TC1211LC CITC | Alldatasheet

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Dimensions in inches and (millimeters) ■Features ■ Mechanical data ■Maximum ratings and electrical characteristics (at TA=25°C unless otherwise noted) ■Outline ESD Protection Device TC1211LC Document ID : DS-22V13 Revised Date : 2017/02/13 Revision : C SOD-923F

  • Case : 0402/SOD-923F standard package,molded plastic.
  • Terminals : Gold plated, solderable per MIL-STD-750 Method 2026
  • Μarking Code : Cathode band & E2 Uni-directional ESD protection.• Surface mount package.• Ultra small SMD package:0402.• High component density.• 0.041(1.05) 0.037(0.95) 0.026(0.65) 0.022(0.55) 0.020(0.50) 0.022(0.55) 0.018(0.45) 0.014(0.35) 0.010(0.25) 0.016(0.40) Symbol TypParameter Min Max Unit Junction capacitance Conditions Leakage current IL uA 60CT pFVR =0V,f =1MHz 1.0VR = 12V ESD capability kV 30 Storage temperature Operating Junction temperature +125 °C TSTG Tj °C+150-55 ESDIEC 61000-4-2(air) IEC 61000-4-2(contact) 30 Peak pulse power Clamping Voltage 19 V PPP Vc 120 IPP = 5 A, tp=8/20us IPP = 1 A, tp=8/20us Vc V24 W ESD kV 0.1 -55 Marking code E5
  • Mounting position : Any.
  • Weight : 0.001 grams(Approx). ■ Circuit Diagram Forward voltage VF VIF = 10mA 0.8 Diode breakdown voltage VBD VIR = 1mA 13.3 15.5 17.5 Chip Integration Technology Corporation

■Rating and characteristic curves f=1MHz TA=25°C 0 2 4 6 128 Capacitance Between Terminals, (PF) Reverse Voltage, (V) Fig.5 - Capacitance Between Terminals Characteristics Clamping Voltage, (V) Fig.3 - Clamping Voltage Vs. Peak Pulse Current Peak Pulse Current, (A) Fig.4 - Voltage Vs. Clamping Forward CurrentPeak Pulse Forward Current, (A)Peak Pulse Power Rating, (%) Ambient Temperature, ( °C ) Mounting on glass epoxy PCBs 100 120 25 50 75 100 1500 125 Fig.2 - Power Rating Derating Curve Voltage, (V) 3210 8/20us waveform 4 5 12 1.5 0.5 6420 8/20us waveform 2.5 8 10 Time, (us) 20% 40% 60% 80% 100% 0 5 15 25 3010 20 120% Percentage Of Ipp Ta=25°C Peak Valur Ipp Test Waveform parameters tf=8us td=20us e -t td= t Ipp/2 Fig.1 - 8/20us Peak Pulse Current Wave Form Acc. IEC 61000-4-5 ESD Protection Device TC1211LC Document ID : DS-22V13 Revised Date : 2017/02/13 Revision : C Chip Integration Technology Corporation

■Reel Taping Specification Trailer Device Leader 10 pitches (min)10 pitches (min) D1 D2 D T C Direction of Feed B C d D D2D1 E F P P0 P1 T SYMBOL A W W1 (mm) SYMBOL (mm) 4.00 0.10± 1.55 0.10± 178 1± o Index hole d E F B W P A 0402/ SOD-923F 0402/ SOD-923F ESD Protection Device TC1211LC Document ID : DS-22V13 Revised Date : 2017/02/13 Revision : C Chip Integration Technology Corporation

http://www.citcorp.com.tw/ Tel:886-3-5600628 Fax:886-3-5600636 ■ CITC reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final■ design, purchase or use. CITC makes no warranty, representation or guarantee regarding the suitability of its products for any■ particular purpose, nor does CITC assume any liability for application assistance or customer product design. CITC does not warrant or accept any liability with products which are purchased or used for any■ unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of CITC.■ CITC products are not authorized for use as critical components in life support devices or systems■ without express written approval of CITC. Dimensions in inches and (millimeters) ■SOD-923F foot print A C B B 0.020 (0.50) A 0.028 (0.70) C 0.010 (0.25) ESD Protection Device TC1211LC Document ID : DS-22V13 Revised Date : 2017/02/13 Revision : C Chip Integration Technology Corporation