TC2054 MICROCHIP | Alldatasheet
Document overview
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Technical content
Features
- Very Low Supply Current (55µA Typ.) for Longer Battery Life Very Low Dropout Voltage: 140mV (Typ.) @ 150mA High Output Voltage Accuracy: ±0.4% (Typ) Standard or Custom Output Voltages Power-Saving Shutdown Mode ERROR Output Can Be Used as a Low Battery Detector or Processor Reset Generator Fast Shutdown Reponse Time: 60 µsec (Typ) Over-Current Protection Space-Saving 5-Pin SOT-23A Package Pin Compatible Upgrades for Bipolar Regulators
Applications
Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular / GSMS / PHS Phones Pagers Device Selection Table Package Type General Description The TC2054, TC2055 and TC2186 are high accuracy (typically ±0.4%) CMOS upgrades for older (bipolar) low dropout regulators. Designed specifically for bat- tery-operated systems, the devices’ total supply current is typically 55µA at full load (20 to 60 times lower than in bipolar regulators). The devices’ key features include ultra low noise oper- ation, very low dropout voltage - typically 45mV (TC2054); 90mV (TC2055); and 140mV (TC2186) at full load - and fast response to step changes in load. An error output (ERROR ) is asserted when the devices are out-of-regulation (due to a low input voltage or exces- sive output current). Supply current is reduced to 0.5µA (max) and both V OUT and ERROR are disabled when the shutdown input is low. The devices also incorporate over-current protection. The TC2054, TC2055 and TC2186 are stable with a low esr ceramic output capacitor of 1 µF and have a maximum output current of 50mA, 100mA and 150mA, respectively. This LDO Family also features a fast response time (60 µsec typically) when released from shutdown. Typical Application Part Number Package Junction Temp. Range TC2054-xxVCT 5-Pin SOT-23A* -40°C to +125°C TC2055-xxVCT 5-Pin SOT-23A* -40°C to +125°C TC2186-xxVCT 5-Pin SOT-23A* -40°C to +125°C Note: *5-Pin SOT-23A is equivalent to EIAJ (SC-74A). TC2054 TC2055 TC2186 5-Pin SOT-23A* TOP VIEW SHDN ERROR GND VOUT VIN 1µF Shutdown Control (from Power Control Logic) TC2054 TC2055 TC2186 VIN 5VIN VOUT ERRORSHDN GND VOUT ERROR 1µF TC2054/2055/2186 50mA, 100mA, and 150mA CMOS LDOs with Shutdown and Error Output
DS21663B-page 2 2002 Microchip Technology Inc.
1.0 ELECTRICAL
ABSOLUTE MAXIMUM RATINGS* *Stresses above those listed under “Absolute Maxi- mum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods my affect device reliability. TC2054/2055/2186 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN =V R +1 V ,IL =1 0 0µA, CL =3 . 3µF, SHDN >V IH,T A = 25°C, unless otherwise noted. BOLDFACE type specifications apply for junction temperature of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions VIN Input Operating Voltage 2.7 — 6.0 V Note 1 IOUTMAX Maximum Output Current 50 100 150 mA TC2054 TC2055 TC2186 VOUT Output Voltage VR -2 . 0 % VR ±0 . 4 % VR +2 . 0 % V Note 2 TCVOUT VOUT Temperature Coefficient ppm/°C Note 3 ∆VOUT/ ∆VIN Line Regulation — 0.05 0.5 %( V R +1 V )< VIN < 6V ∆VOUT/ VOUT Load Regulation -1.5 -2.5 0.5 0.5 0.5 0.5 % TC2054;TC2055 I L =0 . 1 m At oIOUTMAX TC2186 I L =0 . 1 m At oIOUTMAX Note 4 VIN –V OUT Dropout Voltage, Note 5 — 140 140 210 mV I L =1 0 0µA IL =5 0 m A TC2015; TC2185 I L =1 0 0 m A TC2185 I L =1 5 0 m A Note 5 IIN Supply Current — 55 80 µAS H D N =V IH,I L=0 IINSD Shutdown Supply Current — 0.05 0.5 µAS H D N =0 V PSRR Power Supply Rejection Ratio — 50 — dB F RE ≤ 120kHz IOUTSC Output Short Circuit Current 160 300 — mA V OUT =0 V ∆VOUT∆PD Thermal Regulation — 0.04 — V/W Note 6 eN Output Noise — 600 — nV / √Hz IL =I OUTMAX,F=1 0 k H z tR Response Time (from Shutdown Mode) —6 0— µsec V IN =4 V CIN =1 µF, COUT =1 0µF IL =0 . 1 m A ,Note 9 Note 1: The minimum V IN has to meet two conditions: VIN = 2.7V and VIN =V R +V DROPOUT. 3: TCVOUT = 4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, exclud- ing load or line regulation effects. Specifications are for a current pulse equal to I MAX at VIN = 6V for T = 10msec. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA,T J, θJA). 8: Hysteresis voltage is referenced by VR. 9: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. VOUTMAX VOUTMIN–() 106×
2002 Microchip Technology Inc. DS21663B-page 3 TC2054/2055/2186
2.0 PIN DESCRIPTIONS
T h ed e s c r i p t i o n so ft h ep i n sa r el i s t e di nT a b l e2 - 1 . TABLE 2-1: PIN FUNCTION TABLE SHDN Input VIH SHDN Input High Threshold 60 —— % V IN VIN = 2.5V to 6.0V VIL SHDN Input Low Threshold — — 15 %VIN VIN = 2.5V to 6.0V ERROR OUTPUT VINMIN Minimum VIN Operating Volt- age 1.0 — — V V OUT ≥ 2.7V VOL Output Logic Low Voltage — — 400 mV 1 mA Flows to ERROR VTH ERROR Threshold Voltage — 0.95 x V R — V S e eF i g u r e4 - 2 VHYS ERROR Positive Hysteresis — 50 — mV Note 8 tDELAY VOUT to ERROR Delay — 2 — msec V OUT from VR =3 Vt o2 . 8 V RERROR Resistance from ERROR to GND — 126 — Ω VDD =2 . 5 V ,VOUT =2 . 5 V Note 1: The minimum V IN has to meet two conditions: VIN =2 . 7 Va n dVIN =V R +V DROPOUT. 3: TCVOUT = 4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, exclud- ing load or line regulation effects. Specifications are for a current pulse equal to I MAX at VIN = 6V for T = 10msec. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA,T J, θJA). 8: Hysteresis voltage is referenced by VR. 9: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. Electrical Characteristics: VIN =V R +1 V ,IL =1 0 0µA, CL =3 . 3µF, SHDN >V IH,T A = 25°C, unless otherwise noted. BOLDFACE type specifications apply for junction temperature of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions VOUTMAX VOUTMIN–() 106× Pin Number Symbol Description 1V IN Unregulated supply input. 2 GND Ground terminal. 3 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero, ERROR is open circuited and supply current is reduced to 0.5µA (max). 4 ERROR Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-tolerance by approximately -5%. 5V OUT Regulated voltage output.
DS21663B-page 4 2002 Microchip Technology Inc.
3.0 DETAILED DESCRIPTION
The TC2054, TC2055 and TC2186 are precision fixed output voltage regulators. (If an adjustable version is desired, please see the TC1070, TC1071 or TC1187 data sheets.) Unlike bipolar regulators, the TC2054, TC2055 and TC2186 supply current does not increase with load current. In addition, V OUT remains stable and within regulation over the entire 0mA to maximum out- put current operating load range. Figure 3-1 shows a typical application circuit. The reg- ulator is enabled any time the shutdown input (SHDN is at or above V IH, and shutdown (disabled) when SHDN is at or below VIL. SHDN m a yb ec o n t r o l l e db ya CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 µA( t y p i c a l ) ,VOUT falls to zero volts, and ERROR is open-circuited. FIGURE 3-1: TYPICAL APPLICATION CIRCUIT
3.1 ERROR Open Drain Output
ERROR is driven low whenever VOUT falls out of regu- lation by more than -5% (typical). This condition may be caused by low input voltage, output current limiting or thermal limiting. The ERROR threshold is 5% below rated VOUT regardless of the programmed output volt- regulator and 2.85V (typ.) for a 3.0V regulator). ERROR output operation is shown in Figure 4-2. Note that ERROR is active when VOUT falls to VTH,a n d inactive when VOUT rises above VTH by VHYS. As shown in Figure 3-1, ERROR can be used as a bat- tery low flag or as a processor RESET signal (with the addition of timing capacitor C2). R1 x C2 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200msec to allow time for the system to stabilize. Pull-up resistor R1 can be tied to V OUT,V IN or any other voltage less than (V IN +0 . 3 V ) . The ERROR pin sink current is self-limiting to approxi- mately 18mA. FIGURE 3-2: ERROR OUTPUT OPERATION
3.2 Output Capacitor
A1 µF( m i n )c a p a c i t o rf r o mVOUT to ground is required. The output capacitor should have an effective series resistance of 0.01Ω.t o5 Ω for V OUT = 2.5V, and 0.05Ω. to 5Ω for VOUT <2 . 5 V . A1µF capacitor should be con- nected from V IN to GND if there is more than 10 inches of wire between the regulator and the AC filter capaci- tor, or if a battery is used as the power source. Ceramic, tantalum and aluminum electrolytic capacitors can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are rec- ommended for applications operating below -25°C). When operating from sources other than batteries, sup- ply-noise rejection and transient response can be improved by increasing the value of the input and out- put capacitors and employing passive filtering tech- niques. 1µF 0.2µF C2 Required Only if ERROR is used as a Processor RESET Signal (See Text) Shutdown Control (to CMOS Logic or Tie to VIN if unused) BATTLOW or RESET TC2054 TC2055 TC2186 VIN BATTERY VOUT ERRORSHDN GND VOUT 1µF VIH VOL ERROR VTH VOUT HYSTERESIS (VHYS)
2002 Microchip Technology Inc. DS21663B-page 5 TC2054/2055/2186
4.0 THERMAL CONSIDERATIONS
4.1 Power Dissipation
The amount of power the regulator dissipates is prima- rily a function of input and output voltage, and output current. The following equation is used to calculate worst case power dissipation: EQUATION 4-1: The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature AMAX), the maximum allowable die temperature (125 °C) and the thermal resistance from junction-to-air JA). The 5-Pin SOT-23A package has a θJA of approximately 220°C/Watt when mounted on a typical two layer FR4 dielectric copper clad PC board. EQUATION 4-2: Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within lim- its. For example: Maximum allowable power dissipation: = 318mW In this example, the TC2054 dissipates a maximum of only 20.7mW; far below the allowable limit of 318mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits.
4.2 Layout Considerations
The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θ JA and, therefore, increase the maximum allowable power dissipation limit. PD ≈ (VIN –V OUTMIN)ILOADMAX Where: PD = Worst case actual power dissipation VINMAX = Maximum voltage on V IN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current Where all terms are previously defined PDMAX TJMAX TAMAX θJA Given: VINMAX =3 . 0 V ± 5 % VOUTMIN = 2.7V – 2.5% ILOADMAX = 40mA TAMAX = 55°C Find 1. Actual power dissapation 2. Maximum allowable dissapation Actual power dissipation: PD ≈ (VINMAX –V OUTMIN)ILOADMAX = 20.7mW PDMAX TJMAX TAMAX –() θJA 125 55–()
DS21663B-page 6 2002 Microchip Technology Inc.
5.0 TYPICAL CHARACTERISTICS
FIGURE 5-1: POWER SUPPLY REJECTION RATIO FIGURE 5-2: POWER SUPPLY REJECTION RATIO FIGURE 5-3: OUTPUT NOISE FIGURE 5-4: POWER SUPPLY REJECTION RATIO FIGURE 5-5: POWER SUPPLY REJECTION RATIO FIGURE 5-6: DROPOUT VOLTAGE VS. I LOAD Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. f (Hz) -100 -80 -60 -40 -20 10 100 1k 10k 100k 1M PSRR (dB) COUT = 1mF Ceramic IOUT = 100µA VINAC = 100mVp-p VINDC = 4V VOUTDC = 3V f (Hz) -100 -80 -60 -40 -20 10 100 1k 10k 100k 1M PSRR (dB) VINAC = 100mVp-p VINDC = 4V VOUTDC = 3V COUT = 1µF Ceramic IOUT = 150mA 0.01 0.1 1 10 100 1000 0.001 0.01 0.1 COUT = 1µF Frequency (KHz) Noise (mV/√Hz) f (Hz) -100 -80 -60 -40 -20 10 100 1k 10k 100k 1M PSRR (dB) COUT = 10µF Ceramic IOUT = 150mA VINAC = 100mVp-p VINDC = 4V VOUTDC = 3V f (Hz) -100 -80 -60 -40 -20 10 100 1k 10k 100k 1M PSRR (dB) VINAC = 100mVp-p VINDC = 4V VOUTDC = 3V COUT = 10µF Tantalum IOUT = 150mA 0.000 0.020 0.040 0.060 0.080 0.100 0.120 0.140 0.160 0 50 100 150 T = 130˚C T = -45˚C T = 25˚C ILOAD (mA) DOV (V) VOUT = 1.8V
2002 Microchip Technology Inc. DS21663B-page 9 TC2054/2055/2186 TYPICAL CHARACTERISTICS (CONT) FIGURE 5-19: V OUT TO ERROR DELAY VIN 1V/Div 1V/Div 2V/Div VOUT VERROR 2.8V 3.42V 3.0V 2.8V RPULLUP = 100kΩ IOUT = 0.3mA
DS21663B-page 10 2002 Microchip Technology Inc.
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
1 & 2 = part number code + temperature range and volt- age 3 represents year and 2-month period code 4 represents lot ID number
6.2 Taping Information
(V) TC2054 Code TC2055 Code TC2186 Code
1.8 SA TA VA
2 . 5 S BT BV B 2 . 7 S CT CV C 2 . 8 S DT DV D
2.85 SE TE VE
3 . 0 S FT FV F 3 . 3 S GT GV G User Direction of Feed Device Marking Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices PIN 1 Standard Reel Component Orientation TR Suffix Device (Mark Right Side Up) Reverse Reel Component Orientation RT Suffix Device (Mark Upside Down) W P Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 5-Pin SOT-23A 8 mm 4 mm 3000 7 in Carrier Tape, Number of Components Per Reel and Reel Size
2002 Microchip Technology Inc. DS21663B-page 11 TC2054/2055/2186
6.3 Package Dimensions
.071 (1.80) .059 (1.50) .122 (3.10) .098 (2.50) .075 (1.90) REF. .020 (0.50) .012 (0.30) PIN 1 .037 (0.95) REF. .122 (3.10) .106 (2.70) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) .024 (0.60) .004 (0.10) .004 (0.09) SOT-23A-5 Dimensions: inches (mm)
DS21663B-page 12 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21663B-page 13 TC2054/2055/2186 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. T o determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21663B-page 14 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21347B - page 15 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip T echnology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. Trademarks T h eM i c r o c h i pn a m ea n dl o g o ,t h eM i c r o c h i pl o g o ,F i l t e r L a b , KEELOQ,m i c r o I D ,M P L A B ,P I C ,P I C m i c r o ,P I C M A S T E R , PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Tech- nology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
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