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TC164 (8Pin/4R) Product Specification – Mar. 24, 2004 V.4 Supersedes Date of Feb. 10, 2004

www.yageo.com Mar. 24, 2004 V.4 Chip Resistor Surface Mount SERIES TC 164 TYPE TC164 B (mm) 0.3±0.15 H (mm) 0.5±0.15 P (mm) 0.8±0.05 L (mm) 3.2±0.20 T (mm) 0.6±0.1 W1 (mm) 0.3±0.15 W2 (mm) 1.6±0.15 Table 1 YNSC021 H a aP L B T Fig. 2 TC164 series chip resistors construction DIMENSION SCHEMATIC R1 R2 R3 R4 YNSC022 Fig. 3 Equivalent circuit diagram For dimension see Fig. 2 and Table 1 R1=R2=R3=R4 TC164 First two digits for significant figure and 3rd digit for number of zeros Letter R: decimal place MARKING Fig. 1 5% Marking, Value=56 Ω YNSC020 TC164 – X X X XX XXXX (1) TOLERANCE J = ±5% (2) PACKAGING TYPE R = Paper taping reel (3) TEMPERATURE CHARACTERISTIC OF RESISTANCE G = ±200ppm/°C – = Base on spec (4) SPECIAL TYPE 07 = 7 inch dia. Reel 13 = 13 inch dia. Reel (5) RESISTANCE VALUE: 56R, 560R, 5K6, 56K, 1M. SCOPE This specification describes TC164 series chip resistors made by thick film process.

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Part number is identified by the series, size, tolerance, packing style, temperature coefficient, special type and resistance value. Concave termination

www.yageo.com Mar. 24, 2004 V.4 Chip Resistor Surface Mount SERIES TC 164 CHARACTERISTICS TC164 1/16W Operating Temperature Range –55°C to +155°C Maximum Working Voltage 50V Maximum Overload Voltage 100V Dielectric Withstanding Voltage 100V Number of Resistors 4 Resistance Range 10Ω to 1MΩ Zero Ohm Jumper <0.05Ω Temperature Coefficient ±200ppm/°C Rated Current 1.0A Jumper Criteria Maximum Current 2.0A ELECTRICAL CHARACTERISTICS POWER RATING RRAATTEEDD PPOOWWEERR AATT 7700°°CC,, TTCC116644 ==11//1166WW FFOORR EELLEEMMEENNTT RRAATTEEDD VVOOLLTTAAGGEE:: The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V=√(P X R) Where V=Continuous rated DC or AC (rms) working voltage (V) P=Rated power (W) R=Resistance value ( X) Table 2 MRA632 70 100−55 50 Tamb (°C) (%Prated) 100 155 Pmax Fig. 4 Maximum dissipation (P max) in percentage of rated power as a function of the operating ambient temperature (T amb)

www.yageo.com Mar. 24, 2004 V.4 Chip Resistor Surface Mount SERIES TC 164 CCB325 empty compartments with cover tape (min. 240 mm) cover tape only leader ≥400 mmtrailer (max. 260 mm) trailer end leader end Fig. 7 Leader and trailer tape dimension PACKING METHOD LLEEAADDEERR//TTRRAAIILLEERR TTAAPPEE SSPPEECCIIFFIICCAATTIIOONN PACKING STYLE REEL DIMENSION TC164 Paper Taping Reel (R) 7" (178 mm) 5,000 13" (330 mm) 20,000 gewidth CD BA W T MSA284_b DIMENSION TC164 A (mm) 2.0±0.1 B (mm) 3.5±0.1 W (mm) 8.0±0.2 E (mm) 1.75±0.1 F (mm) 3.5±0.05 P0 (mm) 4.0±0.1 P1 (mm) 4.0±0.1 P2 (mm) 2.0±0.05 T (mm) 0.85±0.1 PAPER TAPE SPECIFICATION TAPING REEL DIMENSION TC164 Tape Width 8mm ØA (mm) 180+0/–3 ØB (mm) 60+1/–0 ØC (mm) 13.0±0.2 ØD (mm) 21±0.8 W (mm) 9.0±0.3 T (mm) 11.4±1 Fig. 5 Reel dimension Table 3 Table 4 Table 5 Packing style and packaging quantity For dimension see Table 3 F W P2D0 B A E MBD123_a T cover tape Fig.6 Paper tape dimension For dimension see Table 4

www.yageo.com Mar. 24, 2004 V.4 Chip Resistor Surface Mount SERIES TC 164 TYPE TEST METHOD ACCEPTANCE STANDARD Formula Temperature Coefficient of Resistance (T.C.R.) Measure resistance at +25°C or specified room temperature as R 1, then measure at –55°C or +155°C respectively as R2. Determine the temperature coefficient of resistance from the following formula: 6 (ppm/°C) Where t1=+25°C or specified room temperature t2=–55°C or +155°C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms Refer to table 2 Thermal Shock At –55±3°C for 2 minutes and at +155±2°C for 2 minutes as one cycle. After 5 cycles, the specimen shall be stabilized at room temp. Measure the resistance to determine ΔR/R(%) after one more hour. ±(1.0%+0.05Ω) Low Temperature Operation Place the specimen in a test chamber maintained at –65 (+0/–5)°C. After one hour stabilization at this temperature, full rated working voltage shall be applied for 45 (+5/–0) minutes. Have15 (+5/–0 ) minutes after remove the voltage, the specimen shall be removed from the chamber and stabilized at room temperature for 24 hrs. Measure the resistance to determine ΔR/R(%). ±(1.0%+0.05Ω) No visible damage Short Time Overload Apply 2.5 times of rated voltage but not exceeding the maximum overload voltage for 5 seconds. Have the specimen stabilized at room temperature for 30 minutes minimum. Measure the resistance to determine ΔR/R(%). ±(2.0%+0.05Ω) No visible damage Insulation Resistance Place the specimen in the jig and apply a rated continues overload voltage (R.C.O.V) for one minute as shown. Measure the insulation resistance. Type TC164 Voltage (DC) 100V ≥10,000MΩ Dielectric Withstand Voltage Place the specimen in the jig and apply a specified value continuous overload voltage as shown for one minute. Type TC164 Voltage (AC) 100Vrms Breakdown voltage> specification and without open/short Resistance To Soldering Heat Immerse the specimen in the solder pot at 260±5°C. for 10±1 seconds. Have the specimen stabilized at room temperature for 30 minutes minimum. Measure the resistance to determine R/R(%).Δ ±(1.0%+0.05Ω) No visible damage R2–R1 R1(t2–t1)

www.yageo.com Mar. 24, 2004 V.4 Chip Resistor Surface Mount SERIES TC 164 TYPE TEST METHOD ACCEPTANCE STANDARD Moisture Resistance Place the specimen in the test chamber and subject to 42 damp heat cycles. Each one of which consists of the steps 1 to 7 as figure 9. The total length of test is 1,000 hours. Have the specimen stabilized at room temperature for 24 hours after testing. Measure the resistance to determine R/R(%).Δ ±(2.0%+0.05Ω) No visible damage Life Place the specimen in the oven at 70±2°C. Apply the rated voltage to the specimen at the 1.5 hours on and 0.5 hour off cycle. The total length of test is 1,000 hours. Have the specimen stabilized at room temperature for one hour minimum after testing. Measure the R/R(%).Δ ±(3.0%+0.1Ω) No visible damage Solderability Immerse the specimen in the solder pot at 235±5°C for 5 sec. At least 95% solder coverage on the termination Bending Strength Mount the specimen on a test board as shown in the figure 8. Slowly apply the force till the board is bent for 5±1 sec. Measure the R/R(%) at this position.Δ Type TC164 Bent Distance (d) 1mm ±(1.0%+0.05Ω) No visible damage Fig. 8 Principle of the bending test

www.yageo.com Mar. 24, 2004 V.4 Chip Resistor Surface Mount SERIES TC 164 initial drying 24 hours 90 − 98% RH 80 − 98% RH temperature tolerance ±2 °C (±3.6 °F) unless otherwise specified initial measurements as specified in 2.2 STEP1 STEP3STEP2 prior to first cycle only STEP4 one cycle 24 hours; repeat as specified in 2.5 voltage applied as specified in 2.4 circulation of conditioning air shall be at a minimum cubic rate per minute equivalent to 10 times the volume of the chamber STEP6 STEP7 HBK073 STEP5 51 0 1 5 end of final cycle; measurements as specified in 2.7 optional sub-cycle if specified (2.3); sub-cycle performed during any 5 of the first 9 cycles; humidity uncontrolled during sub-cycle time [h] temperature [°C] 90 − 98% RH 90 − 98% RH +10 °C (+18 °F) −2 °C (−3.6 °F) 80 − 98% RH rate of change of temperature is unspecified, however, specimens shall not be subjected to radiant heating from chamber conditioning processes Fig. 9 Conditions by change of temperature