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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 22
Technical content
Features
- Independently Programmable Rise and Fall Times
- Low Output Impedance: 7 Typical
- High Speed tR, tF: <30 ns with 1000 pF Load
- Short Delay Times: <30 ns
- Wide Operating Range: 4.5V to 18V
- Latch-Up Protected: withstands > 500 mA Reverse Current (Either Polarity)
- Input Withstands Negati ve Swings up to -5V
Applications
- Motor Controls
- Driving Bipolar Transistors
- Driver for Non-Overlapping Totem Poles
- Reach-Up/Reach-Down Driver General Description The TC4404/TC4405 are CMOS buffer-drivers constructed with complementary MOS outputs, where the drains of the totem- pole output have been left separated so that individual connections can be made to the pull-up and pull-down sections of the output. This allows the insertion of drain-current-limiting resistors in the pull-up and/or pull-down sections, allowing the user to define the rates of rise and fall for a capacitive load. It also enables a reduced output swing, if driving a resistive load, or limiting base current when driving a bipolar transistor. Minimum rise and fall times, with no resistors, will be less than 30 ns for a 1000 pF load. For driving MOSFETs in motor-control applications, where slow-ON/fast-OFF oper ation is desired, these devices are superior to the previously used technique of adding a diode-resistor combination between the driver output and the MOSF ET, because they allow accurate control of turn-on, while maintaining fast turn-off and maximum noise immunity for an OFF device. When used to drive bipolar transistors, these drivers maintain the high speeds common to other Microchip drivers. They allow insertion of a base current-limiting resistor, while providing a separate half-output for fast turn-off. By proper positioni ng of the resistor, either NPN or PNP transistors can be driven. For driving many loads in low-power regimes, these drivers require significantly less power at higher frequencies and can be helpful in meeting low-power budgets as they eliminate shoot-through currents in the output stage. Package Type TABLE 1: DEVICE SELECTION TABLE Part Number Package Temp. Range TC4404COA 8-Lead SOIC 0°C to +70°C TC4404CPA 8-Lead PDIP 0°C to +70°C TC4404EOA 8-Lead SOIC -40°C to +85°C TC4404EPA 8-Lead PDIP -40°C to +85°C TC4405COA 8-Lead SOIC 0°C to +70°C TC4405CPA 8-Lead PDIP 0°C to +70°C TC4405EOA 8-Lead SOIC -40°C to +85°C TC4405EPA 8-Lead PDIP -40°C to +85°C
45 B BOTTOMGND
36 B T O PIN B
1.5A Dual Open-Drain MOSFET Drivers
DS20001418E-page 2 2002-2016 Microchip Technology Inc. Because neither drain in an output is dependent on the other, these devices can also be used as open-drain buffer/drivers where both drai ns are available in one device, thus minimizing chip count. Unused open drains should be returned to the supply rail so that their device sources are connected (pull-downs to ground, pull-ups to V DD), to prevent static damage. In addition, in situations where timing resistors or other means of limiting crossover currents are used, like drains from drivers A and B, they may be paralleled for greater current carrying capacity. These devices are built to operate in the most demanding electrical environments. They will not latch-up under any conditions within their power and voltage ratings; they are not subject to damage when up to 5V of noise spiking of either polarity occurs on their ground pin; and they can accept, without damage or logic upset, up to 0.5A of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 2 kV (HBM) of electrostatic discharge. Functional Block Diagram Input GND Effective Input C ≤ 12 pF 300 mV VDD Pull-Up Pull-Down 2 (3) A (B) 8 (6) 7 (5) TC4404 Inverting TC4405 Noninverting4.7V
2002-2016 Microchip Technology Inc. DS20001418E-page 3 TC4404/TC4405
1.0 ELECTRICAL
Absolute Maximum Ratings † Power Dissipation (TA 70°C) Operating Temperature Range † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Characteristics: Unless otherwise specified, all limits apply for typical values at ambient temperature TA = +25°C, with 4.5V VDD 18V. Parameter Sym. Min. Typ. Max. Units Conditions Input Logic 1, High Input Voltage V IH 2.4 — — V Logic 0, Low Input Voltage V IL —— 0 . 8 V Output High Output Voltage V OH VDD – 0.025 — — V Low Output Voltage V OL — — 0.025 V Output Resistance R O —7 1 0 IOUT = 10 mA, VDD = 18V; any drain Peak Output Current (Any Drain) I PK — 1.5 — A Duty cycle 2%, t 300 sec Continuous Output Current (Any Drain) IDC — — 100 mA Latch-Up Protection (Any Drain) Withstand Reverse Current Switching Time (Note 1) Rise Time t R —2 5 3 0 n s Figure 4-1, CL = 1000 pF Fall Time t F —2 5 3 0 n s Figure 4-1, CL = 1000 pF Delay Time t D1 —1 5 3 0 n s Figure 4-1, CL = 1000 pF Delay Time t D2 —3 2 5 0 n s Figure 4-1, CL = 1000 pF Power Supply Power Supply Current I S — 4.5 0.4 mA V IN = 3V (both inputs) VIN = 0V (both inputs) Note 1: Switching times ensured by design.
DS20001418E-page 4 2002-2016 Microchip Technology Inc. DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE) Electrical Characteristics: Unless otherwise indicated, operating temperature range with 4.5V VDD18V. Parameter Sym. Min. Typ. Max. Units Conditions Logic 1, High Input Voltage V IH 2.4 — — V Logic 0, Low Input Voltage V IL —— 0 . 8 V Input Current I IN –10 — 10 A0 V VINVDD Output High Output Voltage V OH VDD – 0.025 — — V Low Output Voltage V OL —— 0 . 0 2 5 V Output Resistance R O —9 1 2 IOUT = 10 mA, VDD = 18V; any drain Peak Output Current (Any Drain) I PK — 1.5 — A Duty cycle 2%, t 300 sec Continuous Output Current (Any Drain) IDC — — 100 mA Latch-Up Protection (Any Drain) Withstand Reverse Current Switching Time (Note 1) Rise Time t R —— 4 0 n s Figure 4-1, CL = 1000 pF Fall Time t F —— 4 0 n s Figure 4-1, CL = 1000 pF Delay Time t D1 —— 4 0 n s Figure 4-1, CL = 1000 pF Delay Time t D2 —— 6 0 n s Figure 4-1, CL = 1000 pF Power Supply Power Supply Current I S — 0.6 mA V IN = 3V (both inputs) VIN = 0V (both inputs) Note 1: Switching times ensured by design. TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V. Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Operating Temperature Range, C Version T A 0— + 7 0 ° C Operating Temperature Range, E Version T A -40 — +85 °C Storage Temperature Range T A -65 — +150 °C Package Thermal Resistances Thermal Resistance, 8-Lead PDIP JA —+ 9 4 —° C / W Thermal Resistance, 8-Lead PDIP JC —+ 4 5 —° C / W Thermal Resistance, 8-Lead SOIC JA —+ 1 6 3 — ° C / W Thermal Resistance, 8-Lead SOIC JC —+ 4 2 —° C / W
2002-2016 Microchip Technology Inc. DS20001418E-page 5 TC4404/TC4405
2.0 TYPICAL PE RFORMANCE CURVES
FIGURE 2-1: Rise Time vs. Supply Voltage. FIGURE 2-2: Fall Time vs. Supply Voltage. FIGURE 2-3: Rise Time vs. Capacitive Load. FIGURE 2-4: Fall Time vs. Capacitive Load. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or t ables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 4 14 16 18 100 pF 470 pF 2200 pF 1500 pF 100 1000 pF 468 14 16 18 100 pF 470 pF 1000 pF 2200 pF 1500 pF 100 100 1000 10,000 10V 15V 100 TA = +25°CTA = +25°CTA = +25°C VDD = 5V 11 11 VDD tRISE (ns) 4 14 16 18 100 pF 470 pF 2200 pF 1500 pF 100 1000 pF 4 6 8 14 16 18 100 pF 470 pF 1000 pF 2200 pF 1500 pF 100 100 1000 10,000 10V 15V 100 TA = +25°CTA = +25°CTA = +25°C VDD = 5V 11 11 VDD tFALL (ns) tRISE (ns) CLOAD (pF) 4 14 16 18 100 pF 470 pF 2200 pF 1500 pF 100 1000 pF 468 14 16 18 100 pF 470 pF 1000 pF 2200 pF 1500 pF 100 100 1000 10000 10V 15V 100 TA = +25°CTA = +25°CTA = +25°C VDD = 5V 11 11 tFALL (ns) CLOAD (pF) 468 14 16 18 -55 -35 -15 5 25 45 65 85 105 125 100 1000 10000 100 10V 15V tD1 TA = +25°C tD2 VDD = 5V CLOAD = 1000 pF VDD = 17.5V CLOAD = 1000 pF TA = +25°C tFALL tRISE
DS20001418E-page 8 2002-2016 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 8-Lead PDIP/SOIC Symbol Description 1V DD Supply Input, 4.5V to 18V
2 IN A Control Input A, TTL/CMOS compatible input
3 IN B Control Input B, TTL/CMOS compatible input
4 GND Ground
5 B BOTTOM Output B, pull-down
6 B TOP Output B, pull-up
7 A BOTTOM Output A, pull-down
8 A TOP Output A, pull-up
2002-2016 Microchip Technology Inc. DS20001418E-page 9 TC4404/TC4405
4.0 APPLICATIONS INFORMATION
4.1 Circuit Layout Guidelines
Long power supply and ground traces should be avoided as the added inductance causes unwanted voltage transients. Power and ground planes should be used wherever possible. In addition, it is advisable that low ESR (Equivalent Series Resistance) bypass capacitors (4.7 µF or 10 µF tantalum) be placed as close to the driver as possible. In order to minimize the length of the output trace, the driver should be physically located as close as possible to the device it is driving. FIGURE 4-1: Switching Time Test Circuit.
4.2 Typical Applications
FIGURE 4-2: Zero Crossover Current Totem-Pole Switch. FIGURE 4-3: Driving Bipolar Transistors. CL = 1000 pF +5V 10% 90% 10% 90% 10% 90%18V 90% 10% 10% 10% 90% +5V 18V 90% 28 . 7 0.1 µF4.7 µF Inverting Driver Noninverting Driver Input VDD = 18V Input Output tD1 tF tR tD2Input: 100 kHz, square wave, tRISE = tFALL 10 ns Output Input Output tD1 tF tR tD2 RT RT VDD (4.5V - 18V) From TTL GND VOUT TC4404 GND TC4405 VDD (4.5V - 18V) From TTL RIB RIB
2002-2016 Microchip Technology Inc. DS20001418E-page 11 TC4404/TC4405
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 8-Lead SOIC (3.90 mm) Example NNN 8-Lead PDIP (300 mil) Example XXXXXXXX XXXXXNNN YYWW TC4404 EPA 256 1519 TC4404C OA 1519 256
DS20001418E-page 12 2002-2016 Microchip Technology Inc. B A For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 1RWH Microchip Technology Drawing No. C04-018D Sheet 1 of 2 /HDG3ODVWLF'XDO,Q/LQH PLO%RG\\>3',3@ eB E A L 8X b 8X b1 D c C 3/$1( .010 C N NOTE 1 TOP VIEW END VIEWSIDE VIEW e
2002-2016 Microchip Technology Inc. DS20001418E-page 13 TC4404/TC4405 Microchip Technology Drawing No. C04-018D Sheet 2 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 1RWH /HDG3ODVWLF'XDO,Q/LQH PLO%RG\\>3',3@ Units INCHES Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e .100 BSC Top to Seating Plane A - - .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width b1 .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing eB - - .430 BSC: Basic Dimension. Theoretically exact value shown without tolerances. protrusions shall not exceed .010" per side. Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or Pin 1 visual index feature may vary, but must be located within the hatched area. § Significant Characteristic Dimensioning and tolerancing per ASME Y14.5M e DATUM A DATUM A e b e b e ALTERNATE LEAD DESIGN (VENDOR DEPENDENT)
DS20001418E-page 14 2002-2016 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
2002-2016 Microchip Technology Inc. DS20001418E-page 15 TC4404/TC4405 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
DS20001418E-page 16 2002-2016 Microchip Technology Inc. /g27/g16/g47/g72/g68/g71/g3/g51/g79/g68/g86/g87/g76/g70/g3/g54/g80/g68/g79/g79/g3/g50/g88/g87/g79/g76/g81/g72/g3/g11/g50/g36/g12/g3/g177/g3/g49/g68/g85/g85/g82/g90/g15/g3/g22/g17/g28/g19/g3/g80/g80/g3/g37/g82/g71/g92/g3/g62/g54/g50/g44/g38/g64 /g49/g82/g87/g72/g29/g41/g82/g85/g3/g87/g75/g72/g3/g80/g82/g86/g87/g3/g70/g88/g85/g85/g72/g81/g87/g3/g83/g68/g70/g78/g68/g74/g72/g3/g71/g85/g68/g90/g76/g81/g74/g86/g15/g3/g83/g79/g72/g68/g86/g72/g3/g86/g72/g72/g3/g87/g75/g72/g3/g48/g76/g70/g85/g82/g70/g75/g76/g83/g3/g51/g68/g70/g78/g68/g74/g76/g81/g74/g3/g54/g83/g72/g70/g76/g73/g76/g70/g68/g87/g76/g82/g81/g3/g79/g82/g70/g68/g87/g72/g71/g3/g68/g87/g3 /g75/g87/g87/g83/g29/g18/g18/g90/g90/g90/g17/g80/g76/g70/g85/g82/g70/g75/g76/g83/g17/g70/g82/g80/g18/g83/g68/g70/g78/g68/g74/g76/g81/g74
2002-2016 Microchip Technology Inc. DS20001418E-page 17 TC4404/TC4405 APPENDIX A: REVISION HISTORY Revision E (April 2016) The following is the list of modifications: 1. Removed all information regarding the discontinued CERDIP package. 2. Added Temperature Specifications Table. 3. Added Section 5.0, Packaging Information. 4. Added Product Identification System page. Revision D (December 2012) Added a note to each package outline drawing.
DS20001418E-page 18 2002-2016 Microchip Technology Inc. NOTES:
2002-2016 Microchip Technology Inc. DS20001418E-page 19 TC4404/TC4405 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X XX PackageTemperature Range Device Device: TC4404: Dual Open-Drain MOSFET Driver TC4405: Dual Open-Drain MOSFET Driver Temperature Range: C= 0 C to +70 C E= - 4 0 C to +85 C Package: OA = Plastic Small Outline (3.90 mm Body),8-Lead, SOIC PA = Plastic Dual In-Line (300 mil Body), 8-Lead, PDIP OA713 = Plastic Small Outline (3.90 mm Body),8-Lead, SOIC (Tape and Reel) Examples: a) TC4404COA: 1.5A Dual Open-Drain MOSFET Driver, 0°C to +70°C, b) TC4404EOA: 1.5A Dual Open-Drain MOSFET Driver, -40°C to +85°C, c) TC4404CPA: 1.5A Dual Open-Drain MOSFET Driver, 0°C to +70°C, d) TC4405EPA: 1.5A Dual Open-Drain MOSFET Driver, -40°C to +85°C, e) TC4404EOA713: 1.5A Dual Open-Drain MOSFET Driver, -40°C to +85°C, Tape and Reel
DS20001418E-page 20 2002-2016 Microchip Technology Inc. NOTES:
2002-2016 Microchip Technology Inc. DS20001418E-page 21 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application me ets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting fr om such use. No licenses are conveyed, implicitly or ot herwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0445-3 Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used in the intended manner and under normal conditions.
- There are dishonest and possibly illegal meth ods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
- Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==
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