TC1240ECHTR

TC1240A MICROCHIP | Alldatasheet

Document overview

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Technical content

Features

• Charge Pumps in 6-Pin SOT-23A Package
• >99% Typical Voltage Conversion Efficiency
• Voltage Doubling
• Input Voltage Range, TC1240: +2.5V to +4.0V, TC1240A: +2.5V to +5.5V
• Low Output Resistance, TC1240: 17 Ω (Typical) TC1240A: 12Ω (Typical)
• Only Two External Capacitors Required
• Low Supply Current, TC1240: 180 µA (Typical) TC1240A: 550 µA (Typical)
• Power-Saving Shutdown Mode (1 µA Maximum)
• Shutdown Input Fully Compatible with 1.8V Logic Systems

Applications

• Cellular Phones
• Pagers
• PDAs, Portable Data Loggers
• Battery Powered Devices
• Handheld Instruments Package Type General Description The TC1240/TC1240A is a doubling CMOS charge pump voltage converter in a small 6-Pin SOT-23A package. The TC1240 doubles an input voltage that can range from +2.5V to +4.0V, while the TC1240A doubles an input voltage that can range from +2.5V to +5.5V. Conversion efficiency is typically >99%. Internal oscillator frequency is 160 kHz for both devices. The TC1240 and TC1240A have an active-high shutdown that limits the current consumption of the devices to less than 1 µA. External component requirement is only two capacitors for standard voltage doubler applications. All other circuitry (including control, oscillator and power MOSFETs) are integrated on-chip. Typical supply cur- rent is 180 µA for the TC1240 and 550 µA for the TC1240A. Both devices are available in a 6-Pin SOT- 23A surface mount package. Typical Application Circuit NOTE: 6-Pin SOT-23A is equivalent to the 6-Pin SOT-23A TC1240ECH TC1240AECH VIN GND SHDNVOUT EIAJ (SC-74A) Positive Voltage Doubler VIN 2 x INPUT INPUT GND VOUT SHDN OFF ON TC1240 TC1240A + C2 Positive Doubling Charge Pumps with Shutdown in a SOT-23 Package

DS21516C-page 2  2003 Microchip Technology Inc.

1.0 ELECTRICAL

Absolute Maximum Ratings † Input Voltage (VIN to GND) Output Voltage (VOUT to GND) Power Dissipation ( † Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1240 ELECTRICAL SPECIFICATIONS Electrical Specifications: Unless otherwise noted, typical values apply at T A = +25°C. Minimum and maximum val- ues apply for TA = -40° to +85°C, and VIN = +2.8V, C1 = C2 = 3.3 µF, SHDN = GND. Parameters Sym Min Typ Max Units Conditions Supply Current I DD — 180 300 µA R LOAD = ∞ Shutdown Supply Current I SHDN — 0.1 1.0 µA SHDN = V IN Minimum Supply Voltage V MIN 2.5 — — V R LOAD = 1.0 kΩ Maximum Supply Voltage V MAX —— 4 . 0V R LOAD = 1.0 kΩ Oscillator Frequency F OSC — 160 — kHz T A = -40°C to +85°C Switching Frequency (Note 1) FSW 40 80 125 kHz T A = -40°C to +85°C Shutdown Input Logic High V IH 1.4 — — V V IN = VMIN to VMAX Shutdown Input Logic Low V IL —— 0 . 4V V IN = VMIN to VMAX Power Efficiency P EFF 86 93 — % R LOAD = 1.0 kΩ Voltage Conversion Efficiency V EFF 97.5 99.96 — % R LOAD = ∞ Output Resistance (Note 2) ROUT — Ω RLOAD = 1.0 kΩ TA = -40°C to +85°C Note 1: Switching frequency is one-half internal oscillator frequency. 2: Capacitor contribution is approximately 26% of the output impedance [ESR = 1 / switching frequency x capacitance].

 2003 Microchip Technology Inc. DS21516C-page 3 TC1240/TC1240A TC1240A ELECTRICAL SPECIFICATIONS Electrical Specifications: Unless otherwise noted, typical values apply at T A = +25°C. Minimum and maximum values apply for TA = -40° to +85°C, and VIN = +5.0V, C1 = C2 = 3.3 µF, SHDN = GND. Parameters Sym Min Typ Max Units Conditions Supply Current I DD — 550 900 µA R LOAD = ∞ Shutdown Supply Current I SHDN — 0.01 1.0 µA SHDN = V IN Minimum Supply Voltage V MIN 2.5 — — V Maximum Supply Voltage V MAX —— 5 . 5V Output Current I LOAD 20 — — mA Sum of the RDS(ON) of the internal MOSFET Switches RSW —4 8 Ω ILOAD = 20 mA Oscillator Frequency F OSC — 160 — kHz T A = -40°C to +85°C Switching Frequency (Note 1) FSW 40 80 125 kHz T A = -40°C to +85°C Shutdown Input Logic High V IH 1.4 — — V V IN = VMIN to VMAX Shutdown Input Logic Low V IL —— 0 . 4V V IN = VMIN to VMAX Power Efficiency P EFF 86 94 — % I LOAD = 5 mA Voltage Conversion Efficiency V EFF 99 99.96 — % R LOAD = ∞ Output Resistance (Note 2) ROUT — Ω ILOAD = 20 µA TA = -40°C to +85°C Note 1: Switching frequency is one-half internal oscillator frequency. 2: Capacitor contribution is approximately 26% of the output impedance [ESR = 1 / switching frequency x capacitance].

DS21516C-page 4  2003 Microchip Technology Inc.

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, typical values apply at T A = +25°C. FIGURE 2-1: Supply Current vs. Supply Voltage (No Load). FIGURE 2-2: Output Source Resistance vs. Supply Voltage (with R LOAD = 1 kΩ) FIGURE 2-3: Output Voltage Drop vs. Load Current. FIGURE 2-4: Supply Current vs. Temperature (No Load). FIGURE 2-5: Output Source Resistance vs. Temperature (with RLOAD = 1 kΩ). FIGURE 2-6: Power Efficiency vs. Load Current. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 700 600 500 400 300 200 100 SUPPLY CURRENT (µA) SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) OUTPUT SOURCE RESISTANCE (Ω) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 VOLT DROP (V) 0 5 10 15 20 25 30 35 40 45 50 LOAD CURRENT (mA) VIN = 4.0V VIN = 2.8V 450 400 350 300 250 200 100 150 -50 -25 0 25 50 75 100 125 TEMPERATURE (°C) SUPPLY CURRENT (µA) VIN = 4.0V VIN = 2.8V -50 -25 0 25 50 75 100 125 TEMPERATURE (°C) VIN = 2.8V OUTPUT SOURCE RESISTANCE (Ω) VIN = 4.0V 100% 90% 80% 70% 60% 50% 40% 0 5 10 15 20 25 30 35 40 45 50 POWER EFFICIENCY (%) LOAD CURRENT (mA) 30% 20% 10% VIN = 2.5V VIN = 3.5V VIN = 4.5V

 2003 Microchip Technology Inc. DS21516C-page 5 TC1240/TC1240A Note: Unless otherwise indicated, typical values apply at T A = +25°C. FIGURE 2-7: Switching Frequency vs. Temperature. 100 -50 -25 0 25 50 75 100 125 TEMPERATURE (°C) VIN = 4.0V SWITCHING FREQUENCY (kHz) VIN = 2.8V

DS21516C-page 6  2003 Microchip Technology Inc.

3.0 PIN DESCRIPTION

The description of the pins are listed in T able 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. Symbol Description 1V IN Power supply input

2 GND Ground

3 C- Commutation capacitor negative terminal

4 SHDN Shutdown input (active high)

OUT Doubled output voltage

6 C+ Commutation capacitor positive terminal

 2003 Microchip Technology Inc. DS21516C-page 7 TC1240/TC1240A

4.0 DETAILED DESCRIPTION

The TC1240/TC1240A charge pump converter dou- bles the voltage applied to the VIN pin. Conversion con- sists of a two-phase operation (Figure 4-1). During the first phase, switches S 2 and S4 are open and S1 and S3 are closed. During this time, C 1 charges to the voltage on VIN and load current is supplied from C2. During the second phase, S 2 and S4 are closed, while S 1 and S3 are open. During this second phase, C1 is level-shifted upward by VIN volts. This connects C 1 to the reservoir capacitor C2, allowing energy to be delivered to the output as needed. The actual voltage is slightly lower than 2 x VIN since the four switches (S 1-S4) have an on-resistance and the load drains charge from reservoir capacitor C2. FIGURE 4-1: Ideal Switched Capacitor Charge Pump Doubler.

5.0 TYPICAL APPLICATIONS

5.1 Output Voltage Considerations

The TC1240/TC1240A performs voltage doubling but does not provide regulation. The output voltage will droop in a linear manner with respect to load current. The value of this equivalent output resistance is approx- imately 12Ω nominal at +25°C and V IN = +5.0V for the TC1240A and 17Ω nominal at +25°C and V IN = +2.8V for the TC1240. V OUT is approximately +10.0V at light loads for the TC1240A and +5.6V for the TC1240, and droops according to the equation below: EQUATION

5.2 Charge Pump Efficiency

The overall power efficiency of the charge pump is affected by four factors: 1. Losses from power consumed by the internal oscillator, switch drive, etc. (which vary with input voltage, temperature and oscillator frequency). 2. I 2R losses due to the on-resistance of the MOSFET switches on-board the charge pump. 3. Charge pump capacitor losses due to effective series resistance (ESR). 4. Losses that occur during charge transfer (from commutation capacitor to the output capacitor) when a voltage difference between the two capacitors exist. Most of the conversion losses are due to factors (2) and (3) above. These losses are given by Equation 5-1. EQUATION 5-1: VOUT = 2 x VIN TC1240/TC1240AVIN S3 S4 OSC VIN VOUT 2V IN VDROOP–×= VDROOP IOUT ROUT×= PLOSS(2,3) IOUT

2 ROUT×=

DS21516C-page 8  2003 Microchip Technology Inc. The switching frequency in Equation 5-1b is defined as one-half the oscillator frequency (i.e., F SW = F OSC/2). The 1/(FSW)(C1) term in Equation 5-1b is the effective output resistance of an ideal switched capacitor circuit (Figure 5-1 and Figure 5-2). The output voltage ripple is given by Equation 5-2. EQUATION 5-2: FIGURE 5-1: Ideal Switched Capacitor Model. FIGURE 5-2: Equivalent Output Resistance.

5.3 Capacitor Selection

In order to maintain the lowest output resistance and output ripple voltage, it is recommended that low ESR capacitors be used. Additionally, larger values of C 1 will lower the output resistance and larger values of C 2 will reduce output ripple (see Equation 5-1b). Table 5-1 shows various values of C 1 and the corresponding output resistance values @ +25°C. It assumes a 0.1 Ω ESR C1 and 0.9 Ω RSW. Table 5-2 shows the output voltage ripple for various values of C2. The V RIPPLE values assume 5mA output load current and 0.1Ω ESRC2. TABLE 5-1: OUTPUT RESISTANCE VS. C1 (ESR = 0.1Ω) TABLE 5-2: OUTPUT VOLTAGE RIPPLE VS. C2 (ESR = 0.1Ω) IOUT 5m A VRIPPLE IOUT V+ V OUT RLC2C1 f FSW x C1 V+ V OUT REQUIV REQUIV = RLC2 C1 (µF) TC1240 ROUT(Ω) TC1240A ROUT(Ω) 0.47 47 35 1 28.5 20.5 2.2 19.5 14 3.3 17 12 4.7 15.5 10.5 10 13.6 9.3 47 12.5 8.3 100 12.2 8.1 C 1 (µF) TC1240/TC1240A VRIPPLE (mV) 0.47 142 16 7 2.2 30 3.3 20 4.7 14 10 6.7 47 2.5 100 1.6

 2003 Microchip Technology Inc. DS21516C-page 9 TC1240/TC1240A

5.4 Input Supply Bypassing

The V IN input should be capacitively bypassed to reduce AC impedance and minimize noise effects due to the switching internal to the device. The recommended capacitor should be a large value (at least equal to C 1) connected from the input to GND.

5.5 Shutdown Input

The TC1240 and TC1240A are disabled when SHDN is high, and enabled when SHDN is low. This input cannot be allowed to float. FIGURE 5-3: Test Circuit.

5.6 Voltage Doubler

The most common application for charge pump devices is the doubler (Figure 5-3). This application uses two external capacitors – C 1 and C2 (plus a power supply bypass capacitor, if necessary). The output is equal to 2 x V IN minus any voltage drops due to loading. Refer to T able 5-1 and Table 5-2 for capacitor selection. VIN VOUT RL TC1240 TC1240A VIN OUT C+ GND SHDN Device C 1 C2 C3 TC1240 TC1240A 3 . 3µ F 3 . 3µ F 3 . 3µ F

DS21516C-page 10  2003 Microchip Technology Inc.

5.7 Cascading Devices

Two or more TC1240/TC1240As can be cascaded to increase output voltage (Figure 5-4). If the output is lightly loaded, it will be close to ((n + 1) x V IN), but will droop at least by R OUT of the first device multiplied by the I Q of the second. It can be seen that the output resistance rises rapidly for multiple cascaded devices. For the case of the two-stage ‘tripler’, output resistance can be approximated as R OUT = 2 x R OUT1 + R OUT2, where ROUT1 is the output resistance of the first stage and ROUT2 is the output resistance of the second stage.

5.8 Paralleling Devices

To reduce the value of R OUT, multiple TC1240/ TC1240As can be connected in parallel (Figure 5-5). The output resistance will be reduced by a factor of N, where N is the number of TC1240/TC1240As. Each device will require its own pump capacitor (C1x), but all devices may share one reservoir capacitor (C2). However, to preserve ripple performance, the value of C2 should be scaled according to the number of paralled TC1240/TC1240As, respectively.

5.9 Layout Considerations

As with any switching power supply circuit good layout practice is recommended. Mount components as close together as possible to minimize stray inductance and capacitance. Also use a large ground plane to minimize noise leakage into other circuitry. FIGURE 5-4: Cascading Multiple Devices To Increase Output Voltage. FIGURE 5-5: Paralleling Multiple Devices To Reduce Output Resistance. "n" GND C- OUT3 TC1240 TC1240A SHDN4 VIN GND C- OUT C1A C2B VIN VOUT VOUT = (n + 1)VIN TC1240 TC1240A SHDN4 "1" VIN C1B C2A C1A C1B 1 1 VOUT VOUT = 2 x VIN ROUT = ROUT OF SINGLE DEVICE VIN NUMBER OF DEVICES TC1240 TC1240A TC1240 TC1240A . . . . . . SHDNSHDN Shutdown Control VIN "1" "n"

 2003 Microchip Technology Inc. DS21516C-page 11 TC1240/TC1240A

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

1 & = part number code + temperature range2 (two-digit code) ex: 1240AECH = E N 3 represents year and 2-month code 4 represents production lot ID code

DS21516C-page 12  2003 Microchip Technology Inc. 6-Lead Plastic Small Outline Transistor (CH) (SOT-23) 10501050βMold Draft Angle Bottom 10501050αMold Draft Angle Top 10501050φFoot Angle 1.90.075p1Outside lead pitch (basic) 0.95.038pPitch 66nNumber of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units D B n E L c β φ α A2A exceed .005" (0.127mm) per side. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not Notes: JEITA (formerly EIAJ) equivalent: SC-74A Drawing No. C04-120 *Controlling Parameter

 2003 Microchip Technology Inc. DS21516C-page 13 TC1240/TC1240A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . Sales and Support PART NO. X /XX PackageTemperature Range Device Device TC1240: Positive Doubling Charge Pump with Shutdown TC1240A Positive Doubling Charge Pump with Shutdown Temperature Range I = -40 °C to +85°C (Industrial) Package CHTR: = 6L SOT-23, Tape and Reel Examples: a) TC1240ECHTR: Tape and Reel, 6L SOT-23 (EIAJ) b) TC1240AECHTR: Tape and Reel, 6L SOT-23 (EIAJ) Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

DS21516C-page 14  2003 Microchip Technology Inc. NOTES:

 2003 Microchip Technology Inc. DS21516C-page 15 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, K EELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Accuron, Application Maestro, dsPIC, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartT el and Total Endurance are trademarks of Microchip T echnology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.

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