TC1173 MICROCHIP | Alldatasheet
Document overview
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Technical content
Features
- Extremely Low Supply Current for Longer Battery Life Very Low Dropout Voltage 300mA Output Current Standard or Custom Output Voltages ERROR Output Can Be Used as a Low Battery Detector or Processor Reset Generator Power Saving Shutdown Mode Bypass Input for Ultra Quiet Operation Over Current and Over Temperature Protection Space-Saving MSOP Package Option
Applications
Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS
- Pagers Device Selection Table NOTE: xx indicates output voltages Other output voltages are available. Please contact Microchip Technology Inc. for details. General Description The TC1173 is a precision output (typically ±0.5%) CMOS low dropout regulator. Total supply current is typically 50µA at full load (20 to 60 times lower than in bipolar regulators). TC1173 key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 240mV at full load) and internal feed-forward compensation for fast response to step changes in load. An error output (ERROR ) is asserted when the TC1173 is out-of-regulation (due to a low input voltage or excessive output current). ERROR c a nb es e ta sa low battery warning or as a processor RESET signal (with the addition of an external RC network). Supply current is reduced to 0.05 µA (typical) and V OUT and ERROR fall to zero when the shutdown input is low. The TC1173 incorporates both over temperature and over current protection. The TC1173 is stable with an output capacitor of only 1 µF and has a maximum output current of 300mA. Typical Application Package Type Part Number Package Junction Temp. Range TC1173-xxVOA 8-Pin SOIC -40°C to +125°C TC1173-xxVUA 8-Pin MSOP -40°C to +125°C TC1173 8VOUTVOUT CBYPASS 470pF (Optional) Shutdown Control (from Power Control Logic) 1µF GND NC Bypass VIN VIN NC SHDN ERROR ERROR 8-Pin SOIC VIN NC VOUT GND NC Bypass TC1173VOA 8-Pin MSOP VIN NC VOUT GND NC Bypass SHDNTC1173VUA ERROR SHDN ERROR 300mA CMOS LDO with Shutdown ERROR Output and Bypass
DS21362B-page 2 2002 Microchip Technology Inc.
1.0 ELECTRICAL
Absolute Maximum Ratings* Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1173 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN =V OUT +1 V ,IL =0 . 1 m A ,CL =3 . 3µF, SHDN >V IH,T A = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions VIN Input Operating Voltage 2.7 — 6.0 V Note 8 IOUTMAX Maximum Output Current 300 —— m A VOUT Output Voltage — VR –2 . 5 % VR ±0.5% VR +2 . 5 % V Note 1 ∆VOUT/∆TV OUT T emperature Coefficient — 40 —p p m / ° C Note 2 ∆VOUT/∆VIN Line Regulation — 0.05 0.35 %( V R +1 V )≤ VIN ≤ 6V ∆VOUT/VOUT Load Regulation — 0.5 2.0 %I L = 0.1mA to IOUTMAX (Note 3) VIN-VOUT Dropout Voltage — 240 160 480 mV I L =0 . 1 m A IL =1 0 0 m A IL =3 0 0 m A(Note 4) ISS1 Supply Current — 50 90 µA SHDN =V IH, ISS2 Shutdown Supply Current — 0.05 0.5 µA SHDN =0 V PSRR Power Supply Rejection Ratio — 60 — dB F RE ≤ 1kHz IOUTSC Output Short Circuit Current — 550 650 mA V OUT =0 V ∆VOUT/∆PD Thermal Regulation — 0.04 — V/W Note 5 eN Output Noise — 260 — nV/ √Hz F=1 k H z ,COUT =1 µF, RLOAD =5 0Ω SHDN Input VIH SHDN Input High Threshold 45 —— % V IN VIL SHDN Input Low Threshold — — 15 %VIN ERROR Output VMIN Minimum Operating Voltage 1.0 — — V VOL Output Logic Low Voltage — — 400 mV 1 mA Flows to ERROR VTH ERROR Threshold Voltage — 0.95 x V R —V VOL ERROR Positive Hysteresis — 50 — mV Note 7 Note 1: VR is the user-programmed regulator output voltage setting. 3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regula- tion specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. 5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to I LMAX at VIN = 6V for T = 10 msec. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA,T J, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. 7: Hysteresis voltage is referenced by VR. 8: The minimum VIN has to justify the conditions: VIN ≥ VR +V DROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX. TC VOUT =( VOUTMAX –V OUTMIN)x1 0 6 VOUT x ∆T
2002 Microchip Technology Inc. DS21362B-page 3 TC1173
2.0 PIN DESCRIPTIONS
T h ed e s c r i p t i o n so ft h ep i n sa r el i s t e di nT a b l e2 - 1 . TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin SOIC) (8-Pin MSOP) Symbol Description 1V OUT Regulated voltage output. 2 GND Ground terminal. 3 NC No connect. 4 Bypass Reference bypass input. Connecting a 470pF to this input further reduces output noise.
5 ERROR
Out-of-Regulation Flag. (Open drain output). This output goes low when V OUT is out-of-tolerance by approximately – 5%. 6 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.05 µA( t y p i c a l ) . 7 NC No connect. IN Unregulated supply input.
DS21362B-page 4 2002 Microchip Technology Inc.
3.0 DETAILED DESCRIPTION
The TC1173 is a fixed output, low drop-out regulator. Unlike bipolar regulators, the TC1173’s supply current does not increase with load current. In addition, V OUT remains stable and within regulation over the entire 0mA to I OUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN ) is at or above V IH, and shutdown (disabled) when SHDN is at or below V IL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 µA (typical), V OUT falls to zero and ERROR is disabled. FIGURE 3-1: TYPICAL APPLICATION CIRCUIT
3.1 ERROR Output
ERROR is driven low whenever V OUT falls out of regulation by more than – 5% (typical). This condition may be caused by low input voltage, output current limiting, or thermal limiting. The ERROR threshold is 5% below rated V OUT regardless of the programmed output voltage value (e.g., ERROR =V OL at 4.75V regulator). ERROR output operation is shown in Figure 3-2. Note that ERROR is active when V OUT is at or below VTH, and inactive when VOUT is above VTH +V H. As shown in Figure 3-1, ERROR c a nb eu s e da sa battery low flag, or as a processor RESET signal (with the addition of timing capacitor C3). R1 x C3 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200 msec to allow time for the system to stabilize. Pull-up resistor R1 can be tied to V OUT,V IN or any other voltage less than (V IN +0 . 3 V ) . FIGURE 3-2: ERROR OUTPUT OPERATION
3.2 Output Capacitor
A1 µF (min) capacitor from V OUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1 Ω and less than 5.0Ω.A1 µF capacitor should be connected from V IN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recom- mended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
3.3 Bypass Input
A 470pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. TC1173 VOUTVOUT CBYPASS 470pF (Optional) Shutdown Control (from Power Control Logic) 1µF GND NC Bypass VIN NC SHDN ERROR 5 C3 required only if ERROR is used as a processor RESET signal. (see text) Battery RESET or Battery Low 1µF 0.2µF VTH VOUT ERROR VIH VOL HYSTERESIS (VH)
2002 Microchip Technology Inc. DS21362B-page 5 TC1173
4.0 THERMAL CONSIDERATIONS
4.1 Thermal Shutdown
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150°C. The regulator remains off until the die temperature drops to approximately 140°C.
4.2 Power Dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: EQUATION 4-1: The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (θJA). The 8-Pin SOIC package has a θJA of approxi- mately 160°C/Watt, while the 8-Pin MSOP package has a θ JA of approximately 200°C/Watt. EQUATION 4-2: Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: V INMAX = 3.0V ± 10% VOUTMIN = 2.7V ± 0.5% ILOADMAX = 250mA TJMAX = 125°C TAMAX =5 5 ° C θJA = 200°C/W 8-Pin MSOP Package Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD ≈ (VINMAX –V OUTMIN)ILOADMAX = 155mW Maximum allowable power dissipation: In this example, the TC1173 dissipates a maximum of 155mW; below the allowable limit of 350mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable V IN is found by substituting the maximum allowable power dissipation of 250mW into Equation 4-1, from which V INMAX =4 . 1 V .
4.3 Layout Considerations
The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θ JA and therefore increase the maximum allowable power dissipation limit. Where: PD ≈ (VINMAX –V OUTMIN)ILOADMAX PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Minimum regulator output voltage = Maximum output (load) current = Maximum voltage on VIN PDMAX =( TJMAX –T AMAX) θJA Where all terms are previously defined. PDMAX =( TJMAX –T AMAX) θJA = (125 – 55) 200 = 350mW
DS21362B-page 6 2002 Microchip Technology Inc.
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Output Noise FREQUENCY (kHz) NOISE (µV/√HZ) 10.0 1.0 0.01 0.01 1 10 100 1000 0.1 0.0 RLOAD = 50Ω COUT = 1µF 0.012 0.010 0.008 0.004 0.002 0.000 -0.002 -0.004 0.006 TEMPERATURE (°C) Line Regulation LINE REGULATION (%) 2.00 1.80 1.60 1.20 1.00 0.80 0.60 0.40 0.20 0.00 1.40 TEMPERATURE ( °C) Load Regulation LOAD REGULATION (%) 1 to 300mA 1 to 50mA 1 to 100mA 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 50 100 150 200 250 300 LOAD CURRENT (mA) Dropout Voltage vs. Load Current DROPOUT VOLTAGE (V) 100.0 90.0 70.0 80.0 50.0 40.0 60.0 TEMPERATURE (°C) Supply Current SUPPLY CURRENT (µA) 3.075 3.025 2.925 2.975 TEMPERATURE (°C) VOUT vs. Temperature VOUT (V) 125°C 885°CC 70°C 25°C 0°CC -40°C VIN = 4V ILOAD = 100µA CLOAD = 3.3µF
2002 Microchip Technology Inc. DS21362B-page 7 TC1173
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Package marking data not available at this time.
6.2 Taping Form
Component Taping Orientation for 8-Pin MSOP Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin MSOP 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size PIN 1 User Direction of Feed Standard Reel Component Orientation for TR Suffix Device W P Component Taping Orientation for 8-Pin SOIC (Narrow) Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size Standard Reel Component Orientation for TR Suffix Device PIN 1 User Direction of Feed P W
DS21362B-page 8 2002 Microchip Technology Inc.
6.3 Package Dimensions
.122 (3.10) .114 (2.90) .122 (3.10) .114 (2.90) .043 (1.10) MAX. .006 (0.15) .002 (0.05) .016 (0.40) .010 (0.25) .197 (5.00) .189 (4.80) .008 (0.20) .005 (0.13) .028 (0.70) .016 (0.40) 6° MAX. .026 (0.65) TYP. PIN 1 Dimensions: inches (mm) .050 (1.27) TYP. 8° MAX. PIN 1 .244 (6.20) .228 (5.79) .157 (3.99) .150 (3.81) .197 (5.00) .189 (4.80) .020 (0.51) .013 (0.33) .010 (0.25) .004 (0.10) .069 (1.75) .007 (0.18) .050 (1.27) .016 (0.40) 8-Pin SOIC Dimensions: inches (mm)
2002 Microchip Technology Inc. DS21362B-page 9 TC1173 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. T o determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21362B-page 10 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21362B-page 11 TC1173 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip T echnology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, K EELOQ,m i c r o I D ,M P L A B ,P I C ,P I C m i c r o ,P I C M A S T E R , PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Tech- nology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and T otal Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
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