TC426 MICROCHIP | Alldatasheet
Document overview
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Technical content
Features
- High-Speed Switching (C L = 1000pF): 30nsec High Peak Output Current: 1.5A High Output Voltage Swing -V DD -25mV - GND +25mV Low Input Current (Logic "0" or "1"): 1 µA TTL/CMOS Input Compatible Available in Inverting and Noninverting Configurations Wide Operating Supply Voltage - 4.5V to 18V Current Consumption - Inputs Low – 0.4mA - Inputs High – 8mA Single Supply Operation Low Output Impedance: 6 Ω Pinout Equivalent of DS0026 and MMH0026 Latch-Up Resistant: Withstands > 500mA Reverse Current ESD Protected: 2kV
Applications
Switch Mode Power Supplies Pulse Transformer Drive Clock Line Driver Coax Cable Driver Device Selection Table Package Type General Description The TC426/TC427/TC428 are dual CMOS high-speed drivers. A TTL/CMOS input voltage level is translated into a rail-to-rail output voltage level swing. The CMOS output is within 25mV of ground or positive supply. The low impedance, high-current driver outputs swing a 1000pF load 18V in 30nsec. The unique current and voltage drive qualities make the TC426/TC427/TC428 ideal power MOSFET drivers, line drivers, and DC-to- DC converter building blocks. Input logic signals may equal the power supply voltage. Input current is a low 1 µA, making direct interface to CMOS/bipolar switch-mode power supply control ICs possible, as well as open-collector analog comparators. Quiescent power supply current is 8mA maximum. The TC426 requires 1/5 the current of the pin-compatible bipolar DS0026 device. This is important in DC-to-DC converter applications with power efficiency constraints and high-frequency switch-mode power supply applications. Quiescent current is typically 6mA when driving a 1000pF load 18V at 100kHz. The inverting TC426 driver is pin-compatible with the bipolar DS0026 and MMH0026 devices. The TC427 is noninverting; the TC428 contains an inverting and non- inverting driver. Other pin compatible driver families are the TC1426/ TC1427/TC1428, TC4426/TC4427/TC4428 and TC4426A/TC4427A/TC4428A. Part Number Package Configuration Temp. Range TC426COA TC426CPA TC426EOA TC426EPA TC426IJA TC426MJA 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin CERDIP Inverting Inverting Inverting Inverting Inverting Inverting 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -25°C to +85°C -55°C to +125°C TC427COA TC427CPA TC427EOA TC427EPA TC427IJA TC427MJA 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin CERDIP Noninverting Noninverting Noninverting Noninverting Noninverting Noninverting 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -25°C to +85°C -55°C to +125°C TC428COA TC428CPA TC428EOA TC428EPA TC428IJA TC428MJA 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin CERDIP Complementary Complementary Complementary Complementary Complementary Complementary 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -25°C to +85°C -55°C to +125°C TC426 NC OUT A OUT B NC IN A GND IN B NC = No internal connection 2, 4 7, 5 Inverting TC427 NC OUT A OUT B NC IN A GND IN B 2, 4 7, 5 Noninverting TC428 NC OUT A OUT B NC IN A GND IN B 2 7 4 5VDD Complementary VDD VDD 8-Pin PDIP/SOIC/CERDIP 1.5A Dual High-Speed Power MOSFET Drivers
DS21415B-page 2 2002 Microchip Technology Inc. Functional Block Diagram Input ≈2.5mA ≈500µA NOTE: TC428 has one inverting and one noninverting driver. Ground any unused driver input. Inverting Output Noninverting Output (TC426)(TC427) GND TC426 TC427 TC428
2002 Microchip Technology Inc. DS21415B-page 3 TC426/TC427/TC428
1.0 ELECTRICAL
Absolute Maximum Ratings* Input Voltage, Any Terminal Power Dissipation (TA ≤ 70°C) Derating Factor Operating Temperature Range *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC426/TC427/TC428 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = +25°C with 4.5V ≤ VDD ≤ 18V, unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions Input VIH Logic 1, High Input Voltage 2.4 —— V VIL Logic 0, Low Input Voltage —— 0.8 V IIN Input Current -1 — 1 µA0 V ≤ VIN ≤ VDD Output VOH High Output Voltage V DD – 0.025 —— V VOL Low Output Voltage —— 0.025 V ROH High Output Resistance — 10 15 Ω IOUT = 10mA, VDD = 18V ROL Low Output Resistance — 61 0 Ω IOUT = 10mA, VDD = 18V IPK Peak Output Current — 1.5 — A Switching Time (Note 1) tR Rise Time —— 30 nsec Figure 3-1, Figure 3-2 tF Fall Time —— 30 nsec Figure 3-1, Figure 3-2 tD1 Delay Time —— 50 nsec Figure 3-1, Figure 3-2 tD2 Delay Time —— 75 nsec Figure 3-1, Figure 3-2 Power Supply IS Power Supply Current — 0.4 mA V IN = 3V (Both Inputs) VIN = 0V (Both Inputs) Note 1: Switching times ensured by design.
DS21415B-page 4 2002 Microchip Technology Inc. TC426/TC427/TC428 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Over operating temperature range with 4.5V ≤ VDD ≤ 18V, unless otherwise noted. Input VIH Logic 1, High Input Voltage 2.4 —— V VIL Logic 0, Low Input Voltage —— 0.8 V IIN Input Current -10 — 10 µA0 V ≤ VIN ≤ VDD Output VOH High Output Voltage V DD – 0.025 —— V VOL Low Output Voltage —— 0.025 V ROH High Output Resistance — 13 20 Ω IOUT = 10mA, VDD = 18V ROL Low Output Resistance — 81 5 Ω IOUT = 10mA, VDD = 18V Switching Time (Note 1) tR Rise Time —— 60 nsec Figure 3-1, Figure 3-2 tF Fall Time —— 60 nsec Figure 3-1, Figure 3-2 tD1 Delay Time —— 75 nsec Figure 3-1, Figure 3-2 tD2 Delay Time —— 120 nsec Figure 3-1, Figure 3-2 Power Supply I S Power Supply Current — 0.6 mA V IN = 3V (Both Inputs) VIN = 0V (Both Inputs) Note 1: Switching times ensured by design.
2002 Microchip Technology Inc. DS21415B-page 5 TC426/TC427/TC428
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP, SOIC, CERDIP) Symbol Description 1 NC No Internal Connection. 2 IN A Control Input A, TTL/CMOS compatible logic input. 3 GND Ground. 4 IN B Control Input B, TTL/CMOS compatible logic input. 5 OUT B CMOS totem-pole output. DD Supply input, 4.5V to 18V. 7 OUT A CMOS totem-pole output. 8 NC No internal Connection.
DS21415B-page 6 2002 Microchip Technology Inc.
3.0 APPLICATIONS INFORMATION
3.1 Supply Bypassing
Charging and discharging large capacitive loads quickly requires large currents. For example, charging a 1000pF load to 18V in 25nsec requires an 0.72A current from the device power supply. To ensure low supply impedance over a wide frequency range, a parallel capacitor combination is recom- mended for supply bypassing. Low-inductance ceramic disk capacitors with short lead lengths (< 0.5 in.) should be used. A 1µF film capacitor in parallel with one or two 0.1µF ceramic disk capacitors normally provides adequate bypassing.
3.2 Grounding
The TC426 and TC428 contain inverting drivers. Ground potential drops developed in common ground impedances from input to output will appear as negative feedback and degrade switching speed characteristics. Individual ground returns for the input and output circuits or a ground plane should be used.
3.3 Input Stage
The input voltage level changes the no-load or quiescent supply current. The N-channel MOSFET input stage transistor drives a 2.5mA current source load. With a logic "1" input, the maximum quiescent supply current is 8mA. Logic "0" input level signals reduce quiescent current to 0.4mA maximum. Minimum power dissipation occurs for logic "0" inputs for the TC426/TC427/TC428. Unused driver inputs must be connected to V DD or GND. The drivers are designed with 100mV of hysteresis. This provides clean transitions and minimizes output stage current spiking when changing states. Input voltage thresholds are approximately 1.5V, making the device TTL compatible over the 4.5V to 18V supply operating range. Input current is less than 1µA over this range. The TC426/TC427/TC428 may be directly driven by the TL494, SG1526/1527, SG1524, SE5560, and similar switch-mode power supply integrated circuits.
3.4 Power Dissipation
The supply current vs frequency and supply current vs capacitive load characteristic curves will aid in determining power dissipation calculations. The TC426/TC427/TC428 CMOS drivers have greatly reduced quiescent DC power consumption. Maximum quiescent current is 8mA compared to the DS0026 40mA specification. For a 15V supply, power dissipation is typically 40mW. Two other power dissipation components are: Output stage AC and DC load power. Transition state power. Output stage power is: Po = P DC + PAC = Vo (IDC) + f CL VS Where: Vo = DC output voltage IDC = DC output load current f = Switching frequency Vs = Supply voltage In power MOSFET drive applications the P DC term is negligible. MOSFET power transistors are high imped- ance, capacitive input devices. In applications where resistive loads or relays are driven, the PDC component will normally dominate. The magnitude of PAC is readily estimated for several cases: A. B. 1. f = 200kHZ 1. f = 200kHz 2. CL =1000pf 2. C L =1000pf 3. Vs = 18V 3. Vs = 15V 4. P AC = 65mW 4. P AC = 45mW During output level state changes, a current surge will flow through the series connected N and P channel output MOSFETS as one device is turning "ON" while the other is turning "OFF". The current spike flows only during output transitions. The input levels should not be maintained between the logic "0" and logic "1" levels. Unused driver inputs must be tied to ground and not be allowed to float. Average power dissipation will be reduced by minimizing input rise times. As shown in the characteristic curves, average supply current is frequency dependent.
DS21415B-page 8 2002 Microchip Technology Inc.
4.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -25 0 25 150 TIME (ns) Rise and Fall Times vs. Temperature 50 75 100 125 TEMPERATURE (°C) DELAY TIME (ns) Delay Times vs. Supply Voltage SUPPLY VOLTAGE (V) 51 0 1 5 20 tD2 05 10 15 20 TIME (ns) SUPPLY VOLTAGE (V) tR tF CL = 1000pF TA = +25°C Rise and Fall Times vs. Supply Voltage CL = 1000pF TA = +25°C CL = 1000pF VDD = 18V tR tF tD1 100 10 1000 10K TIME (ns) CAPACITIVE LOAD (pF) Rise and Fall Times vs. Capacitive Load 100 0-25 50 100 150 DELAY TIME (ns) TEMPERATURE (°C) Delay Times vs. Temperature 100 25 75 125 SUPPLY CURRENT (mA) Supply Current vs. Capacitive Load 400kHz 200kHz 20kHz 100 1000 10K CAPACITIVE LOAD (pF) CL = 1000pF VDD = 18V tD2 tD1 TA = +25°C VDD = 18V TA = +25°C VDD = 18V tR tF 0.96 0.72 0.48 0.24 0 10 OUTPUT VOLTAGE (V) Low Output vs. Voltage 1.20 20 30 40 50 60 70 80 90 100 CURRENT SUNK (mA) 10V 15V 1.76 1.32 0.88 0.44 0 10 High Output vs. Voltage 2.20 20 30 40 50 60 70 80 90 100 CURRENT SOURCED (mA) 18V VDD – VOUT (V) 13V SUPPLY CURRENT (mA) Supply Current vs. Frequency 10 100 1000 FREQUENCY (kHz) 10V TA = +25°C VDD = 5V VDD = 8V VDD = 18V CL = 1000pF TA = +25°C TA = +25°C
2002 Microchip Technology Inc. DS21415B-page 9 TC426/TC427/TC428 TYPICAL CHARACTERISTICS (CONTINUED) SUPPLY VOLTAGE (V) 50 100 150 200 250 300 SUPPLY CURRENT (µA) Supply Voltage vs. Quiescent Supply Current No Load Both Inputs Logic "0" T A = +25°C 123456 SUPPLY VOLTAGE (V) SUPPLY CURRENT (mA) Supply Voltage vs. Quiescent Supply Current No Load Both Inputs Logic "1" T A = +25°C 200 400 600 800 1000 1200 1400 1600 0 10 20 30 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (°C) MAX. POWER (mW) 8-Pin DIP 8-8-Pin CERDIP 8-Pin SOIC Thermal Derating Curves
DS21415B-page 10 2002 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Package marking data not available at this time.
5.2 Package Dimensions
3° MIN. PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm) .400 (10.16) .370 (9.40) .300 (7.62) .230 (5.84) .065 (1.65) .045 (1.14) PIN 1 .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18) .110 (2.79) .090 (2.29) .020 (0.51) .016 (0.41) .040 (1.02) .020 (0.51) .320 (8.13) .290 (7.37) .150 (3.81) MIN. 3° MIN. 8-Pin CERDIP (Narrow) .015 (0.38) .008 (0.20) .400 (10.16) .320 (8.13) Dimensions: inches (mm)
2002 Microchip Technology Inc. DS21415B-page 11 TC426/TC427/TC428 Package Dimensions (Continued) .050 (1.27) TYP. 8° MAX. PIN 1 .244 (6.20) .228 (5.79) .157 (3.99) .150 (3.81) .197 (5.00) .189 (4.80) .020 (0.51) .013 (0.33) .010 (0.25) .004 (0.10) .069 (1.75) .007 (0.18) .050 (1.27) .016 (0.40) 8-Pin SOIC Dimensions: inches (mm)
DS21415B-page 12 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21415B-page13 TC426/TC427/TC428 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21415B-page14 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21415B-page 15 TC426/TC427/TC428 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, K EELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Tech- nology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
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