520A timebase counter selecting either a count of 65536 (DIN = High), or count of 32768, (DIN =L o w ) . 13 15 DV Output, active low. DV is brought low any time the TC520A is in the AZ phase of con- version. This occurs when, either the TC520A initiates a normal AZ phase by setting A, B, equal to 01, or when CE is pulled high, which overrides the normal A, B sequencing a n df o r c e sa nA Zs t a t e .D Vis returned high when the TC520A exits AZ. 14 16 CE Input, active low, level triggered. Conversion will be continuously performed as long as CE remains low. Pulling CE high causes the conversion process to be halted and forces the TC520A into the AZ mode for as long as CE remains high. CE should be taken high whenever it is necessary to momentarily suspend conversion (for example: to change the address lines of an input multiplexer). CE should be pulled high only when the TC520A enters an AZ phase (i.e. when DV is low). This is necessary to avoid excessively long integrator discharge times, which could result in erroneous conver- sion. This pin should be grounded if unused. It should be left floating if a 0.01 µF RESET capacitor is connected to it (see Section 4.0, Typical Applications). TABLE 2-1: PIN FUNCTION TABLE (CONTINUED) Pin Number 14-Pin PDIP Pin Number 16-Pin SOIC Symbol Description
DS21431B-page 6 2002 Microchip Technology Inc.
3.0 DETAILED DESCRIPTION
3.1 TC520A Timing
The TC520A consists of a serial port and state machine. The state machine provides control timing to the TC5xx A/D converter connected to the TC520A as well as providing sequential timing for TC520A internal operation. All timing is derived from the frequency source at OSC IN and OSCOUT. This frequency source can be either an externally provided clock signal or external crystal. If an external clock is used, it must be connected to the OSC IN pin and OSCOUT must remain floating. If a crystal is used, it must be connected between the OSC IN and OSC OUT and be physically located as close to the OSC IN and OSC OUT pins as possible. The incoming frequency is internally divided by 4 and the resulting clock (SYSCLK) controls all timing functions.
3.2 TC5XX A/D Converter Control
The TC520A control outputs (A, B) and control input (CMPTR) connect directly to the corresponding pins of the TC5XX A/D converter. A conversion is consum- mated when A, B have been sequenced through the required 4 phases of conversion: Auto Zero (AZ), Inte- grate (INT), De-integrate (D INT) and Integrator Zero (IZ) (see Figure 4-1). The Auto Zero phase compensates for offset errors in the TC5XX A/D converter. The Integrate phase connects the voltage to be converted to the TC5XX A/D converter input, resulting in an inte- grator output dv/dt directly proportional to the magni- tude of the applied input voltage. Actual A/D conversion (counting) is initiated at the start of the DINT phase and terminates when the integrator output crosses 0V. The integrator output is then forced to 0V during the IZ phase and the converter is ready for another cycle. Please see the TC500/TC500A/TC510/TC514 data sheet for a complete description of these phases. The number of SYSCLK periods (counts) for the AZ and INT phases is determined by the LOAD VALUE. The LOAD VALUE is a single byte that must be loaded into the most significant byte of 16-bit counter on board the TC520A during initialization. The lower byte of this counter is pre-loaded to a value of 0FFH (256 10)a n d cannot be changed. The LOAD VALUE (upper 8 bits of the counter) can be programmed over a range of 0FFH to 00H (corre- sponding to a range of AZ = INT = 256 counts to 65536 counts). (See Figure 3-2). The LOAD VALUE sets the number of counts for both the AZ and INT phases and directly affects resolution and speed of conversion. The greater the number of counts allowed for AZ and INT, the greater the A/D resolution (but the slower the con- version speed). The time period required for the DINT phase is a func- tion of the amount of voltage stored on the integrator during the INT phase and the value of V REF. The DINT phase is initiated by the TC520A immediately after the INT phase and terminated when the TC5XX A/D con- verter changes the state of the CMPTR input of the TC520A, indicating a zero crossing. In general, the maximum number of counts chosen for DINT is twice that of INT (with V REF chosen at VININ(MAX)/2). Choos- ing these values guarantees a full count (maximum res- olution) during DINT when VIN =V IN(MAX). The IZ phase is initiated immediately following the DINT phase and is maintained until the CMPTR input transi- tions high. This indicates the integrator is initialized and ready for another conversion cycle. This phase typically takes 2msec.
3.3 Serial Port Control Signals
Communication to and from the TC520A is accom- plished over a 3 wire serial port. Data is clocked into DIN on the rising edge of DCLK and clocked out of DOUT on the falling edge of DCLK. READ must be low to read from the serial port and can be taken high at any time, which terminates the read cycle and releases D OUT to a high impedance state. Conversion data is shifted to the processor from D OUT in the following order: OVERRANGE (which can also be used as the 17th data bit), POLARITY, conversion data (MSB first).
2002 Microchip Technology Inc. DS21431B-page 7 TC520A
4.0 TYPICAL APPLICATIONS
4.1 TC500 Series A/D Converter
The TC500/TC500A/TC510/TC514 data sheet details the equations necessary to calculate values for integra- tion resistor (R INT) and capacitor (C INT), auto zero (CAZ) and reference capacitors (CREF) and voltage ref- erence (V REF). All equations apply when using the TC520A, except Integration time (T INT) and Auto zero time (TAZ), which are functions of the SYSCLK period (timebase frequency and LOAD VALUE). Microchip offers a ready-to-use TC5XX A/D converter design tool. The TC500 Design Spreadsheet is an Excel-based spreadsheet that calculates values for all components as well as the TC520A LOAD VALUE. It also calculates overall converter performance such as noise rejection, converter speed, etc.
4.2 TC520A Initialization
Initialization of the TC520A consists of: 1. Power-On RESET of the TC500/TC520A (forc- ing the TC520A into an AZ phase). 2. Initializing the TC520A LOAD VALUE.
4.3 Power-On RESET
The TC520A powers up with A,B = 00 (IZ Phase), awaiting a high logic state on CMPTR, which must be initiated by forcing the TC520A into the AZ phase. This can be accomplished in one of two ways: 1. External hardware (processor or logic) can momentarily pull LOAD or CE low for a minimum of 100msec (TAZI)o r ; 2. A .01 µF RESET capacitor can be connected from CE to VCC to generate a power-on pulse on CE.
4.4 LOAD VALUE Initialization
T h eL O A DV A L U Ei st h ep r e s e tv a l u e( h i g hb y t eo ft h e SYSCLK timing counter) which determines the number of counts allocated to the AZ and INT phases of conversion. This value can be calculated using either the TC520A spreadsheet within the TC500 Design Spreadsheet software or can be setup as shown in the following sections.
4.4.1 SELECT V REF,T DEINT
Choose the TC5XX A/D converter reference voltage REF) to be half of the maximum A/D converter input voltage. For example, if VIN(MAX) = 2.5V, choose VREF = 1.25V. This forces the maximum de-integration time (TDEINT) to be equal to twice the maximum integration time (TINT), ensuring a full count (maximum resolution) during DINT.
4.4.2 CALCULATE T INT
The TC520A counter length is 16-bits (65536), allowing the full 65536 counts for T DEINT results in a maximum TINT = 65536/2 or 32768.
4.4.3 SELECT SYSCLK FREQUENCY
SYSCLK frequency directly affects conversion time. The faster the SYSCLK, the faster the conversion time. The upper limit SYSCLK frequency is determined by the worst case delay of the TC500 comparator (which for the TC500 and TC500A is 3.2 µsec). While a faster value for SYSCLK can be used, operation is optimized (error minimized) by choosing a SYSCLK period (1/ SYSCLK frequency) that is greater than 3.2 µsec. Choosing T SYSCLK =4 µsec makes the SYSCLK fre- quency equal to 250kHz. This makes the external crystal (or frequency source) equal to 1.0MHz, since SYSCLK = crystal frequency/4). Calculating integration time (in msec) using T SYSCLK =4 µsec, TINT =4 µsec x 32768 = 131msec.
4.4.4 CALCULATE LOAD VALUE
Plug the TINT and TSYSCLK values into the equation and convert the resulting value to hexadecimal: EQUATION 4-1: In this example, LOAD VALUE = 128(10) = 10H. There- fore, a LOAD VALUE of 10H is loaded into the TC520A. If the desired T INT was 100msec instead of 131msec, the LOAD VALUE would be 9EH, and so on. The TC520A LOAD VALUE must be initialized on power-up, and can be re-initialized as often as desired thereafter. This is accomplished by bringing the LOAD input low while transmitting the appropriate LOAD VALUE to the TC520A as shown in Figure 4-1 and Figure 4-2. 4.4.5 POLLED VS. INTERRUPT OPERATION The TC520A can be accessed at any time by the host processor. This makes operation in a polled environ- ment especially easy since the most recently converted data is available to the processor as needed. The TC520A can also be used in an interrupt environment by connecting DV to the IRQ line of the processor. Since AZ is the first phase of a new conversion cycle, the most recently converted data will be available as soon as DV goes low. If so desired, the interrupt service routine can also modify the LOAD VALUE during the DV = low interval. [(65536 - (TINT/TSYSCLK)] 256LOAD VALUE =
DS21431B-page 8 2002 Microchip Technology Inc. FIGURE 4-1: TC520 initialization & startup conversion timing relatioNships FIGURE 4-2: lOad value modify cycle
4.4.6 OPTO-ISOLATED APPLICATIONS
The 3 wire serial port of the TC520A can be opto- isolated for applications requiring isolated data acquisi- tion. The additional control lines (LOAD ,D V, READ ) are normally not needed in such applications, but can also be brought across the isolation barrier with the addition of a second isolator. LOAD LOAD VALUE updated and conversion started TC520A Conversion State CE is pulled high only during AZ (DV = Low) New LOAD VALUE can be loaded (if so desired) TC520A held in AZ phase as lon g as CE = HIGH CE AZ INT IZDINT AZ INT INT DINT IZ AZ AZ DIN, DCLK DV LOAD VALUE shifted into DIN Load Value LOAD LOAD VALUE updated and conversion started TC520A Conversion State CE AZ INT IZDINT AZ INT INTDINT IZ AZ DIN, DCLK DV LOAD VALUE shift into DIN
DS21431B-page 10 2002 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Package marking information not available at this time.
5.2 Taping Forms
Component Taping Orientation for 16-Pin SOIC (Wide) Devices W PIN 1 User Direction of Feed Standard Reel Component Orientation for TR Suffix Device P Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 16-Pin SOIC (W) 16 mm 12 mm 1000 13 in Carrier Tape, Number of Components Per Reel and Reel Size
2002 Microchip Technology Inc. DS21431B-page 11 TC520A
5.3 Package Dimensions
.260 (6.60) .240 (6.10) .770 (19.56) .745 (18.92) .310 (7.87) .290 (7.37) .040 (1.02) .020 (0.51) .070 (1.78) .045 (1.14) .022 (0.56) .015 (0.38) .110 (2.79) .090 (2.29) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) PIN 114-Pin PDIP (Narrow) .015 (0.38) .008 (0.20) 3˚MIN. .400 (10.16) .310 (7.87) Dimensions: inches (mm) MAX. PIN 1 .299 (7.59) .291 (7.40) .413 (10.49) .398 (10.10) .019 (0.48) .014 (0.36) .012 (0.30) .004 (0.10) .104 (2.64) .009 (0.23) .050 (1.27) .016 (0.40) .419 (10.65) .398 (10.10) .050 (1.27) TYP. 16-Pin SOIC (Wide) Dimensions: inches (mm)
DS21431B-page 12 2002 Microchip Technology Inc.
2002 Microchip Technology Inc. DS21431B-page 13 TC520A SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. T o determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21431B-page 14 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21431B-page 15 TC520A Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip T echnology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, K EELOQ,m i c r o I D ,M P L A B ,P I C ,P I C m i c r o ,P I C M A S T E R , PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Tech- nology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
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