TC1683

TC1682_05 MICROCHIP | Alldatasheet

Document overview

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Technical content

Features

• Small 8-Pin MSOP Package
• Operates from 1.8V to 5.5V
• 120 Ohms (typ) Output Resistance
• 99% Voltage Conversion Efficiency
• Only 3 External Capacitors Required
• Power-Saving Shutdown Mode
• Low Active Supply Current - 95μA (typ) for TC1682 - 225μA (typ) for TC1683 - 700μA (typ) for TC1684
• Fully Compatible with 1.8V Logic Systems

Applications

• LCD Panel Bias
• Cellular Phones PA Bias
• Pagers
• PDAs, Portable Data Loggers
• Battery-Powered Devices Device Selection Table Package Type General Description The TC1682/TC1683/TC1684 are CMOS charge pump converters that provide an inverted doubled output from a single positive supply. An on-board oscillator provides the clock and only three external capacitors are required for full circuit implementation. Switching frequencies are 12kHz for the TC1682, 35kHz for the TC1683, and 125kHz for the TC1684. When the SHDN pin is held at a logic high, the device goes into a very low power mode of operation consuming less than 1μA (typ) of supply current. Low output source impedance (typically 120Ω), provides output current up to 10mA. The TC1682/ TC1683/TC1684 feature a 1.8V to 5.5V operating voltage range and high efficiency, which make them an ideal choice for a wide variety of applications requiring a negative doubled voltage derived from a single positive supply (for example: generation of -7.2V from a +3.6V lithium cell or -10V generated from a +5V logic supply). The minimum external part count, small physical size and shutdown mode feature make this family of products useful for a wide variety of negative bias power supply applications. Functional Block Diagram Part Number Package Osc. Freq. (kHz) Operating Temp. Range TC1682EUA 8-Pin MSOP -40°C to +85°C TC1683EUA 8-Pin MSOP -40°C to +85°C TC1684EUA 8-Pin MSOP 125 -40°C to +85°C TC1682 TC1683 TC1684 VOUT SHDN VIN C2– GND C1– C1+ C2+ 8-Pin MSOP C1+ C2+ VIN C1– C2– TC1682 TC1683 TC1684 VOUT – COUT Input GND C1 must have a voltage rating ≥ VIN C2 and COUT must have a voltage rating ≥ 2VIN VOUT = -(2 x VIN) SHDN ON OFF Inverting Charge Pump Voltage Doublers with Active High Shutdown Obsolete Device

© 2005 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Power Dissipation (TA ≤ 70°C) *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1682/TC1683/TC1684 ELECTRICAL SPECIFICATIONS C1 = C2 = 0.33μF (TC1684), SHDN = GND, Typical values are at TA = +25°C Symbol Parameter Min Typ Max Units Device Test Conditions IDD Supply Current 225 700 160 480 1500 μA TC1682 TC1683 TC1684 ISHDN Shutdown Supply Current 0.5 μA All SHDN = VIN = +5V VMIN Minimum Supply Voltage 1.8 V All RLOAD = 1kΩ VMAX Maximum Supply Voltage 5.5 V All RLOAD = 1kΩ FOSC Oscillator Frequency 8.4 24.5 125 15.6 45.5 170 kHz TC1682 TC1683 TC1684 VIH SHDN Input Logic High 1.4 V All VIN = VMIN to VMAX VIL SHDN Input Logic Low 0.4 V All VIN = VMIN to VMAX VEFF Voltage Conversion Efficiency All RLOAD = ∞ ROUT Output Resistance 120 170 Ω All ILOAD = 0.5mA to 10mA (Note 1) TWK Wake-up Time From Shutdown Mode 1800 600 200 μsec TC1682 TC1683 TC1684 RLOAD = 2kΩ Note Capacitor contribution is approximately 20% of the output impedance (ESR = 1/ pump frequency x capacitance).

© 2005 Microchip Technology Inc. DS21537C-page 3 TC1682/TC1683/TC1684 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin MSOP) Symbol

Description

C1– C1 commutation capacitor negative terminal. C2+ C2 commutation capacitor positive terminal. C2– C2 commutation capacitor negative terminal. VOUT Doubling inverting charge pump output (-2 x VIN). GND Ground. VIN Positive power supply input. C1+ C1 commutation capacitor positive terminal. SHDN Shutdown input (active high).

© 2005 Microchip Technology Inc. DS21537C-page 5 TC1682/TC1683/TC1684 4.0 APPLICATIONS INFORMATION 4.1 Output Voltage Considerations The TC1682/TC1683/TC1684 perform inverting voltage conversions but do not provide any type of regulation. The output voltage will droop in a linear manner with respect to the output load current. The value of the equivalent output resistance is approximately 120Ω nominal at +25°C and VIN = +5V. In this particular case, the output is approximately -10V at very light loads and will droop according to the equation below: VDROOP = IOUT x ROUT 4.2 Capacitor Selection In order to maintain the lowest output resistance and output ripple voltage, it is recommended that low ESR capacitors be used. Additionally, larger values of C1 and C2 will lower the output resistance and larger values of COUT will reduce output ripple. Note: For proper charge pump operation, C1 must have a voltage rating greater than or equal to VIN, while C2 and COUT must have a voltage rating greater than or equal to 2VIN. Table 4-1 shows various values of C1/C2 and the corresponding output resistance values for VIN = 5V @ +25°C. Table 4-2 shows the output voltage ripple for various values of COUT (again assuming VIN = 5V @ +25°C). The VRIPPLE values assume a 1mA output load current and a 0.1Ω ESRCOUT. TABLE 4-1: OUTPUT RESISTANCE VS. C1/C2 (ESR = 0.1Ω) TABLE 4-2: OUTPUT VOLTAGE RIPPLE VS. COUT2 (ESR = 0.1Ω) IOUT = 1mA 4.3 Input Supply Bypassing The VIN input should be capacitively bypassed to reduce AC impedance and minimize noise effects due to the switching internal to the device. It is recommended that a large value capacitor (at least equal to C1) be connected from VIN to GND for optimal circuit performance. 4.4 Shutdown Input The TC1682/TC1683/TC1684 is enabled when SHDN is low, and disabled when SHDN is high. This input cannot be allowed to float. (If SHDN is not required, see the TC2682/TC2683/TC2684 data sheet.) The SHDN input should be limited to 0.3V above VIN. 4.5 Inverting Voltage Doubler The most common application for the TC1682/TC1683/ TC1684 devices is the inverting voltage doubler (Figure 4-1). This application uses three external capacitors: C1, C2 and COUT. Note: A power supply bypass capacitor is recommended. The output is equal to -2VIN plus any voltage drops due to loading. Refer to Table 4-1 and Table 4-2 for capacitor selection guidelines. FIGURE 4-1: INVERTING VOLTAGE DOUBLER TEST CIRCUIT 4.6 Layout Considerations As with any switching power supply circuit, good layout practice is recommended. Mount components as close together as possible to minimize stray inductance and capacitance. Also use a large ground plane to minimize noise leakage into other circuitry. C1, C2 (μF) TC1682 ROUT(Ω) TC1683 ROUT(Ω) TC1684 ROUT(Ω) 0.33 633 184 120 262 120 102 3.3 120 COUT (μF) TC1682 VRIPPLE (mV) TC1683 VRIPPLE (mV) TC1684 VRIPPLE (mV) 0.33 192 3.3 VIN CIN VOUT RL VIN COUT TC1682 TC1683 TC1684 C1– C2– C1+ C2+ GND Device CIN COUT TC1682 3.3μF 3.3μF 3.3μF 3.3μF TC1683 1μF 1μF 1μF 1μF TC1684 0.33μF 0.33μF 0.33μF 0.33μF SHDN VOUT

© 2005 Microchip Technology Inc. 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking data not available at this time. 5.2 Taping Form 5.3 Package Dimensions Component Taping Orientation for 8-Pin MSOP Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin MSOP 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size User Direction of Feed PIN 1 Standard Reel Component Orientation for TR Suffix Device P 8-Pin MSOP .122 (3.10) .114 (2.90) .122 (3.10) .114 (2.90) .043 (1.10) MAX. .006 (0.15) .002 (0.05) .016 (0.40) .010 (0.25) .197 (5.00) .189 (4.80) .008 (0.20) .005 (0.13) .028 (0.70) .016 (0.40) 6° MAX. .026 (0.65) TYP. PIN 1 Dimensions: inches (mm)

© 2005 Microchip Technology Inc. DS21537C-page7 TC1682/TC1683/TC1684 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

© 2005 Microchip Technology Inc. NOTES:

© 2005 Microchip Technology Inc. DS21537C-page 9 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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