TC2054-3.0VCTTR | DigiCamel IC Datasheet

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TC2054_09 MICROCHIP | Alldatasheet

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Technical content

Features

Low Supply Current (55 µA Typical) for Longer Battery Life
Low Dropout Voltage: 140 mV (Typical) @ 150 mA
High Output Voltage Accuracy: ±0.4% (Typical)
Standard or Custom Output Voltages
Power-Saving Shutdown Mode
ERROR Output Can Be Used as a Low Battery Detector or Processor Reset Generator
Fast Shutdown Reponse Time: 60 µs (Typical)
Overcurrent and Overtemperature Protection
Space-Saving 5-Pin SOT-23A Package
Pin Compatible Upgrades for Bipolar Regulators
Standard Output Voltage Options: 3.3V, 5.0V

Applications

Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular / GSMS / PHS Phones
Pagers Typical Application General Description The TC2054, TC2055 and TC2186 are high accuracy (typically ±0.4%) CMOS upgrades for older (bipolar) low dropout regulators. Designed specifically for battery-operated syst ems, the devices’ total supply current is typically 55 µA at full load (20 to 60 times lower than in bipolar regulators). The devices’ key features include low noise operation, low dropout voltage – typically 45 mV (TC2054); 90 mV (TC2055); and 140 mV (TC2186) at full load - and fast response to step changes in load. An error output (ERROR ) is asserted when the devices are out-of-regulation (due to a low input voltage or excessive output current). Supply current is reduced to 0.5 µA (maximum) and both V OUT and ERROR are disabled when the shutdown input is low. The devices also incorporate overcurrent and overtemperature protection. The TC2054, TC2055 and TC2186 are stable with a low esr ceramic output capacitor of 1 µF and have a maximum output current of 50 mA, 100 mA and 150 mA, respectively. This LDO Family also features a fast response time (60 µs typically) when released from shutdown. Package Type 1µ F Shutdown Control (from Power Control Logic) TC2054 TC2055 TC2186 VIN 5VIN VOUT ERRORSHDN GND VOUT ERROR 1µ F TC2054 TC2055 TC2186 1 3 ERROR GND VOUT VIN SHDN 5-Pin SOT-23A Top View 50 mA, 100 mA, and 150 mA CMOS LDOs with Shutdown and Error Output

1.0 ELECTRICAL

Absolute Maximum Ratings † † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods my affect device reliability. ELECTRICAL SPECIFICATIONS Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. BOLDFACE type specifications apply for junction temperature of -40°C to +125°C. Parameter Sym Min Typ Max Units Conditions Input Operating Voltage V IN 2.7 — 6.0 V Note 1 Maximum Output Current I OUTMAX 50 — — mA TC2054 100 — — TC2055 150 — — TC2186 Output Voltage V OUT VR - 2.0% V R ± 0.4% V R + 2.0% V Note 2 VOUT Temperature Coefficient TCVOUT — 20 — ppm/°C Note 3 —4 0— Line Regulation ΔVOUT/ ΔVIN Load Regulation ΔVOUT/ VOUT -1.0 0.33 +1.0 % TC2054;TC2055 I L = 0.1 mA to IOUTMAX -2.0 0.43 +2.0 TC2186 I L = 0.1 mA to IOUTMAX Note 6 Dropout Voltage, Note 7 VIN – VOUT —2— m V I L = 100 µA —4 57 0 I L = 50 mA — 90 140 TC2015; TC2185 I L = 100 mA — 140 210 TC2185 I L = 150 mA Note 7 Supply Current I IN — 55 80 µA SHDN = VIH, IL=0 Shutdown Supply Current I INSD — 0.05 0.5 µA SHDN = 0V Power Supply Rejection Ratio PSRR — 50 — dB F RE ≤ 100 kHz Output Short Circuit Current I OUTSC 160 300 — mA V OUT = 0V Note 1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. 3: TCVOUT = 6: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 7: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 8: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms. 9: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem- perature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). 10: Hysteresis voltage is referenced by VR. 11: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. VOUTMAX VOUTMIN–() 106×

DS21663D-page 4 © 2009 Microchip Technology Inc. TEMPERATURE CHARACTERISTICS Thermal Regulation ΔVOUT/ΔPD —0 . 0 4— V / W Note 8 Thermal Shutdown Die Temperature TSD — 160 — °C Output Noise eN — 600 — nV / √Hz IL = IOUTMAX, F = 10 kHz Response Time (from Shutdown Mode) tR —6 0— µ s V IN = 4V CIN = 1 µF, COUT = 10 µF IL = 0.1 mA, Note 11 SHDN Input SHDN Input High Threshold V IH 60 — — %V IN VIN = 2.5V to 6.0V SHDN Input Low Threshold V IL ——1 5 % V IN VIN = 2.5V to 6.0V ERROR OUTPUT Minimum VIN Operating Voltage VINMIN 1.0 — — V I OL = 0.1 mA Output Logic Low Voltage V OL — — 400 mV 1 mA Flows to ERROR, IOL = 1 mA, VIN = 2V ERROR Threshold Voltage V TH — 0.95 x V R — V See Figure 4-2 ERROR Positive Hysteresis V HYS —5 0— m V Note 10 VOUT to ERROR Delay t DELAY —2— m s V OUT from VR = 3V to 2.8V Resistance from ERROR to GND RERROR — 126 — Ω VDD = 2.5V, VOUT = 2.5V Electrical Specifications: Unless otherwise noted, VDD = +2.7V to +6.0V and VSS = GND. Parameters Sym Min Typ Max Units Conditions Temperature Ranges: Extended Temperature Range T A -40 — +125 °C Operating Temperature Range T A -40 — +125 °C Storage Temperature Range T A -65 — +150 °C Thermal Package Resistances: Thermal Resistance, 5L-SOT-23 θ JA — 255 — °C/W ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. BOLDFACE type specifications apply for junction temperature of -40°C to +125°C. Parameter Sym Min Typ Max Units Conditions Note 1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. 3: TCVOUT = 6: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 7: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 8: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to I MAX at VIN = 6V for T = 10 ms. 9: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem- perature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). 10: Hysteresis voltage is referenced by VR. 11: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. VOUTMAX VOUTMIN–() 106×

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C. FIGURE 2-1: Power Supply Rejection Ratio. FIGURE 2-2: Power Supply Rejection Ratio. FIGURE 2-3: Output Noise vs. Frequency. FIGURE 2-4: Power Supply Rejection Ratio. FIGURE 2-5: Power Supply Rejection Ratio. FIGURE 2-6: Dropout Voltage vs. ILOAD. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In so me graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -100 -80 -60 -40 -20 10 100 1,000 10,000 100,000 1,000,000 f (Hz) PSRR (dB) VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V IOUT = 100 µA COUT = 1 µF Ceramic 10 100 1000 10k 100k 1M -100 -80 -60 -40 -20 10 100 1,000 10,000 100,000 1,000,000 f (Hz) PSRR (dB) 10 100 1000 10k 1M100k VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V IOUT = 150 mA COUT = 1 µF Ceramic 0.001 0.01 0.1 0.01 0.1 1 10 100 1000 Frequency (kHz) Noise (µV/√Hz) COUT = 1 µF -100 -80 -60 -40 -20 10 100 1,000 10,000 100,000 1,000,000 f (Hz) PSRR (dB) VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V IOUT = 150 mA COUT = 10 µF Ceramic 10 100 1000 10k 100k 1M -100 -80 -60 -40 -20 10 100 1,000 10,000 100,000 1,000,000 f (Hz) PSRR (dB) 10 100 1000 10k 100k 1M VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V IOUT = 150 mA COUT = 10 µF Tantalum 0.000 0.020 0.040 0.060 0.080 0.100 0.120 0.140 0.160 0 50 100 150 T = 130°C T = -45°C T = 25°C ILOAD (mA) DOV (V) VOUT = 1.8V

DS21663D-page 8 © 2009 Microchip Technology Inc. Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C. FIGURE 2-19: VOUT to ERROR Delay. VIN 1V/Div 1V/Div 2V/Div VOUT VERROR 2.8V 3.42V 3.0V 2.8V RPULLUP = 100kΩ IOUT = 0.3mA

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

3.1 Unregulated Supply Input (V IN)

Connect the unregulated input supply to the VIN pin. If there is a large distance between the input supply and the LDO regulator, some input capacitance is necessary for proper operation. A 1 µF capacitor, connected from V IN to ground, is recommended for most applications.

3.2 Ground Terminal (GND)

Connect the unregulated input supply ground return to GND. Also connect one side of the 1 µF typical input decoupling capacitor close to this pin and one side of the output capacitor C OUT to this pin.

3.3 Shutdown Control Input (SHDN )

The regulator is fully enabled when a logic-high is applied to SHDN . The regulator enters shutdown when a logic-low is applied to this input. During shutdown, the output voltage falls to zero and the supply current is reduced to 0.5 µA (maximum).

3.4 Out-of-Regulation Flag (ERROR )

The open-drain ERROR flag provides indication that the regulator output voltage is not in regulation. The ERROR pin will be low when the output is typically below 5% of its specified value.

3.5 Regulated Voltage Output (V OUT)

Connect the output load to V OUT of the LDO. Also connect one side of the LDO output decoupling capacitor as close as possible to the VOUT pin. TABLE 3-1: PIN FUNCTION TABLE Pin Number Symbol Description 1V IN Unregulated supply input. 2 GND Ground terminal. 3S H D N Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero, ERROR is open circuited and supply current is reduced to 0.5 µA (maximum).

4 ERROR

Out-of-Regulation Flag. (Open-drain output). This output goes low when VOUT is out-of-tolerance by approximately -5%. 5V OUT Regulated voltage output.

4.0 DETAILED DESCRIPTION

The TC2054, TC2055 and TC2186 are precision fixed output voltage regulators. (If an adjustable version is desired, refer to the TC1070/TC1071/TC1187 data sheet (DS21353). Unlike bipolar regulators, the TC2054, TC2055 and TC2186 supply current does not increase with load current. In addition, V OUT remains stable and within regulation over the entire 0 mA to maximum output current operating load range. Figure 4-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN ) is at or above V IH, and shutdown (disabled) when SHDN is at or below V IL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 µA (typical), V OUT falls to zero volts, and ERROR is open-circuited. FIGURE 4-1: Typical Application Circuit.

4.1 ERROR Open-Drain Output

ERROR is driven low whenever V OUT falls out of regulation by more than -5% (typical). This condition may be caused by low input voltage, output current limiting or thermal limiting. The ERROR threshold is 5% below rated V OUT regardless of the programmed output voltage value (e.g. ERROR = V OL at 4.75V (typical) for a 5.0V regulator and 2.85V (typical) for a 3.0V regulator). ERROR output operation is shown in Figure 4-2. Note that ERROR is active when VOUT falls to VTH, and inactive when VOUT rises above VTH by VHYS. As shown in Figure 4-1, ERROR can be used as a battery low flag or as a processor RESET signal (with the addition of timing capacitor C2). R1 x C2 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200 m s to allow time for the system to stabilize. Pull-up resistor R 1 can be tied to VOUT, VIN or any other voltage less than (V IN + 0.3V). The ERROR pin sink current is self-limiting to approximately 18 mA. FIGURE 4-2: Error Output Operation.

4.2 Output Capacitor

A 1 µF (minimum) capacitor from V OUT to ground is required. The output capacitor should have an effective series resistance of 0.01Ω. to 5Ω for VOUT = 2.5V, and 0.05Ω. to 5Ω for VOUT < 2.5V. Ceramic, tantalum and aluminum electrolytic capacitors can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C). When operating from source s other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.

4.3 Input Capacitor

A 1 µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and this AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitors can be used (since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalum are recommended for applications operating below -25°C). When operating from source s other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 0.2 µF 1MΩ C2 Required Only if ERROR is used as a Processor RESET Signal (See Text) Shutdown Control (to CMOS Logic or Tie to VIN if unused) BATTLOW or RESET TC2054 TC2055 TC2186 VIN BATTERY VOUT GND 1µ F VOUT 1µ F ERRORSHDN VIH VOL ERROR VTH VOUT HYSTERESIS (VHYS)

5.0 THERMAL CONSIDERATIONS

5.1 Thermal Shutdown

Integrated thermal protection circuitry shuts the regulator off when the die temperature exceeds approximately 160°C. The regulator remains off until the die temperature cools to approximatley 150°C.

5.2 Power Dissipation

The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. Equation 5-1 is used to calculate worst case power dissipation: EQUATION 5-1: The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (T AMAX), the maximum allowable die temperature (125 °C) and the thermal resistance from junction-to-air (θJA). The 5-Pin SOT-23A package has a θJA of approximately 220°C/Watt when mounted on a typical two layer FR4 dielectric copper clad PC board. EQUATION 5-2: Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Actual power dissipation: Maximum allowable power dissipation: In this example, the TC2054 dissipates a maximum of only 26.7 mW; far below the allowable limit of 318 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits.

5.3 Layout Considerations

The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θ JA and, therefore, increase the maximum allowable power dissipation limit. PD VINMAX VOUTMIN–() ILOADMAX≈ Where: PD = Worst-case actual power dissipation VINMAX = Maximum voltage on V IN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current Where all terms are previously defined. PDMAX TJMAX TAMAX– θJA Given: VINMAX = 3.0V +10% VOUTMIN = 2.7V – 2.5% ILOADMAX =4 0 m A TAMAX = +55°C Find: 1. Actual power dissipation 2. Maximum allowable dissipation PD VINMAX VOUTMIN–() ILOADMAX= 26.7mW= PDMAX TJMAX TAMAX– θJA 125 55– 318mW=

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

6.2 Taping Information

5-Lead SOT-23 Example: XXNN 1 23 5 4 SA25 TABLE 6-1: PART NUMBER CODE AND TEMPERATURE RANGE (V) TC2054 TC2055 TC2186

1.8 SA TA VA

2.5 SB TB VB

2 . 6S HT HV H 2 . 7S CT CV C 2 . 8S DT DV D

2.85 SE TE VE

3 . 0S FT FV F 3 . 3S GT GV G

5.0 SK TJ VJ

Legend: XX...X Customer-specific information NN Alphanumeric traceability code Carrier Tape, Number of Components Per Reel and Reel Size: Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 5-Pin SOT-23A 8 mm 4 mm 3000 7 in. Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices Device Marking PIN 1 User Direction of Feed Standard Reel Component Orientation for 713 Suffix Device (Mark Right Side Up) W P

© 2009 Microchip Technology Inc. DS21663D-page 13 TC2054/2055/2186 APPENDIX A: REVISION HISTORY Revision D (September 2009) The following is the list of modifications: 1. Added the 2.6V, and 5.0V option in Table 6-1 in Section 6.0 “Packaging Information”. 2. Updated the package outline drawing. 3. Added 2.6V option to Product Identification System section. Revision C (May 2006) The following is the list of modifications: 1. Added overtemperature to bullet for overcurrent protection in Features and General Description verbiage. 2. Added “Thermal Shutdown Die Temperature” to the Electrical Specifications table. Changed condition for “Minimum VIN Operating Voltage”. 3. Added Temperature Characteristics Table. 4. Added Section 5.1 “Thermal Shutdown”. 5. Updated the package outline drawing. Revision B (May 2002)

Data Sheet converted to Microchip standards. Revision A (May 2001)
Original Release of this Document under Telcom.

© 2009 Microchip Technology Inc. DS21663D-page 15 TC2054/2055/2186 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: TC2054: 50 mA LDO with Shutdown and ERROR Output TC2055: 100 mA LDO with Shutdown and ERROR Output TC2186: 150 mA LDO with Shutdown and ERROR Output Output Voltage: XX = 1.8V XX = 2.5V XX = 2.6V XX = 2.7V XX = 2.8V XX = 2.85V XX = 3.0V XX = 3.3V XX = 5.0V Temperature Range: V = -40°C to +125°C Package: CTTR = Plastic Small Outline Transistor (SOT-23), 5-lead, Tape and Reel PART NO. -XX X TemperatureOutput Voltage Device Examples: a) TC2054-1.8VCTTR: 5LD SOT-23-A, 1.8V, Tape and Reel. b) TC2054-2.85VCTTR: 5LD SOT-23-A, 2.85V, Tape and Reel. c) TC2054-3.3VCTTR: 5LD SOT-23-A, 3.3V, Tape and Reel. a) TC2055-1.8VCTTR: 5LD SOT-23-A, 1.8V, Tape and Reel. b) TC2055-2.85VCTTR: 5LD SOT-23-A, 2.85V, Tape and Reel. c) TC2055-3.0VCTTR: 5LD SOT-23-A, 3.0V, Tape and Reel. a) TC2186-1.8VCTTR: 5LD SOT-23-A, 1.8V, Tape and Reel. b) TC2186-2.8VCTTR: 5LD SOT-23-A, 2.8V, Tape and Reel. Range XXXX Package

© 2009 Microchip Technology Inc. DS21663D-page 17 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application me ets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting fr om such use. No licenses are conveyed, implicitly or ot herwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, PIC 32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices:

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Product Information

TC2054-3.0VCTTR specifications and overview.

Summary

50 mA, 100 mA, and 150 mA CMOS LDOs with Shutdown and Error Output 2009

Description

50 mA, 100 mA, and 150 mA CMOS LDOs with Shutdown and Error Output 2009

Source title TC2054-3.0VCTTR Datasheet(PDF) - Microchip Technology

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