TC4404_13 MICROCHIP | Alldatasheet
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2002-2012 Microchip Technology Inc. DS21418D-page 1 TC4404/TC4405 Features:
- Independently Programmable Rise and Fall Times
- Low Output Impedance – 7 Typ.
- High Speed tR, tF – <30 nsec with 1000 pF Load
- Short Delay Times – <30 nsec
- Wide Operating Range: - 4.5V to 18V
- Latch-Up Protected: Will Withstand > 500 mA Reverse Current (Either Polarity)
- Input Withstands Negative Swings Up to -5V Applications:
- Motor Controls
- Driving Bipolar Transistors
- Driver for Non-overlapping Totem Poles
- Reach-Up/Reach-Down Driver Device Selection Table General Description: The TC4404/TC4405 are CMOS buffer-drivers constructed with complementary MOS outputs, where the drains of the totem-pole output have been left separated so that individual connections can be made to the pull-up and pull-down sections of the output. This allows the insertion of drain-current-limiting resistors in the pull-up and/or pull-down sections, allowing the user to define the rates of rise and fall for a capacitive load; or a reduced output swing, if driving a resistive load, or to limit base current, when driving a bipolar transistor. Minimum rise and fall times, with no resistors, will be less than 30 nsec for a 1000 pF load. For driving MOSFETs in motor-control applications, where slow-ON/fast-OFF operation is desired, these devices are superior to the previously used technique of adding a diode-resistor combination between the driver output and the MOSFET, because they allow accurate control of turn-ON, while maintaining fast turn- OFF and maximum noise immunity for an OFF device. When used to drive bipolar transistors, these drivers maintain the high speeds common to other Microchip drivers. They allow insertion of a base current-limiting resistor, while providing a separate half-output for fast turn-OFF. By proper positioning of the resistor, either npn or pnp transistors can be driven. For driving many loads in low-power regimes, these drivers, because they eliminate shoot-through currents in the output stage, require significantly less power at higher frequencies, and can be helpful in meeting low-power budgets. Package Type Part Number Package Temp. Range TC4404COA 8-Pin SOIC 0°C to +70°C TC4404CPA 8-Pin PDIP 0°C to +70°C TC4404EOA 8-Pin SOIC -40°C to +85°C TC4404EPA 8-Pin PDIP -40°C to +85°C TC4404MJA 8-Pin CERDIP -55°C to +125°C TC4405COA 8-Pin SOIC 0°C to +70°C TC4405CPA 8-Pin PDIP 0°C to +70°C TC4405EOA 8-Pin SOIC -40°C to +85°C TC4405EPA 8-Pin PDIP -40°C to +85°C TC4405MJA 8-Pin CERDIP -55°C to +125°C TC4405 B BOTTOMGND IN B IN A VDD B TOP A BOTTOM A TOP TC4405 B BOTTOMGND IN B IN A VDD B TOP A BOTTOM A TOP TC4404 B BOTTOMGND IN B IN A VDD B TOP A BOTTOM A TOP TC4404 B BOTTOMGND IN B IN A VDD B TOP A BOTTOM A TOP 8-Pin PDIP/SOIC/CERDIP 1.5A Dual Open-Drain MOSFET Drivers
DS21418D-page 2 2002-2012 Microchip Technology Inc. Because neither drain in an output is dependent on the other, these devices can also be used as open-drain buffer/drivers where both drains are available in one device, thus minimizing chip count. Unused open drains should be returned to the supply rail that their device sources are connected to (pull-downs to ground, pull-ups to V DD), to prevent static damage. In addition, in situations where timing resistors or other means of limiting crossover currents are used, like drains may be paralleled for greater current carrying capacity. These devices are built to operate in the most demand- ing electrical environments. They will not latch-up under any conditions within their power and voltage ratings; they are not subject to damage when up to 5V of noise spiking of either polarity occurs on their ground pin; and they can accept, without damage or logic upset, up to 1/2 amp of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 2 kV of electrostatic discharge. Functional Block Diagram Input GND Effective Input C ≤ 12 pF 300 mV VDD Pull-Up Pull-Down 2 (3) A (B) 8 (6) 7 (5) TC4404 Inverting TC4405 Noninverting4.7V
2002-2012 Microchip Technology Inc. DS21418D-page 3 TC4404/TC4405
1.0 ELECTRICAL
Absolute Maximum Ratings* Power Dissipation (TA 70°C) Package Thermal Resistance Operating Temperature Range *Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC4404/TC4405 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = +25°C, with 4.5V VDD18V, unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions Input VIH Logic 1, High Input Voltage 2.4 — — V VIL Logic 0, Low Input Voltage — — 0.8 V IIN Input Current -1 — 1 A0 V VINVDD Output VOH High Output Voltage V DD – 0.025 — — V VOL Low Output Voltage — — 0.025 V RO Output Resistance — 7 10 IOUT = 10 mA, VDD = 18V; Any Drain IPK Peak Output Current (Any Drain) — 1.5 — A Duty cycle 2%, t 300 sec IDC Continuous Output Current (Any Drain) — — 100 mA IR Latch-Up Protection (Any Drain) Withstand Reverse Current Switching Time (Note 1) tR Rise Time — 25 30 nsec Figure 3-1, C L = 1000 pF tF Fall Time — 25 30 nsec Figure 3-1, C L = 1000 pF tD1 Delay Time — 15 30 nsec Figure 3-1, C L = 1000 pF tD2 Delay Time — 32 50 nsec Figure 3-1, C L = 1000 pF Power Supply IS Power Supply Current — 4.5 0.4 mA V IN = 3V (Both Inputs) VIN = 0V (Both Inputs) Note 1: Switching times ensured by design.
DS21418D-page 4 2002-2012 Microchip Technology Inc. TC4404/TC4405 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Over operating temperature range with 4.5V VDD18V, unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions VIH Logic 1, High Input Voltage 2.4 — — V VIL Logic 0, Low Input Voltage — — 0.8 V IIN Input Current -10 — 10 A0 V VINVDD Output VOH High Output Voltage V DD – 0.025 — — V VOL Low Output Voltage — — 0.025 V RO Output Resistance — 9 12 IOUT = 10 mA, VDD = 18V; Any Drain IPK Peak Output Current (Any Drain) — 1.5 — A Duty cycle 2%, t 300 sec IDC Continuous Output Current (Any Drain) — — 100 mA IR Latch-Up Protection (Any Drain) Withstand Reverse Current Switching Time (Note 1) tR Rise Time — — 40 nsec Figure 3-1, C L = 1000 pF tF Fall Time — — 40 nsec Figure 3-1, C L = 1000 pF tD1 Delay Time — — 40 nsec Figure 3-1, C L = 1000 pF tD2 Delay Time — — 60 nsec Figure 3-1, C L = 1000 pF Power Supply IS Power Supply Current — 0.6 mA V IN = 3V (Both Inputs) VIN = 0V (Both Inputs) Note 1: Switching times ensured by design.
2002-2012 Microchip Technology Inc. DS21418D-page 5 TC4404/TC4405
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP, SOIC, CERDIP) Symbol Description 1V DD Supply input, 4.5V to 18V. 2 IN A Control input A, TTL/CMOS compatible input. 3 IN B Control input A, TTL/CMOS compatible input. 4 GND Ground. 5 B BOTTOM Output B, pull-down. 6 B TOP Output B, pull-up. 7 A BOTTOM Output A, pull-down. 8 A TOP Output A, pull-up.
DS21418D-page 6 2002-2012 Microchip Technology Inc.
3.0 APPLICATIONS INFORMATION
3.1 Circuit Layout Guidelines
Avoid long power supply and ground traces (added inductance causes unwanted voltage transients). Use power and ground planes wherever possible. In addition, it is advisable that low ESR bypass capac- itors (4.7 F or 10 F tantalum) be placed as close to the driver as possible. The driver should be physically located as close to the device it is driving as possible to minimize the length of the output trace. FIGURE 3-1: Switching Time Test Circuit
3.2 Typical Applications
FIGURE 3-2: Zero Crossover Current Totem-Pole Switch FIGURE 3-3: Driving Bipolar Transistors CL = 1000 pF +5V 10% 90% 10% 90% 10% 90%18V 90% 10% 10% 10% 90% +5V 18V 90% 2 8,7 0.1 μF4.7 μF Inverting Driver Noninverting Driver Input VDD = 18V Input Output tD1 tF tR tD2Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 nsec Output Input Output tD1 tF tR tD2 RT RT VDD (4.5V - 18V) From TTL GND VOUTTC4404 GND TC4405 RIB VDD (4.5V - 18V) From TTL RIB
DS21418D-page 8 2002-2012 Microchip Technology Inc.
4.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Fall Time vs. Supply VoltageRise Time vs. Supply Voltage tRISE (nsec) 468 1 0 1 2 14 16 18 100 pF 470 pF 2200 pF 1500 pF 100 1000 pF tFALL (nsec) 468 1 0 1 2 14 16 18 100 pF 470 pF 1000 pF 2200 pF 1500 pF 100 Rise TIme vs. Capacitive Load 100 1000 10,000 CLOAD (pF) 10V 15V tRISE (nsec) 100 VDD (V) VDD (V) TA = +25°CTA = +25°CTA = +25°C VDD = 5V Rise and Fall Times vs. Temperature Propagation Delay vs. Supply VoltageFall Time vs. Capacitive Load 468 1 0 1 2 14 16 18 DELAY TIME (nsec) VDD (V) TIME (nsec) TEMPERATURE (°C) -55 -35 5 25 45 65 85 105 125-15 tFALL (nsec) 100 1000 10,000 100 C LOAD (pF) 10V 15V tD1 TA = +25°C tD2 VDD = 5V CLOAD = 1000 pF VDD = 17.5V CLOAD = 1000 pF TA = +25°C tFALL tRISE Quiescent Supply Current vs. Voltage TEMPERATURE (°C) IQUIESCENT (mA) 186 8 10 12 14 16 DELAY TIME (nsec) VDRIVE (V) DELAY TIME (nsec) Effect of Input Amplitude on Delay Time Propagation Delay Time vs. Temperature -55 -35 -15 5 25 45 65 85 105 125 BOTH INPUTS = 1 BOTH INPUTS = 0 02468 1 0 VDD (V) 0.1 tD1 TA = +25°C tD2 CLOAD = 1000pF VDD = 10V TA = +25°C VDD = 17.5V VLOAD = 1000pF tD1 tD2
2002-2012 Microchip Technology Inc. DS21418D-page 9 TC4404/TC4405 TYPICAL CHARACTERISTICS (CONTINUED) Pull-Up Output Resistance TEMPERATURE (°C) IQUIESCENT (mA) 4.0 3.5 3.0 2.5 2.0 -55 -35 -15 5 25 45 65 85 105 125 Quiescent Supply Current vs. Temperature RDS(ON) (Ω) 468 1 0 1 2 14 16 18 468 1 0 1 2 14 16 18 Pull-Down Output Resistance WORST CASE @ TJ = +150°C TYP @ +25°CTYP @ +25°C WORST CASE @ TJ = +150°C RDS(ON) (Ω) VDD = 18V BOTH INPUTS = 1 VDD (V)VDD (V)
DS21418D-page 10 2002-2012 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Package marking data not available at this time.
5.2 Taping Formpp g ( )
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size Standard Reel Component Orientation for 713 Suffix Device Pin 1 User Direction of Feed P W
2002-2012 Microchip Technology Inc. DS21418D-page 11 TC4404/TC4405
5.3 Package Dimensions
3° Min. Pin 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
DS21418D-page 12 2002-2012 Microchip Technology Inc. Package Dimensions (Continued) .400 (10.16) .370 (9.40) .300 (7.62) .230 (5.84) .065 (1.65) .045 (1.14) Pin 1 .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18) .110 (2.79) .090 (2.29) .020 (0.51) .016 (0.41) .040 (1.02) .020 (0.51) .320 (8.13) .290 (7.37) .150 (3.81) Min. 3° Min. 8-Pin CERDIP (Narrow) .015 (0.38) .008 (0.20) .400 (10.16) .320 (8.13) Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21418D-page 13 TC4404/TC4405 .050 (1.27) Typ. 8° Max. Pin 1 .244 (6.20) .228 (5.79) .157 (3.99) .150 (3.81) .197 (5.00) .189 (4.80) .020 (0.51) .013 (0.33) .010 (0.25) .004 (0.10) .069 (1.75) .007 (0.18) .050 (1.27) .016 (0.40) 8-Pin SOIC Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
DS21418D-page 14 2002-2012 Microchip Technology Inc.
6.0 REVISION HISTORY
Revision D (December 2012) Added a note to each package outline drawing.
2002-2012 Microchip Technology Inc. DS21418D-page 15 TC4404/TC4405 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:
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DS21418D-page 16 2002-2012 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response From: Name Company Address City / State / ZIP / Country Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: DS21418DTC4404/TC4405 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document?
2002-2012 Microchip Technology Inc. DS21418D-page 17 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767931 Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions.
- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
- Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are co mmitted to continuously improvin g the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT S YSTEM CERTIFIED BY DNV == ISO/TS 16949 ==
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