TC1232 | DigiCamel IC Datasheet

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TC1232 MICROCHIP | Alldatasheet

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Features

Precision Voltage Monitor - Adjustable +4.5V or +4.75V
Reset Pulse Width – 250 msec minimum
No External Components
Adjustable Watchdog Timer - 150 msec, 600 msec or 1.2 sec
Operating Voltage 4.0V to 5.5V
Debounced Manual Reset Input for External Override Block Diagram General Description The TC1232 is a fully-integrated processor supervisor that provides three important functions to safeguard processor sanity: precision power on/off reset control, watchdog timer and external reset override. On power-up, the TC1232 holds the processor in the reset state for a minimum of 250 msec after VCC is within tolerance to ensure a stable system start-up. Microprocessor sanity is monitored by the onboard watchdog circuit. The microprocessor must provide a periodic low-going signal on the ST input. Should the processor fail to supply this signal within the selected time-out period (150 msec, 600 msec or 1200 msec), an out-of-control processor is indicated and the TC1232 issues a processor reset as a result. The outputs of the TC1232 are immediately driven active when the PB input is brought low by an external push button switch or other electronic signal. When connected to a push button switch, the TC1232 provides contact debounce. The TC1232 is packaged in a space-saving 8-Pin PDIP or SOIC package, a 16-Pin SOIC (wide) package and requires no external components. Package Types Device Features VREF RST RST Tolerance Select (5% or 10%) TOL VCC Debounce Watchdog Timebase Select PB RST TD Watchdog Timer ST Reset Generator Device RST pin RST pin Trip Points (Max) Minimum Reset Active Time (ms) WDI Input Typical Timeouts (ms) MR Input Type Pull-up Resistor Active Level Type Active Level TC1232 Open-drain External Low Push-pull High 4.75V or 4.5V 250 150, 600 or 1200 Yes TC1232 RST RST GND TOL TD PB RST RST ST VCC RST ST RST GND TOL TD PB RST RST ST VCC PB RST VCC NC TD NC NC TOL GND NC NC NC TC1232 NC NC 16-Pin SOIC (Wide) 8-Pin PDIP 8-Pin SOIC TC1232 TC1232 Microprocessor Monitor

© 2005 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Voltage on Any Pin (With Respect to GND) Operating Temperature Range: † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = TMIN to TMAX; VCC = +4.0V to 5.5V. Parameters Sym Min Typ Max Units Conditions Supply Voltage VCC 4.0 5.0 5.5 V ST and PB RST Input High Level VIH 2.0 VCC +0.3 V Note 1 ST and PB RST Input Low Level VIL -0.3 +0.8 V Input Leakage ST, TOL IL -1.0 +1.0 µA Output Current RST IOH -1.0 -12 mA VOH = 2.4V Current RST, RST IOL 2.0 mA VOL = 0.4V Operating Current ICC 200 µA Note 2 VCC 5% Trip Point VCCTP 4.50 4.62 4.74 V TOL = GND (Note 3) VCC 10% Trip Point VCCTP 4.25 4.37 4.49 V TOL = VCC (Note 3) Capacitance Electrical Characteristics: Unless otherwise noted, TA = +25°C. (Note 4) Input Capacitance ST, TOL CIN pF Output Capacitance RST, RST COUT pF Note 1: PB RST is internally pulled up to VCC with an internal impedance of typically 40 kΩ. Measured with outputs open. All voltages referenced to GND. Ensured by design.

© 2005 Microchip Technology Inc. Preliminary DS21370C-page 3 TC1232 FIGURE 1-1: Rise Time, Fall Time and Reset Detected to Reset Active Timing Waveforms. AC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = TMIN to TMAX; VCC = +4.0V to 5.5V. Parameters Sym Min Typ Max Units Conditions VCC Fall Time tF µs Note 1 VCC Rise Time tR µs Note 1 VCC Trip Point Detected to RST High and RST Low tRPD 100 ns VCC falling VCC Trip Point Detected to RST High and RST Open tRPU 250 610 1000 ms VCC rising (Note 2) Note 1: Ensured by design. tR = 5 µs. +4.75V tF VCC +4.25V tR VCC +4.25V +4.75V VCC = 5V +4.5V (5% Trip Point) +4.25V (10% Trip Point) RST RST VOL VOH tRPD VCC 4.6V (5% Trip Point) 4.5V(10% Trip Point) RST RST VOL VOH tRPU Determined by external Pull-up resistor Determined by external Pull-up resistor

© 2005 Microchip Technology Inc. FIGURE 1-2: Push Button Reset and Watchdog Timer Reset Timing Waveforms. AC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, TA = TMIN to TMAX; VCC = +4.0V to 5.5V. Parameters Sym Min Typ Max Units Conditions PB RST Pulse Width tPB ms Note 1 PB RST Falling Edge Low to Reset Active tPBD ms PB RST Rising Edge High to Reset Inactive tRST 250 610 1000 ms ST Pulse Width tST ns ST Time-out Period tTD 62.5 150 250 ms TD Pin = 0V 250 600 1000 ms TD Pin = Open 500 1200 2000 ms TD Pin = VCC Note 1: PB RST must be held low for a minimum of 20 ms to ensure a reset. RST VIL tPB RST tPBD VIH tRST PB RST The debounced PB RST input ignores input pulses less than 1 ms and is designed to recognize pulses of 20 ms or greater. tST ST tTD RST (when tTD ≤ tTD (min)) “H” RST (when tTD(min) ≤ tTD ≤ tTD(max)) (when tTD ≥ tTD(max)) RST RST (when tTD ≤ tTD(min)) “L” RST (when tTD(min) ≤ tTD ≤ tTD(max)) (when tTD ≥ tTD(max)) RST

© 2005 Microchip Technology Inc. 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLES Pin No. Symbol Pin Type Buffer/ Driver Type Function 8-pin PDIP, SOIC 16-pin SOIC PB RST I ST Push-button Reset Input. Input for a Manual Reset Switch. This input debounces (ignores) pulses less than 1 ms in duration and is ensured to recognize inputs of 20 ms or greater. L = Manual Reset Switch is Active, Force RST/RST pins Active H = Manual Reset Switch is Inactive. State of RST/RST pins determined by other system conditions. TD I ST Time Delay Input. The voltage level on this input determines the watchdog timer time-out period. TD = 0V → tTD = 150 ms TD = Open → tTD = 600 ms TD = VCC → tTD = 1.2 sec TOL I ST Tolerance Input. TOL = GND, Max Voltage Trip Point (VCCTP) = 4.75V (5% tolerance) TOL = VCC, Max Voltage Trip Point (VCCTP) = 4.5V (10% tolerance) GND P The ground reference for the device. RST O Push Pull Reset Output (Active-High) Goes active (High) if one of these conditions occurs: If VCC falls below the selected reset voltage threshold. If PB RST pin is forced low. If ST pin is not strobed within the minimum selected time-out period. (see TD pin) During power-up RST O Open Drain Reset Output (Active-Low) Goes active (Low) if one of these conditions occurs: If VCC falls below the selected reset voltage threshold. If PB RST pin is forced low. If ST pin is not strobed within the minimum selected time-out period. (see TD pin) During power-up ST I ST Strobe Input Input for Watchdog Timer. WDT period determined by state of TD pin Falling Edge → Resets Watchdog Timer counter (no time-out) VCC P The positive supply (+5V) for the device. 1,3,5, 7,10,1 2,16 NC No internal connection.

© 2005 Microchip Technology Inc. 5.0 PACKAGING INFORMATION 5.1 Package Marking Information XXXXXXXX XXXXXNNN YYWW 8-Lead PDIP (300 mil) Examples: 8-Lead SOIC (150 mil) Examples: XXXXXXXX XXXXYYWW NNN TC1232 I/P256 0518 TC1232 COA0518 256 16-Lead SOIC (150 mil) Examples: XXXXXXXXXXXXX YYWWNNN XXXXXXXXXXXXX TC1232COE 0518256 XXXXXXXXXX Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e TC1232 CPA^^256 0518 TC1232E OA^^0518 256 TC1232COE^^ 0518256 XXXXXXXXXX OR OR OR e e e

© 2005 Microchip Technology Inc. Preliminary DS21370C-page 11 TC1232 8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP) B A L p α E eB β c n D Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n Pitch p .100 2.54 Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness c .008 .012 .015 0.20 0.29 0.38 Upper Lead Width .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top α Mold Draft Angle Bottom β * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed JEDEC Equivalent: MS-001 Drawing No. C04-018 .010” (0.254mm) per side. § Significant Characteristic

© 2005 Microchip Technology Inc. 8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC) Foot Angle φ β Mold Draft Angle Bottom α Mold Draft Angle Top 0.51 0.42 0.33 .020 .017 .013 B Lead Width 0.25 0.23 0.20 .010 .009 .008 c Lead Thickness 0.76 0.62 0.48 .030 .025 .019 L Foot Length 0.51 0.38 0.25 .020 .015 .010 h Chamfer Distance 5.00 4.90 4.80 .197 .193 .189 D Overall Length 3.99 3.91 3.71 .157 .154 .146 Molded Package Width 6.20 6.02 5.79 .244 .237 .228 E Overall Width 0.25 0.18 0.10 .010 .007 .004 Standoff 1.55 1.42 1.32 .061 .056 .052 Molded Package Thickness 1.75 1.55 1.35 .069 .061 .053 A Overall Height 1.27 .050 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units D n p B E h L β c 45° φ α A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 § Significant Characteristic

© 2005 Microchip Technology Inc. Preliminary DS21370C-page 13 TC1232 16-Lead Plastic Small Outline (OE) – Wide, 300 mil (SOIC) Foot Angle φ β Mold Draft Angle Bottom α Mold Draft Angle Top 0.51 0.42 0.36 .020 .017 .014 B Lead Width 0.33 0.28 0.23 .013 .011 .009 c Lead Thickness 1.27 0.84 0.41 .050 .033 .016 L Foot Length 0.74 0.50 0.25 .029 .020 .010 h Chamfer Distance 10.49 10.30 10.10 .413 .406 .398 D Overall Length 7.59 7.49 7.39 .299 .295 .291 Molded Package Width 10.67 10.34 10.01 .420 .407 .394 E Overall Width 0.30 0.20 0.10 .012 .008 .004 Standoff 2.39 2.31 2.24 .094 .091 .088 Molded Package Thickness 2.64 2.50 2.36 .104 .099 .093 A Overall Height 1.27 .050 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units L β c φ h 45° D p n B E α A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-102 § Significant Characteristic

REVISION HISTORY

Revision C (June 2005) The following is the list of modifications: Since no data is given in Section 2.0 “Typical Performance Curves”, “Preliminary” was added to the bottom of this document. Corrected Operating Voltage in the Electrical Specifications General Data Sheet Enhancements Added Revision History Appendix Section Revision B (March 2003)

Not logged Revision A (March 2002)
Original Release of this Document.

© 2005 Microchip Technology Inc. Preliminary DS21370C-page 17 TC1232 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: TC1232: Microprocessor Monitor Temperature Range: C = 0°C to +70°C E = -40°C to +85°C Package: PA = Plastic DIP (300 mil Body), 8-lead OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead Tape and Reel OE = Plastic SOIC (300 mil Body), 16-lead OE713 = Plastic SOIC (300 mil Body), 16-lead Tape and Reel PART NO. X /XX Package Temperature Range Device Examples: a) TC1232COA: 0°C to +70°C, 8L-SOIC b) TC1232COA713: 0°C to +70°C, 8L-SOIC, Tape and Reel c) TC1232COE: 0°C to +70°C, 16L-SOIC d) TC1232COE713: 0°C to +70°C, 16L-SOIC Tape and Reel e) TC1232CPA: 0°C to +70°C, 8L-PDIP f) TC1232EOA: -40°C to +85°C, 8L-SOIC g) TC1232EOA713: -40°C to +85°C, 8L-SOIC, Tape and Reel h) TC1232EOE: -40°C to +85°C, 16L-SOIC i) TC1232EOE713: -40°C to +85°C, 16L-SOIC, Tape and Reel j) TC1232EPA: -40°C to +85°C, 8L-PDIP

© 2005 Microchip Technology Inc. Preliminary DS21370C-page 19 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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Product Information

TC1232 specifications and overview.

Summary

Microprocessor Monitor 2005

Description

Microprocessor Monitor 2005

Source title TC1232 Datasheet(PDF) - Microchip Technology

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