TC4626 MICROCHIP | Alldatasheet
Document overview
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Technical content
Features
- Power Driver With On Board Voltage Booster L o w IDD –< 4 m A Small Package – 8-Pin PDIP Under-Voltage Circuitry Fast Rise-Fall Time – <40nsec @1000pF Below-Rail Input Protection
Applications
Raises 5V to drive higher – Vgs (ON) MOSFETs Eliminates one system power supply Device Selection Table Package Type General Description The TC4626/TC4627 are single CMOS high speed drivers with an on-board voltage boost circuit. These parts work with an input supply voltage from 4 to 6 volts. The internal voltage booster will produce a V BOOST potential up to 12 volts above V IN.T h i sVBOOST is not regulated, so its voltage is dependent on the input VDD voltage and output drive loading requirements. An internal undervoltage lockout circuit keeps the output in a low state when V BOOST drops below 7.8 volts. Output is enabled when VBOOST is above 11.3 volts. Functional Block Diagram Part Number Package Temp. Range TC4626COE 16-Pin SOIC (Wide) -55°C to +125°C TC4626CPA 8-Pin PDIP -40°C to +85°C TC4626EOE 16-Pin SOIC (Wide) -40°C to +85°C TC4626EPA 8-Pin PDIP 0°C to +70°C TC4626MJA 8-Pin CERDIP 0°C to +70°C TC4627COE 16-Pin SOIC (Wide) -55°C to +125°C TC4627CPA 8-Pin PDIP -40°C to +85°C TC4627EOE 16-Pin SOIC (Wide) -40°C to +85°C TC4627EPA 8-Pin PDIP 0°C to +70°C TC4627MJA 8-Pin CERDIP 0°C to +70°C 4 5 IN OUT C1+ GND 4 13 VBOOST NC IN C1– NC C1+ NC NC VDDC1– VDD 8 9 12C2 NC NC GND NC VBOOST NC OUT TC4626 TC4627 TC4626 TC4627 8-Pin PDIP/CERDIP 16-Pin SOIC (Wide) Voltage Booster Clock C1+ C1- In GND EXT Output VBOOST EXT V = 2 x VDD VDD Noninverting TC4627 Inverting TC4626 (Unregulated 3 x VDD) UV LOCK EXT NOTE: Pin numbers correspond to 8-pin package. Power CMOS Drivers With Voltage Tripler
DS21426B-page 2 2002 Microchip Technology Inc.
1.0 ELECTRICAL
Absolute Maximum Ratings* Input Voltage, Any Terminal Package Power Dissipation (TA ≤ 70°C) Operating Temperature Range (Ambient) *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC4626/TC4627 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA =+ 2 5 ° C ,VDD =5 V ,C1 =C 2 =C 3 10µF unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions Input VIH Logic 1, High Input Voltage 2.4 — — V VIL Logic 0, Low Input Voltage — — 0.8 V IIN Input Current -1 — 1 µA0 V ≤ VIN ≤ VDRIVE Output VOH High Output Voltage V BOOST –0 . 0 2 5 — — V VOL Low Output Voltage — — 0.025 V RO Output Resistance, High — 10 15 Ω IOUT =1 0 m A ,VDD =5 V RO Output Resistance, Low — 8 10 Ω IOUT =1 0 m A ,VDD =5 V IPK Peak Output Current — 1.5 — A Switching Time t R R i s eT i m e — 3 3 4 0 n s e c F i g u r e3 - 1 ,F i g u r e3 - 2 tF Fall Time — 27 35 nsec Figure 3-1, Figure 3-2 tD1 Delay Time — 35 45 nsec Figure 3-1, Figure 3-2 tD2 Delay Time — 45 55 nsec Figure 3-1, Figure 3-2 FMAX Maximum Switching Frequency 1.0 — — MHz V DD =5 V ,VBOOST >8 . 5 V , Figure 3-1 Voltage Booster R3 Voltage Tripler Output Source Resistance —3 0 0 4 0 0 Ω IL =1 0 m A ,VDD =5 V R2 Voltage Doubler Output Source Resistance —1 2 0 2 0 0 Ω FOSC Oscillator Frequency 12 — 28 kHz VOSC Oscillator Amplitude Measured at C1- 4.5 — 10 V R LOAD =1 0 kΩ UV @VBOOST Undervoltage Threshold 7.0 7.8 8.5 V VSTART @VBOOST Start Up Voltage 10.5 11.3 12 V VBOOST @VDD = 5V 14.6 — — V No Load
2002 Microchip Technology Inc. DS21426B-page 3 TC4626/TC4627 TC4626/TC4627 ELECTRICAL SPECIFICATIONS (CONTINUED) Symbol Parameter Min Typ Max Units Test Conditions Power Supply IDD Power Supply Current — — 2.5 mA V IN = LOW or HIGH VDD Supply Voltage 4.0 — 6.0 V Electrical Characteristics: Over operating temperature range, V DD =5 V ,C1 =C 2 =C 3 10µF unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions Input VIH Logic 1, High Input Voltage 2.4 — — V VIL Logic 0, Low Input Voltage — — 0.8 V IIN Input Current -10 — 1 µA0 V ≤ VIN ≤ VBOOST Output VOH High Output Voltage V DRIVE –0 . 0 2 5 — — V VOL Low Output Voltage — — 0.025 V RO Output Resistance, High — Ω IOUT =1 0 m A ,VDD =5 V C&EV e r s i o n( TA =7 0 ° Co r8 5 ° C ) M Version (TA =1 2 5 ° C ) RO Output Resistance, Low — Ω I OUT =1 0 m A ,VDD =5 V C&EV e r s i o n( TA =7 0 ° Co r8 5 ° C ) M Version (TA =1 2 5 ° C ) IPK Peak Output Current — 1.5 — A Switching Time t R Rise Time — — 55 nsec Figure 3-1, Figure 3-2 tF Fall Time — — 50 nsec Figure 3-1, Figure 3-2 tD1 Delay Time — — 60 nsec Figure 3-1, Figure 3-2 tD2 Delay Time — — 70 nsec Figure 3-1, Figure 3-2 FMAX Maximum Switching Frequency 750 — — kHz V DD =5 V ,VBOOST >8 . 5 V , Figure 3-1 Voltage Booster R3 Voltage Boost Output Source Resistance — 400 500 Ω IL =1 0 m A ,VDD =5 V R2 Voltage Doubler Output Source Resistance — 170 300 Ω FOSC Oscillator Frequency 5 — 50 kHz VOSC Oscillator Amplitude Measured at C1- 4.5 — 10 V R LOAD =1 0 kΩ UV @VBOOST Undervoltage Threshold 7.0 7.8 8.5 V VSTART @VBOOST Start Up Voltage 10.5 11.3 12 V VBOOST @VDD = 5V 14.6 — — V No Load Power Supply I DD Power Supply Current — — 4 mA V IN = LOW or HIGH VDD Supply Voltage 4.0 — 6.0 V
DS21426B-page 4 2002 Microchip Technology Inc.
2.0 PIN DESCRIPTIONS
T h ed e s c r i p t i o n so ft h ep i n sa r el i s t e di nT a b l e2 - 1 . TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP, CERDIP) Symbol Description 1C 1 - 2C 1 + 3C 2 4 GND Ground. 5O U T BOOST 7I N DD Pin No. (16-Pin SOIC Wide) Symbol Description 1C 1 - 2 NC No connect. 3C 1 + 4 NC No connect. 5C 2 6 NC No connect. 7 NC No connect. 8 GND Ground. 9O U T 10 NC No connect. 11 V BOOST 12 NC No connect. 13 IN 14 NC No connect. 15 NC No connect. 16 V DD
2002 Microchip Technology Inc. DS21426B-page 5 TC4626/TC4627
3.0 APPLICATIONS INFORMATION
FIGURE 3-1: INVERTING DRIVER SWITCHING TIME FIGURE 3-2: NONINVERTING DRIVER SWITCHING TIME 0.1µF Ceramic VBOOST +5V 10% 90% 10% 90% 10% 90% TC4626 C1+ C1- VDD = 5VC2 VBOOST CL = 1000pF Input Input Output tD1 tF tD2 Input: 100kHz, square wave, tRISE = tFALL ≤ 10nsec Output tR 10µF 10µF 10µF 0.1µF Ceramic VBOOST +5V TC4627 C1+ C1- VDD = 5VC2 VBOOST CL = 1000pF Input Input Output tD1 tF tD2 Input: 100kHz, square wave, tRISE = tFALL ≤ 10nsec Output tR 10µF 10µF 10µF 90% 10% 10% 10% 90% 90%
DS21426B-page 6 2002 Microchip Technology Inc.
3.1 BOOSTER FUNCTION
The voltage booster is an unregulated voltage tripler circuit. The tripler consists of three sets of internal switches and three external capacitors. S1a and S1b charge capacitor C1 to V DD potential. S2a and S2b add C1 potential to VDD input to charge C2 to 2 x VDD.S 3 a and S3b add C1 potential to C2 to charge C3 to 3 x V DD. The position of the switches is controlled by the internal 4 phase clock. FIGURE 3-3: VOLTAGE BOOSTER FIGURE 3-4: POSITION OF SWITCHES S1a S1b GND S2a S2b 2 x VDD 3 x VDD, VBOOST S3b S3a (4 to 6V) VDD Pin 2 Voltage Pin 1 Voltage 3 x VDD 2 x VDD VDD 2 x VDD VDD On Off On Off On Off Pin 1 & 2 Waveforms
2002 Microchip Technology Inc. DS21426B-page 7 TC4626/TC4627
4.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. VOUT HI (Volts) TC4626 VOH vs. Frequency 5 500 1,000 1,500 2,000 2,500 3,000 3,500 FREQUENCY (kHz) 470pF 2200pF 1000pF VS = 5V TA = -55°C FREQUENCY (kHz) TC4626 VOH vs. Frequency 5 500 1,000 1,500 2,000 2,500 3,000 3,500 470pF 2200pF 1000pF VOUT HI (Volts) VS = 5V TA = 125°C Time (nsec) -40 -20 0 20 40 60 80 Delay Time vs. Temperature 100 120 VS = 5V CLOAD = 1000pF Input = 0-5V; TR & TF <10nsec; @ <20kHz TEMPERATURE (°C) tD2 tD1 tRISEtFALL VOUT HI (Volts) 10 500 1,000 1,500 2,000 2,500 3,000 3,500 FREQUENCY (kHz) 470pF 2200pF 1000pF VS = 5V TA = 25°C TC4626 VOH vs. Frequency Time (nsec) -40 -20 0 20 40 60 80 100 Delay Time vs. Temperature 100 120 Input = 0-5V; TR & TF <10nsec; @ <20kHz VS = 4V CLOAD = 1000pF TEMPERATURE (°C) tD2 tD1 tRISE tFALL Delay Time vs. Temperature Time (nsec) -40 -20 0 20 40 60 80 100 120 VS = 6V CLOAD = 1000pF Input = 0-5V; TR & TF <10nsec; @ <20kHz TEMPERATURE (°C) tD2 tD1 tRISEtFALL
DS21426B-page 8 2002 Microchip Technology Inc. TYPICAL CHARACTERISTICS (CONTINUED) VOUT HI (Volts) 1234567 FREQUENCY x 100 kHz 9 100 2,200pF 470pF 1,000pF VS = 5V TA = 25°C TC4626 VOH vs. Frequency VOUT HI (Volts) 1 2 34 567 FREQUENCY x 100 kHz 9 100 470pF 2,200pF 1,000pF VS = 5V TA = 125°C TC4626 VOH vs. Frequency 1234567 FREQUENCY x 100 kHz 9 100 2,200pF 470pF 1,000pF VS = 5V TA = -55°C TC4626 VOH vs. Frequency VOUT HI (Volts)
2002 Microchip Technology Inc. DS21426B-page 9 TC4626/TC4627
5.0 PACKAGING INFORMATION
Package marking data not available at this time.
5.1 Package Dimensions
3° MIN. PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm) .400 (10.16) .370 (9.40) .300 (7.62) .230 (5.84) .065 (1.65) .045 (1.14) PIN 1 .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18) .110 (2.79) .090 (2.29) .020 (0.51) .016 (0.41) .040 (1.02) .020 (0.51) .320 (8.13) .290 (7.37) .150 (3.81) MIN. 3° MIN. 8-Pin CDIP (Narrow) .015 (0.38) .008 (0.20) .400 (10.16) .320 (8.13) Dimensions: inches (mm)
DS21426B-page 10 2002 Microchip Technology Inc. Package Dimensions (Continued) /K38 ° /K4D/K41/K58/K2E /K50/K49/K4E /K31 /K2E/K32/K39/K39 /K28/K37/K2E/K35/K39/K29 /K2E/K32/K39/K31 /K28/K37/K2E/K34/K30/K29 /K2E/K34/K31/K33 /K28/K31/K30/K2E/K34/K39/K29 /K2E/K33/K39/K38 /K28/K31/K30/K2E/K31/K30/K29 /K2E/K30/K31/K39 /K28/K30/K2E/K34/K38/K29 /K2E/K30/K31/K34 /K28/K30/K2E/K33/K36/K29 /K2E/K30/K31/K32 /K28/K30/K2E/K33/K30/K29 /K2E/K30/K30/K34 /K28/K30/K2E/K31/K30/K29 /K2E/K31/K30/K34 /K28/K32/K2E/K36/K34/K29 /K2E/K30/K39/K37 /K28/K32/K2E/K34/K36/K29 /K2E/K30/K31/K33 /K28/K30/K2E/K33/K33/K29 /K2E/K30/K30/K39 /K28/K30/K2E/K32/K33/K29 /K2E/K30/K35/K30 /K28/K31/K2E/K32/K37/K29 /K2E/K30/K31/K36 /K28/K30/K2E/K34/K30/K29 /K2E/K34/K31/K39 /K28/K31/K30/K2E/K36/K35/K29 /K2E/K33/K39/K38 /K28/K31/K30/K2E/K31/K30/K29 /K2E/K30/K35/K30 /K28/K31/K2E/K32/K37/K29 /K54/K59/K50/K2E 16-Pin SOIC (Wide) Dimensions: inches (mm)
2002 Microchip Technology Inc. DS21426B-page11 TC4626/TC4627 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. T o determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21426B-page12 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21426B-page 13 TC4626/TC4627 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip T echnology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, K EELOQ,m i c r o I D ,M P L A B ,P I C ,P I C m i c r o ,P I C M A S T E R , PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Tech- nology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and T otal Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
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