TC1121CPA | DigiCamel IC Datasheet

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Optional High-Frequency Operation Allows Use of Small Capacitors Low Operating Current (FC = GND): -5 0 μA High Output Current (100 mA) Converts a 2.4V to 5.5V Input Voltage to a Corresponding Negative Output Voltage (Inverter mode) Uses Only 2 Capacitors; No Inductors Required Selectable Oscillator Frequency: - 10 kHz to 200 kHz Power-Saving Shutdown Input Available in 8-Pin MSOP, 8-Pin PDIP and 8-Pin Small Outline (SOIC) Packages Applications: Laptop Computers Medical Instruments D i s k D r i v e s μP-Based Controllers Process Instrumentation Device Selection Table Package Type General Description: The TC1121 is a charge pump converter with 100 mA output current capability. It converts a 2.4V to 5.5V input to a corresponding negative output voltage. As with all charge pump converters, the TC1121 uses no inductors saving cost, size and EMI. An on-board oscillator operates at a typical frequency of 10 kHz (at V + = 5V) when the frequency control input (FC) is connected to ground. The oscillator frequency increases to 200 kHz when FC is connected to V +, allowing the use of smaller capacitors. Operation at sub-10 kHz frequencies results in lower quiescent NScurrent and is accomplished with the addition of an external capacitor from OSC (pin 7) to ground. The TC1121 also can be driven from an external clock NSconnected OSC. Typical supply current at 10 kHz is 50 μA, and falls to less than 1 μA when the shutdown input is brought low, whether the internal or an external clock is used. The TC1121 is available in 8-pin SOIC, MSOP and PDIP packages. Part Number Package Operating Temp. Range TC1121COA 8-Pin SOIC 0°C to +70°C TC1121CPA 8-Pin PDIP 0°C to +70°C TC1121CUA 8-Pin MSOP 0°C to +70°C TC1121EOA 8-Pin SOIC -40°C to +85°C TC1121EPA 8-Pin PDIP -40°C to +85°C TC1121EUA 8-Pin MSOP -40°C to +85°C TC1121COA TC1121EOA TC1121CUA TC1121EUA SHDN FC CAP+ CAP– GND OSC 8-Pin SOIC 8-Pin MSOP VOUT TC1121CPA TC1121EPA SHDN FC CAP+ CAP– GND OSC 8-Pin PDIP VOUT 100mA Charge Pump Voltage Converter with Shutdown

1.0 ELECTRICAL

Absolute Maximum Ratings* Package Power Dissipation (TA ≤ 70°C) Operating Temperature Range *Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1121 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = 0°C to 70°C (C suffix), -40°C to +85°C (E suffix), V += 5V ±10% COSC = Open, C1, C2 = 10 μF, FC = V+, SHDN = VIH, typical values are at TA = 25°C unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions IDD Active Supply Current — 0.6 100 μA mA RL = Open, FC = Open or GND RL = Open, FC = V+ ISHUTDOWN Shutdown Supply Current — 0.2 1.0 μAS H D N = 0V V+ Supply Voltage 2.4 — 5.5 V VIH SHDN Input Logic High V DD x 0.8 — — V VIL SHDN Input Logic Low — — 0.4 V IIN Input Leakage Current -1 μAS H D N , OSC FC pin ROUT Output Source Resistance — 12 20 Ω IOUT = 60 mA IOUT Output Current 60 100 V OUT = more negative than -3.75V FOSC Oscillator Frequency 5 100 200 kHz Pin 7 Open, Pin 1 Open or GND SHDN = VIH, Pin 1 = V+ PEFF Power Efficiency — % FC = GND for all R L = 2k between V+ and VOUT RL = 1kΩ between VOUT and GND IL = 60 mA to GND VEFF Voltage Conversion Efficiency 99 99.9 — % R L = Open Note 1: Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no inputs from sources operating from external supplies be applied prior to “power up” of the TC1121.

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin MSOP , PDIP , SOIC) Symbol Description

1 FC Frequency control for internal oscillator, FC = open, F OSC = 10 kHz typ; FC = V+, FOSC

= 200 kHz typ; FC has no effect when OSC pin is driven externally. 2C A P + Charge-pump capacitor, positive terminal. 3 GND Power-supply ground input. 4C A P – Charge-pump capacitor, negative terminal. 5 OUT Output, negative voltage. 6 SHDN Shutdown. 7 OSC Oscillator control input. An external capacitor can be added to slow the oscillator. Take care to minimize stray capacitance. An external oscillator also may be connected to overdrive OSC. + Power-supply positive voltage input.

3.0 APPLICATIONS

3.1 Negative Voltage Converter

The TC1121 is typically used as a charge-pump voltage inverter. C1 and C2 are the only two external capacitors used in the operating circuit (Figure 3-1). FIGURE 3-1: Charge Pump Inverter The TC1121 is not sensitive to load current changes, although its output is not actively regulated. A typical output source resistance of 11.8Ω means that an input of +5V results in -5V output voltage under light load, and only decreases to -3.8V typ with a 100 mA load. The supplied output current is from capacitor C2 during one-half the charge-pump cycle. This results in a peak-to-peak ripple of: V RIPPLE = IOUT/2(fPUMP) (C2) + IOUT (ESRC2) Where fPUMP is 5 kHz (one half the nominal 10 kHz oscillator frequency), and C2 = 150 μF with an ESR of 0.2Ω, ripple is about 90 mV with a 100 mA load current. If C2 is raised to 390 μF, the ripple drops to 45 mV.

3.2 Changing Oscillator Frequency

The TC1121’s clock frequency is controlled by four modes: TABLE 3-1: OSCILLATOR FREQUENCY MODES The oscillator runs at 10 kHz (typical) when FC and OSC are not connected. The oscillator frequency is lowered by connecting a capacitor between OSC and GND, but FC can still multiply the frequency by 20 times in this mode. An external clock source that swings within 100 mV of V + and GND may overdrive OSC in the Inverter mode. OSC can be driven by any CMOS logic output. When OSC is overdriven, FC has no effect. Note that the frequency of the signal appearing at CAP + and CAP– is half that of the oscillator. In addition, by lowering the oscillator frequency, the effective output resistance of the charge-pump increases. To compensate for this, the value of the charge-pump capacitors may be increased. Because the 5 kHz output ripple frequency may be low enough to interfere with other circuitry, the oscillator frequency can be increased with the use of the FC pin or an external oscillator. The output ripple frequency is half the selected oscillator frequency. Although the TC1121’s quiescent current will increase if the clock frequency is increased, it allows smaller capacitance values to be used for C1 and C2.

3.3 Capacitor Selection

In addition to load current, the following factors affect the TC1121 output voltage drop from its ideal value 1) output resistance, 2) pump (C1) and reservoir (C2) capacitor ESRs and 3) C1 and C2 capacitance. The voltage drop is the load current times the output resistance. The loss in C2 is the load current times C2’s ESR; C1’s loss is larger because it handles currents greater than the load current during charge-pump operation. Therefore, the voltage drop due to C1 is about four times C1’s ESR multiplied by the load current, and a low (or high) ESR capacitor has a greater impact on performance for C1 than for C2. In general, as the TC1121’s pump frequency increases, capacitance values needed to maintain comparable ripple and output resistance diminish proportionately. 2.4V to 5.5V VOUT TC1121 GND OSCCAP+ CAP– FC VOUT VIN SHDN *SHDN should be tied to VIN if not used. SHDN* FC OSC Oscillator Frequency Open Open 10 kHz FC = V+ Open 200 kHz Open or FC = V+ External Capacitor See Typical Operating Characteristics Open External Clock External Clock Frequency

3.4 Cascading Devices

To produce greater negative magnitudes of the initial supply voltage, the TC1121 may be cascaded (see Figure 3-2). Resulting output resistance is approxi- mately equal to the sum of individual TC1121 R OUT values. The output voltage (where n is an integer representing the number of devices cascaded) is defined by VOUT = -n (VIN).

3.5 Paralleling Devices

To reduce output resistance, multiple TC1121s may be paralleled (see Figure 3-3). Each device needs a pump capacitor C1, but the reservoir capacitor C2 serves all devices. The value of C2 should be increased by a factor of n (the number of devices). FIGURE 3-2: Cascading TC1121s to Increase Output Voltage FIGURE 3-3: Paralleling TC1121s to Reduce Output Resistance C1 C1n 4 4 8 8 VIN C2n TC1121 TC1121 GND GND OSC OSCCAP+ CAP+ CAP– CAP– FC FC SHDN VOUT VOUT VIN VOUT VIN SHDN SHDN*SHDN* “1” “n” *SHDN should be tied to VIN if not used. C1n 4 4 8 8 V+IN TC1121 TC1121 GND GND OSC OSCCAP+ CAP+ CAP– CAP– FC FC SHDN VOUT VOUT VIN VIN SHDN SHDN*SHDN* *SHDN should be tied to VIN if not used. “1” “n”

7 OSC

ROUT = ROUT (of TC1121)/n(number of devices)

3.6 Combined Positive Supply

Multiplication and Negative Voltage Conversion Figure 3-4 shows this dual function circuit, in which capacitors C1 and C2 perform pump and reservoir functions to generate negative voltage. Capacitors C3 and C4 are the respective capacitors for multiplied positive voltage. This particular configuration leads to higher source impedances of the generated supplies due to the finite impedance of the common charge-pump driver. FIGURE 3-4: Combined Positive Multiplier and Negative Converter D1, D2 = 1N4148 VIN VOUT = (2VIN) – (VFD1) – (VFD2) TC1121 GND OSCCAP+ CAP– FC SHDN VOUT VIN SHDN* VOUT = VIN *SHDN should be tied to VIN if not used.

4.0 PACKAGING INFORMATION

4.1 Package Marking Information

Package marking data not available at this time.

4.2 Taping Form

Component Taping Orientation for 8-Pin MSOP Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin MSOP 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size Pin 1 User Direction of Feed Standard Reel Component Orientation for 713 Suffix Device W P Component Taping Orientation for 8-Pin SOIC (Narrow) Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size Standard Reel Component Orientation for 713 Suffix Device Pin 1 User Direction of Feed P W

4.3 Package Dimensions

.122 (3.10) .114 (2.90) .122 (3.10) .114 (2.90) .043 (1.10) Max. .006 (0.15) .002 (0.05) .016 (0.40) .010 (0.25) .197 (5.00) .189 (4.80) .008 (0.20) .005 (0.13) .028 (0.70) .016 (0.40) 6° Max. .026 (0.65) Typ. Pin 1 Dimensions: inches (mm) 3° Min. Pin 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm)

DS21358C-page 10 © 2006 Microchip Technology Inc. Package Dimensions (Continued) .050 (1.27) Typ. 8° Max. Pin 1 .244 (6.20) .228 (5.79) .157 (3.99) .150 (3.81) .197 (5.00) .189 (4.80) .020 (0.51) .013 (0.33) .010 (0.25) .004 (0.10) .069 (1.75) .007 (0.18) .050 (1.27) .016 (0.40) 8-Pin SOIC Dimensions: inches (mm)

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Product Information

TC1121CPA specifications and overview.

Summary

100mA Charge Pump Voltage Converter with Shutdown 02/16/06

Description

100mA Charge Pump Voltage Converter with Shutdown 02/16/06

Source title TC1121CPA Datasheet(PDF) - Microchip Technology

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