TC4403_13 MICROCHIP | Alldatasheet
Document overview
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Technical content
Features
- Low Quiescent Current: 300 A Max
- Capacitive Inputs With 300mV Hysteresis
- Both Inputs Must Be Driven to Drive Load
- Low Output Leakage
- High Peak Current Capability
- Fast Output Rise Time
- Outputs Individually Testable
Applications
- Isolated Load Drivers
- P u l s e r s
- Safety Interlocks Device Selection Table Package Type General Description The TC4403 is a modified version of the TC4425 driver, intended to drive floating or isolated loads requiring high-current pulses. The load is intended to be con- nected between the outputs without other reference to supply or ground. Then, only when both logic inputs and the V DD input are energized, is power supplied to the load. This construction allows the implementation of a wide variety of redundant input controllers. The low OFF-state output leakage and independence of the two half-circuits permit a wide variety of testing schemes to be utilized to assure functionality. The high peak current capability, short internal delays, and fast output rise and fall times ensure that sufficient power will be available to the load when it is needed. The TTL and CMOS compatible inputs allow operation from a wide variety of input devices. The ability to swing the inputs negative without affecting device performance allows negative biases to be placed on the inputs for greater safety. In addition, the capacitive nature of the inputs allows the use of series resistors on the inputs for extra noise suppression. The TC4403 is built for outstanding ruggedness and reliability in harsh applications. Input voltage excur- sions above the supply voltage or below ground are clamped internally without damaging the device. The output stages are power MOSFETs with high-speed body diodes to prevent damage to the driver from inductive kickbacks. Part Number Package Temp. Range TC4403CPA 8-Pin PDIP 0°C to +70°C TC4403EPA 8-Pin PDIP -40°C to +85°C TC4403MJA 8-Pin CERDIP -55°C to +125°C TC4403 OUT (GND)IN (GND) GND IN (VDD) VDD OUT (VDD) NCNC 8-Pin PDIP/CERDIP 1.5A High-Speed, Floating Load Driver
DS21417C-page 2 2002-2012 Microchip Technology Inc. Functional Block Diagram Typical Application TC4403 300mV Input Hysteresis Effective Input C = 20pF (Each Input) GND IN (VDD) IN (GND) 4 OUT (VDD) OUT (GND) VDD Power 1 MΩ RLOADTC4403 -15V 1 MΩ +15V RT RT TC4422 Fire Arm
2002-2012 Microchip Technology Inc. DS21417C-page 3 TC4403
1.0 ELECTRICAL
Absolute Maximum Ratings* Package Thermal Resistance Operating Temperature Range *Stresses above those list ed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC4403 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = +25°C, with 4.5V VDD18V, unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions Input VIH Logic 1, High Input Voltage 2.4 — — V VIL Logic 0, Low Input Voltage — — 0.8 V IIN Input Current -1000 ±10 ±1000 nA -5V VINVDD Output VOH High Output Voltage V DD – 0.025 — — V VOL Low Output Voltage — — 0.025 V ROS Sourcing Output Resistance — 2.8 5 IOUT = 10mA, VDD = 18V ROG Grounding Output Resistance — 3.5 5 IOUT = -10mA, VDD = 18V IPK Peak Output Current — 1.5 — A Switching Time (Note 1) tR Rise Time — 23 35 nsec Figure 3-1, C L = 1800pF tF Fall Time — 25 35 nsec Figure 3-1, C L = 1800pF tD1 Delay Time — 33 75 nsec Figure 3-1, C L = 1800pF tD2 Delay Time — 38 75 nsec Figure 3-1, C L = 1800pF Power Supply I S Power Supply Current — 1.5 0.15 2.5 0.25 mA V IN = 3V (Both Inputs) VIN = 0V (Both Inputs) Note 1: Switching times ensured by design.
DS21417C-page 4 2002-2012 Microchip Technology Inc. TC4403 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Over operating temperature range with 4.5V VDD 18V, unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions Input VIH Logic 1, High Input Voltage 2.4 — — V VIL Logic 0, Low Input Voltage — — 0.8 V IIN Input Current -10,000 ±10 ±10,000 nA -5V VINVDD Output VOH High Output Voltage V DD – 0.025 — — V VOL Low Output Voltage — — 0.025 V ROS Sourcing Output Resistance — 3.7 8 VIN= 2.4V, IOUT = 10mA, VDD = 18V ROG Grounding Output Resistance — 4.3 8 VIN= 2.4V, IOUT = -10mA, VDD = 18V Switching Time (Note 1) tR Rise Time — 28 60 nsec Figure 3-1, C L = 1800pF tF Fall Time — 32 60 nsec Figure 3-1, C L = 1800pF tD1 Delay Time — 32 100 nsec Figure 3-1, C L = 1800pF tD2 Delay Time — 38 100 nsec Figure 3-1, C L = 1800pF Power Supply IS Power Supply Current — 0.2 3.5 0.3 mA V IN = 3V (Both Inputs) VIN = 0V (Both Inputs) Note 1: Switching times ensured by design.
2002-2012 Microchip Technology Inc. DS21417C-page 5 TC4403
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP, CERDIP) Symbol Description 1 NC No connection. 2I N ( V DD) Control input V DD, TTL/CMOS compatible logic input signal, controls OUT (V DD). 3 GND Ground. 4 IN (GND) Control Input GND, TTL/CMOS compatible logic input signal, controls OUT (GND). 5 OUT (GND) Output GND, CMOS Pull Down Output. DD Supply Input, 4.5V to 18V. 7O U T ( V DD) Output V DD, CMOS pull-up output. 8 NC No connection.
DS21417C-page 6 2002-2012 Microchip Technology Inc.
3.0 APPLICATIONS INFORMATION
FIGURE 3-1: SWITCHING TIME TEST CIRCUITS Input VDD Input GND 0.1μF MLC 1μF WIMA MKS-2 10kΩ TC4403 0.1μF MLC 10KΩ TC4403 +5V 10% 90% 10% 16V 10% 90% 10% 1μF WIMA MKS-2 Input VDD VDD = 16V Input Output tD1 tF CL = 1800pF Output tR +5V 16V Input Output tD1 CL = 1800pF Output VDD = 16V Input GND
2002-2012 Microchip Technology Inc. DS21417C-page 7 TC4403
4.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. tRISE (nsec) 4 6 8 10 12 14 16 18 Rise Time vs. Supply Voltage 100 p1000pF pp4700pF 3300pF 470pF p1500pF pp2200pF TA °C VDD (V) Rise Time vs. Capacitive Load 100 1000 10,000 CLOAD (pF) 10V 15V 100 TA = +25°C tRISE (nsec)TIME (nsec) Rise and Fall Times vs. Temperature -55 -35 5 25 45 65 85 105 125-15 TEMPERATURE (°C) tFALL tRISE tFALL tRISE C = 2200pF V = 18V tFALL (nsec) 4 6 8 10 12 14 16 18 Fall Time vs. Supply Voltage 100 p1000pF 1500pFp pp4700pF 3300pF pp2200pF 44470pF VDD (V) TA = +25°C Fall Time vs. Capacitive Load 100 1000 10,000 10V 15V 100 TA = +25°C tFALL (nsec) CLOAD (pF) Propagation Delay vs. Input Amplitude 100 DELAY TIME (nsec) INPUT (V) 0 1 2 3 4 5 6 7 8 9 10 11 12 tD1 tD2 C = 2200pF VDD
DS21417C-page 8 2002-2012 Microchip Technology Inc. TYPICAL CHARACTERISTICS (CONTINUED) Delay Time vs. Supply Voltage 4 6 8 10 12 14 16 18 DELAY TIME (nsec) VDD (V) C T °C tD1 tD2 0.1 0.01 4 6 8 10 12 14 16 18 IQUIESCENT (mA) Quiescent Current vs. Voltage BOTH INPUTS = 1 BOTH INPUTS = 0 VDD (V) TA = +25°CC 5.7 5.1 4.5 3.9 3.3 2.7 2.1 1.5 75 150 225 300
75 HOURS
2.768V CLOSED CIRCUIT VOLTAGE HOURS OF SERVICE 2.727V Typical Discharge Characteristics Delay Time vs. Temperature DELAY TIME (ns) -55 -35 -15 5 25 45 65 85 105 125 TEMPERATURE (°C) CCLOAD = 2200pF tD1 tD2 -55 -35 -15 5 25 45 65 85 105 125 Quiescent Current vs. Temperature 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 INPUTS = 1 INPUTS = 0 TEMPERATURE (°C) IQUIESCENT (mA) 200 400 600 800 1000 1200 1400 1600 0 10 20 30 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (°C) MAX. POWER (mW)
8 Pin DIP
88 Pin CERDIP
2002-2012 Microchip Technology Inc. DS21417C-page 9 TC4403
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Package marking data not available at this time.
5.2 Package Dimensions
3° MIN. PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
DS21417C-page 10 2002-2012 Microchip Technology Inc. .400 (10.16) .370 (9.40) .300 (7.62) .230 (5.84) .065 (1.65) .045 (1.14) PIN 1 .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18) .110 (2.79) .090 (2.29) .020 (0.51) .016 (0.41) .040 (1.02) .020 (0.51) .320 (8.13) .290 (7.37) .150 (3.81) MIN. 3° MIN. 8-Pin CERDIP (Narrow) .015 (0.38) .008 (0.20) .400 (10.16) .320 (8.13) Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21417C-page 11 TC4403
6.0 REVISION HISTORY
Revision C (December 2012) Added a note to each package outline drawing.
DS21417C-page 12 2002-2012 Microchip Technology Inc. NOTES:
2002-2012 Microchip Technology Inc. DS21417C-page13 TC4403 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an e rrata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21417C-page14 2002-2012 Microchip Technology Inc. NOTES:
2002-2012 Microchip Technology Inc. DS21417C-page 15 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767924 Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions.
- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
- Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are co mmitted to continuously improvin g the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT S YSTEM CERTIFIED BY DNV == ISO/TS 16949 ==
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