TC4422A

TC4421A MICROCHIP | Alldatasheet

Document overview

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Technical content

Features

• High Peak Output Current: 10A (typ.)
• Low Shoot-Through/Cross-Conduction Current in Output Stage
• Wide Input Supply Voltage Operating Range: - 4.5V to 18V
• High Continuous Output Current: 2A (max.)
• Matched Fast Rise and Fall Times: - 15 ns with 4,700 pF Load - 135 ns with 47,000 pF Load
• Matched Short Propagation Delays: 42 ns (typ.)
• Low Supply Current: - With Logic ‘1’ Input – 130 µA (typ.) - With Logic ‘0’ Input – 33 µA (typ.)
• Low Output Impedance: 1.2Ω (typ.)
• Latch-Up Protected: Will Withstand 1.5A Output Reverse Current
• Input Will Withstand Negative Inputs Up To 5V
• Pin-Compatible with the TC4420/TC4429 and TC4421/TC4422 MOSFET Drivers
• Space-Saving, Thermally-Enhanced, 8-Pin DFN Package

Applications

• Line Drivers for Extra Heavily-Loaded Lines
• Pulse Generators
• Driving the Largest MOSFETs and IGBTs
• Local Power ON/OFF Switch
• Motor and Solenoid Driver
• LF Initiator General Description The TC4421A/TC4422A are improved versions of the earlier TC4421/TC4422 family of single-output MOSFET drivers. These devices are high-current buffer/drivers capable of driving large MOSFETs and Insulated Gate Bipolar Transistors (IGBTs). The TC4421A/TC4422A have matched output rise and fall times, as well as matched leading and falling-edge propagation delay times. The TC4421A/TC4422A devices also have very low cross-conduction current, reducing the overall power dissipation of the device. These devices are essentially immune to any form of upset, except direct overvoltage or over-dissipation. They cannot be latched under any conditions within their power and voltage ratings. These parts are not subject to damage or improper operation when up to 5V of ground bounce is present on their ground terminals. They can accept, without damage or logic upset, more than 1A inductive current of either polarity being forced back into their outputs. In addition, all terminals are fully protected against up to 4 kV of electrostatic discharge. The TC4421A/TC4422A inputs may be driven directly from either TTL or CMOS (3V to 18V). In addition, 300 mV of hysteresis is built into the input, providing noise immunity and allowing the device to be driven from slowly rising or falling waveforms. With both surface-mount and pin-through-hole packages, in addition to a wide operating temperature range, the TC4421A/TC4422A family of 9A MOSFET drivers fit into most any application where high gate/line capacitance drive is required. Package Types(1) 8-Pin VDD OUTPUT GND VDD INPUT NC GND OUTPUT TC4421A TC4422A 5-Pin TO-220 VDD GND INPUT GND OUTPUT TC4421A TC4422A Tab is Common to VDD Note 1: Duplicate pins must both be connected for proper operation. Exposed pad of the DFN package is electrically isolated. TC4421A TC4422A VDD OUTPUT GND OUTPUT PDIP/SOIC 8-Pin DFN(2) VDD INPUT NC GND TC4421A TC4422A VDD OUTPUT GND OUTPUT TC4421A TC4422A VDD OUTPUT GND OUTPUT 9A High-Speed MOSFET Drivers

© 2005 Microchip Technology Inc. Functional Block Diagram Effective Input Output Input GND VDD 300 mV 4.7V TC4421A C = 25 pF TC4422A Inverting Non-Inverting 130 µA Cross-Conduction Reduction and Pre-Drive Circuitry Output

© 2005 Microchip Technology Inc. DS21946A-page 7 TC4421A/TC4422A Note: Unless otherwise indicated, TA = +25°C with 4.5V ≤ VDD ≤ 18V. FIGURE 2-13: Input Threshold vs. Supply Voltage. FIGURE 2-14: High-State Output Resistance vs. Supply Voltage. FIGURE 2-15: Low-State Output Resistance vs. Supply Voltage. FIGURE 2-16: Supply Current vs. Capactive Load (VDD = 18V). FIGURE 2-17: Supply Current vs. Capactive Load (VDD = 12V). FIGURE 2-18: Supply Current vs. Capactive Load (VDD = 6V). 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 Supply Voltage (V) Input Threshold (V) VIH VIL 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Supply Voltage (V) ROUT-HI (:) TJ = 25°C TJ = 150°C VIN = 5V (TC4422A) VIN = 0V (TC4421A) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Supply Voltage (V) ROUT-LO (:) TJ = 25°C TJ = 150°C VIN = 0V (TC4422A) VIN = 5V (TC4421A) 100 120 140 160 180 100 1,000 10,000 100,000 Capacitive Load (pF) Supply Current (mA)

2 MHz

1 MHz

VDD = 18V 100 120 140 160 180 200 100 1,000 10,000 100,000 Capacitive Load (pF) Supply Current (mA) VDD = 12V 100 120 140 160 180 200 220 100 1,000 10,000 100,000 Capacitive Load (pF) Supply Current (mA) VDD = 6V

© 2005 Microchip Technology Inc. DS21946A-page 9 TC4421A/TC4422A 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 3.1 Supply Input (VDD) The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 18V with respect to the ground pin. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A minimum value of 1.0 µF is suggested. 3.2 Control Input The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input also has 300 mV of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. 3.3 CMOS Push-Pull Output The MOSFET driver output is a low-impedance, CMOS, push-pull style output capable of driving a capacitive load with 9.0A peak currents. The MOSFET driver output is capable of withstanding 1.5A peak reverse currents of either polarity. 3.4 Ground The ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return. 3.5 Exposed Metal Pad The exposed metal pad of the 6x5 DFN package is not internally connected to any potential. Therefore, this pad can be connected to a ground plane or other copper plane on a Printed Circuit Board (PCB) to aid in heat removal from the package. 3.6 Metal Tab The metal tab of the TO-220 package is connected to the VDD potential of the device. This connection to VDD can be used as a current carrying path for the device. Pin No. 8-Pin PDIP, SOIC Pin No. 8-Pin DFN Pin No. 5-Pin TO-220 Symbol

Description

Supply input, 4.5V to 18V INPUT Control input, TTL/CMOS-compatible input NC No connection GND Ground GND Ground OUTPUT CMOS push-pull output OUTPUT CMOS push-pull output VDD Supply input, 4.5V to 18V PAD NC Exposed metal pad TAB VDD Metal tab is at the VDD potential

© 2005 Microchip Technology Inc. 4.0 APPLICATIONS INFORMATION FIGURE 4-1: Switching Time Test Circuits. Inverting Driver Non-Inverting Driver Input tD1 tF tR tD2 Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 nsec Output Input Output tD1 tF tR tD2 +5V 10% 90% 10% 90% 10% 90% +18V 90% 10% 10% 10% 90% +5V +18V 90% CL = 10,000 pF 0.1 µF 4.7 µF Input VDD = 18V Output 0.1 µF TC4421A TC4422A Note: Pinout shown is for the DFN, PDIP and SOIC packages. VDD VDD Input GND GND Output Output

© 2005 Microchip Technology Inc. DS21946A-page 11 TC4421A/TC4422A 5.0 PACKAGING INFORMATION 5.1 Package Marking Information XXXXXXXX XXXXXNNN YYWW 8-Lead PDIP (300 mil) Example: TC4421A PA ^ 256 0514 5-Lead TO-220 XXXXXXXXX XXXXXXXXX YYWWNNN Example: TC4421A XXXXXXXXX 0514256 VAT^^ Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e 8-Lead DFN Example: TC4421A VMF^ 0514 256 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN TC4421A SN 0514 256 e e e e XXXXXXX XXXXXXX XXYYWW NNN

© 2005 Microchip Technology Inc. 5-Lead Plastic Transistor Outline (AT) (TO-220) L Q E b e F A D a (5X) ØP EJECTOR PIN Drawing No. C04-036 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC equivalent: TO-220 *Controlling Parameter Mold Draft Angle Lead Width Lead Thickness a b .014 Dimension Limits Overall Height Lead Length Overall Width Lead Pitch A L E .540 MIN e Units .060 INCHES* .022 0.36 0.56 MILLIMETERS .190 .560 13.72 MIN MAX 4.83 14.22 MAX .160 4.06 Overall Length D 1.02 0.64 .040 .025 Overall Lead Centers .263 .385 .560 .273 6.68 6.93 .072 1.52 1.83 .415 9.78 10.54 .590 14.22 14.99 Through Hole Diameter P .146 .156 3.71 3.96 Base to Bottom of Lead .090 2.29 .115 2.92 Through Hole Center Q .103 2.87 .113 2.62 Flag Thickness F .045 1.40 .055 1.14 Flag Length .234 6.55 .258 5.94 Space Between Leads .030 1.02 .040 0.76

© 2005 Microchip Technology Inc. DS21946A-page 13 TC4421A/TC4422A 8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated

© 2005 Microchip Technology Inc. 8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP) B A L p α E eB β c n D Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n Pitch p .100 2.54 Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness c .008 .012 .015 0.20 0.29 0.38 Upper Lead Width .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top α Mold Draft Angle Bottom β * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed JEDEC Equivalent: MS-001 Drawing No. C04-018 .010” (0.254mm) per side. § Significant Characteristic

© 2005 Microchip Technology Inc. DS21946A-page 15 TC4421A/TC4422A 8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC) Foot Angle φ β Mold Draft Angle Bottom α Mold Draft Angle Top 0.51 0.42 0.33 .020 .017 .013 B Lead Width 0.25 0.23 0.20 .010 .009 .008 c Lead Thickness 0.76 0.62 0.48 .030 .025 .019 L Foot Length 0.51 0.38 0.25 .020 .015 .010 h Chamfer Distance 5.00 4.90 4.80 .197 .193 .189 D Overall Length 3.99 3.91 3.71 .157 .154 .146 Molded Package Width 6.20 6.02 5.79 .244 .237 .228 E Overall Width 0.25 0.18 0.10 .010 .007 .004 Standoff 1.55 1.42 1.32 .061 .056 .052 Molded Package Thickness 1.75 1.55 1.35 .069 .061 .053 A Overall Height 1.27 .050 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units D n p B E h L β c 45° φ α A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 § Significant Characteristic

© 2005 Microchip Technology Inc. NOTES:

© 2005 Microchip Technology Inc. DS21946A-page 17 TC4421A/TC4422A APPENDIX A:

REVISION HISTORY

Revision A (May 2005)

• Original Release of this Document.

© 2005 Microchip Technology Inc. NOTES:

© 2005 Microchip Technology Inc. DS21946A-page 19 TC4421A/TC4422A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: TC4421A: 9A High-Speed MOSFET Driver, Inverting TC4422A: 9A High-Speed MOSFET Driver, Non-Inverting Temperature Range: V = -40°C to +125°C Package: * AT = TO-220, 5-lead MF = Dual, Flat, No-Lead (6x5 mm Body), 8-lead MF713 = Dual, Flat, No-Lead (6x5 mm Body), 8-lead (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead OA = Plastic SOIC (150 mil Body), 8-lead OA713 = Plastic SOIC (150 mil Body), 8-lead (Tape and Reel) *All package offerings are Pb Free (Lead Free). PART NO. X XX Package Temperature Range Device Examples: TC4421AVAT: 9A High-Speed Inverting MOSFET Driver, TO-220 package, -40°C to +125°C. TC4421AVOA: 9A High-Speed Inverting MOSFET Driver, SOIC package, -40°C to +125°C. TC4421AVMF: 9A High-Speed Inverting MOSFET Driver, DFN package, -40°C to +125°C. TC4422AVPA: 9A High-Speed Non-Inverting MOSFET Driver, PDIP package, -40°C to +125°C. TC4422AVOA: 9A High-Speed Non-Inverting MOSFET Driver, SOIC package, -40°C to +125°C. TC4422AVMF: 9A High-Speed Non-Inverting MOSFET Driver, DFN package, -40°C to +125°C. XXX Tape & Reel

© 2005 Microchip Technology Inc. NOTES:

© 2005 Microchip Technology Inc. DS21946A-page 21 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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