TC1121 MICROCHIP | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 14
Technical content
Features
- Optional High-Frequency Operation Allows Use of Small Capacitors Low Operating Current (FC = GND) -5 0 µA High Output Current (100mA) Converts a 2.4V to 5.5V Input Voltage to a Corresponding Negative Output Voltage (Inverter Mode) Uses Only 2 Capacitors; No Inductors Required Selectable Oscillator Frequency - 10kHz to 200kHz Power-Saving Shutdown Input Available in 8-Pin MSOP , 8-Pin PDIP and 8-Pin Small Outline (SOIC) Packages
Applications
Laptop Computers Medical Instruments D i s k D r i v e s µP-Based Controllers Process Instrumentation Device Selection Table Package Type General Description The TC1121 is a charge pump converter with 100mA output current capability. It converts a 2.4V to 5.5V input to a corresponding negative output voltage. As with all charge pump converters, the TC1121 uses no inductors saving cost, size and EMI. An on-board oscillator operates at a typical frequency of 10kHz (at V + = 5V) when the frequency control input (FC) is connected to ground. The oscillator frequency increases to 200kHz when FC is connected to V +, allowing the use of smaller capacitors. Operation at sub-10kHz frequencies results in lower quiescent NScurrent and is accomplished with the addition of an external capacitor from OSC (pin 7) to ground. The TC1121 also can be driven from an external clock NSconnected OSC. Typical supply current at 10kHz is 50µA, and falls to less than 1 µA when the shutdown input is brought low, whether the internal or an external clock is used. The TC1121 is available in 8-pin SOIC, MSOP and PDIP packages. Part Number Package Operating Temp. Range TC1121COA 8-Pin SOIC 0°C to +70°C TC1121CPA 8-Pin PDIP 0°C to +70°C TC1121CUA 8-Pin MSOP 0°C to +70°C TC1121EOA 8-Pin SOIC -40°C to +85°C TC1121EPA 8-Pin PDIP -40°C to +85°C TC1121EUA 8-Pin MSOP -40°C to +85°C TC1121COA TC1121EOA TC1121CUA TC1121EUA SHDN FC CAP+ CAP– GND OSC 8-Pin SOIC 8-Pin MSOP VOUT TC1121CPA TC1121EPA SHDN FC CAP+ CAP– GND OSC 8-Pin PDIP VOUT 100mA Charge Pump Voltage Converter with Shutdown
DS21358B-page 2 2002 Microchip Technology Inc. Functional Block Diagram HDN C1121SC Control C SC ND UT witch atrix RC Oscillator ogic ircuits AP AP
2002 Microchip Technology Inc. DS21358B-page 3 TC1121
1.0 ELECTRICAL
Absolute Maximum Ratings* Package Power Dissipation (TA ≤ 70°C) Operating Temperature Range *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.TC1121 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = 0°C to 70°C (C suffix), -40°C to +85°C (E suffix), V+= 5V ±10% COSC = Open, C1, C2 = 10µF, FC = V+, SHDN = VIH, typical values are at TA = 25°C unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions IDD Active Supply Current — 0.6 100 µA mA RL = Open, FC = Open or GND RL = Open, FC = V+ ISHUTDOWN Shutdown Supply Current — 0.2 1.0 µAS H D N = 0V V+ Supply Voltage 2.4 — 5.5 V VIH SHDN Input Logic High V DD x 0.8 —— V VIL SHDN Input Logic Low —— 0.4 V IIN Input Leakage Current -1 µAS H D N , OSC FC pin ROUT Output Source Resistance — 12 20 Ω IOUT = 60mA IOUT Output Current 60 100 V OUT = more negative than -3.75V FOSC Oscillator Frequency 5 100 200 kHz Pin 7 Open, Pin 1 Open or GND SHDN = VIH, Pin 1 = V+ PEFF Power Efficiency — % FC = GND for all R L = 2k between V+ and VOUT RL = 1kΩ between VOUT and GND IL = 60mA to GND VEFF Voltage Conversion Efficiency 99 99.9 — %R L = Open Note 1: Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no inputs from sources operating from external supplies be applied prior to "power up" of the TC1121.
DS21358B-page 4 2002 Microchip Technology Inc.
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin MSOP, PDIP , SOIC) Symbol Description
1 FC Frequency control for internal oscillator, FC = open, F OSC = 10kHz typ; FC = V+, FOSC = 200kHz
typ; FC has no effect when OSC pin is driven externally. 2C A P + Charge-pump capacitor, positive terminal. 3 GND Power-supply ground input. 4C A P – Charge-pump capacitor, negative terminal. 5 OUT Output, negative voltage. 6 SHDN Shutdown. 7 OSC Oscillator control input. An external capacitor can be added to slow the oscillator. Take care to minimize stray capacitance. An external oscillator also may be connected to overdrive OSC. 8V + Power-supply positive voltage input.
2002 Microchip Technology Inc. DS21358B-page 5 TC1121
3.0 APPLICATIONS
3.1 Negative Voltage Converter
The TC1121 is typically used as a charge-pump voltage inverter. C1 and C2 are the only two external capacitors used in the operating circuit (Figure 3-1). FIGURE 3-1: CHARGE PUMP INVERTER The TC1121 is not sensitive to load current changes, although its output is not actively regulated. A typical output source resistance of 11.8Ω means that an input of +5V results in -5V output voltage under light load, and only decreases to -3.8V typ with a 100mA load. The supplied output current is from capacitor C2 during one-half the charge-pump cycle. This results in a peak-to-peak ripple of: V RIPPLE = IOUT/2(fPUMP) (C2) + IOUT (ESRC2) Where f PUMP is 5kHz (one half the nominal 10kHz oscillator frequency), and C2 = 150 µF with an ESR of 0.2Ω, ripple is about 90mV with a 100mA load current. If C2 is raised to 390µF, the ripple drops to 45mV.
3.2 Changing Oscillator Frequency
The TC1121 ’s clock frequency is controlled by four modes: TABLE 3-1: OSCILLATOR FREQUENCY MODES The oscillator runs at 10kHz (typical) when FC and OSC are not connected. The oscillator frequency is lowered by connecting a capacitor between OSC and GND, but FC can still multiply the frequency by 20 times in this mode. An external clock source that swings within 100mV of V + and GND may overdrive OSC in the inverter mode. OSC can be driven by any CMOS logic output. When OSC is overdriven, FC has no effect. Note that the frequency of the signal appearing at CAP + and CAP– is half that of the oscillator. In addition, by lowering the oscillator frequency, the effective output resistance of the charge-pump increases. To compensate for this, the value of the charge-pump capacitors may be increased. Because the 5kHz output ripple frequency may be low enough to interfere with other circuitry, the oscillator frequency can be increased with the use of the FC pin or an external oscillator. The output ripple frequency is half the selected oscillator frequency. Although the TC1121’s quiescent current will increase if the clock frequency is increased, it allows smaller capacitance values to be used for C1 and C2.
3.3 Capacitor Selection
In addition to load current, the following factors affect the TC1121 output voltage drop from its ideal value 1) output resistance, 2) pump (C1) and reservoir (C2) capacitor ESRs and 3) C1 and C2 capacitance. The voltage drop is the load current times the output resistance. The loss in C2 is the load current times C2’s ESR; C1’s loss is larger because it handles currents greater than the load current during charge-pump operation. Therefore, the voltage drop due to C1 is about four times C1 ’s ESR multiplied by the load current, and a low (or high) ESR capacitor has a greater impact on performance for C1 than for C2. In general, as the TC1121’s pump frequency increases, capacitance values needed to maintain comparable ripple and output resistance diminish proportionately. .4V to 5.5V UT C1121 ND SCAP AP C UT N HDN SHDN should be tied to V N if not used. SHDN* FC OSC Oscillator Frequency Open Open 10kHz FC = V+ Open 200kHz Open or FC = V+ External Capacitor See Typical Operating Characteristics Open External Clock External Clock Frequency
DS21358B-page 6 2002 Microchip Technology Inc.
3.4 Cascading Devices
To produce greater negative magnitudes of the initial supply voltage, the TC1121 may be cascaded (see Figure 3-2). Resulting output resistance is approxi- mately equal to the sum of individual TC1121 R OUT values. The output voltage (where n is an integer representing the number of devices cascaded) is defined by VOUT = -n (VIN).
3.5 Paralleling Devices
To reduce output resistance, multiple TC1121s may be paralleled (see Figure 3-3). Each device needs a pump capacitor C1, but the reservoir capacitor C2 serves all devices. The value of C2 should be increased by a factor of n (the number of devices). FIGURE 3-2: CASCADING TC1121s TO INCREASE OUTPUT VOLTAGE FIGURE 3-3: PARALLELING TC1121s TO REDUCE OUTPUT RESISTANCE 1 1n N C1121 C1121 ND ND SC SCAP AP AP AP C C HDN UT UT N UT VIN HDN HDN*HDN* SHDN should be tied to VIN if ot used. 1" n" N C1121 C1121 ND ND SC SCCAP+ AP AP AP FC C HDN UT UT N HDN HDN*HDN* IN if not used. 1" n" SC UT = R UT of TC1121)/n(number of devices)
2002 Microchip Technology Inc. DS21358B-page 7 TC1121
3.6 Combined Positive Supply
Multiplication and Negative Voltage Conversion Figure 3-4 shows this dual function circuit, in which capacitors C1 and C2 perform pump and reservoir functions to generate negative voltage. Capacitors C3 and C4 are the respective capacitors for multiplied positive voltage. This particular configuration leads to higher source impedances of the generated supplies due to the finite impedance of the common charge-pump driver. FIGURE 3-4: COMBINED POSITIVE MULTIPLER AND NEGATIVE CONVERTER 1, D2 = 1N4148 VIN UT = (2VIN) – V ) – (VFD2) C1121 ND SCAP AP C HDN UT N HDN* UT = VIN SHDN should be tied to VIN if not used.
DS21358B-page 8 2002 Microchip Technology Inc.
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
Package marking data not available at this time.
4.2 Package Dimensions
.122 (3.10) .114 (2.90) .122 (3.10) .114 (2.90) .043 (1.10) MAX. .006 (0.15) .002 (0.05) .016 (0.40) .010 (0.25) .197 (5.00) .189 (4.80) .008 (0.20) .005 (0.13) .028 (0.70) .016 (0.40) 6° MAX. .026 (0.65) TYP. PIN 1 Dimensions: inches (mm) 3° MIN. PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm)
2002 Microchip Technology Inc. DS21358B-page 9 TC1121 Package Dimensions (Continued) .050 (1.27) TYP. 8° MAX. PIN 1 .244 (6.20) .228 (5.79) .157 (3.99) .150 (3.81) .197 (5.00) .189 (4.80) .020 (0.51) .013 (0.33) .010 (0.25) .004 (0.10) .069 (1.75) .007 (0.18) .050 (1.27) .016 (0.40) 8-Pin SOIC Dimensions: inches (mm)
DS21358B-page 10 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21358B-page11 TC1121 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21358B-page12 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21358B-page 13 TC1121 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, K EELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Tech- nology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
DS21358B-page 14 2002 Microchip Technology Inc. M AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com Rocky Mountain 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-7456 Atlanta
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Boston
2 Lan Drive, Suite 120
Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 Detroit Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 New York
150 Motor Parkway, Suite 202
Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 San Jose Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-6766200 Fax: 86-28-6766599 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 Hong Kong Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India Microchip Technology Inc. India Liaison Office Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Microchip Technology Taiwan 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 France Microchip Technology SARL Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
91300 Massy, France
D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Arizona Microchip Technology Ltd.
505 Eskdale Road
Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 03/01/02 /G39/G7/G22/G31/G30/G32/G34/G37/G5/G39 WORLDWIDE SALES AND SERVICE