TC1107 MICROCHIP | Alldatasheet
Document overview
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Technical content
Features
- Extremely Low Supply Current (50 µA, Typ.) Very Low Dropout Voltage 300mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Power Saving Shutdown Mode Bypass Input for Ultra Quiet Operation Over Current and Over Temperature Protection Space-Saving MSOP Package Option
Applications
Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS
- Pagers Device Selection Table NOTE: xx indicates output voltages Other output voltages are available. Please contact Microchip Technology Inc. for details. General Description The TC1107 is a fixed output, high accuracy (typically ±0.5%) CMOS upgrade for older (bipolar) low dropout regulators. T otal supply current is typically 50µAa tf u l l load (20 to 60 times lower than in bipolar regulators). TC1107 key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 240mV at full load), and fast response to step changes in load. Supply current is reduced to 0.05 µA (typical) and V OUT falls to zero when the shutdown input is low. The TC1107 incorporates both over temperature and over current protection. The TC1107 is stable with an output capacitor of only 1 µF and has a maximum output current of 300mA. Typical Application Package Type Part Number Package Junction Temp. Range TC1107-xxVOA 8-Pin SOIC -40°C to +125°C TC1107-xxVUA 8-Pin MSOP -40°C to +125°C TC1107 4 5 8VOUTVOUT CBYPASS 470pF (Optional) Shutdown Control (from Power Control Logic) 1µF GND NC Bypass VIN VIN NC NC SHDN 8-Pin SOIC VIN NC SHDN VOUT GND NC Bypass NC TC1107VOA 8-Pin MSOP VIN NC SHDN VOUT GND NC Bypass NC TC1107VUA 300mA CMOS LDO with Shutdown and VREF Bypass
DS21356B-page 2 2002 Microchip Technology Inc.
1.0 ELECTRICAL
Absolute Maximum Ratings* *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1107 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN =V OUT +1 V ,IL =0 . 1 m A ,CL =3 . 3µF, SHDN >V IH,T A = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions VIN Input Operating Voltage 2.7 — 6.0 V Note 7 IOUTMAX Maximum Output Current 300 —— m A VOUT Output Voltage — VR –2 . 5 % VR ±0.5% VR +2 . 5 % V Note 1 ∆VOUT/∆TV OUT T emperature Coefficient — 40 —p p m / ° C Note 2 ∆VOUT/∆VIN Line Regulation — 0.05 0.35 %( V R +1 V )≤ VIN ≤ 6V ∆VOUT/VOUT Load Regulation — 1.1 2.0 %I L = 0.1mA to IOUTMAX VIN-VOUT Dropout Voltage — 270 160 480 mV I L =0 . 1 m A IL =1 0 0 m A IL =3 0 0 m A(Note 4) ISS1 Supply Current — 50 90 µA SHDN =V IH, ISS2 Shutdown Supply Current — 0.05 0.5 µA SHDN =0 V PSRR Power Supply Rejection Ratio — 60 — dB F RE ≤ 1kHz IOUTSC Output Short Circuit Current — 550 650 mA V OUT =0 V ∆VOUT/∆PD Thermal Regulation — 0.04 — V/W Note 5 eN Output Noise — 260 — nV/ √Hz F=1 k H z ,COUT =1 µF, RLOAD =5 0Ω SHDN Input VIH SHDN Input High Threshold 45 —— % V IN VIL SHDN Input Low Threshold — — 15 %VIN Note 1: VR is the regulator output voltage setting. 3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. 5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA,T J, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. 7: The minimum VIN has to justify the conditions: VIN ≥ VR +V DROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX. TC VOUT =( VOUTMAX –V OUTMIN)x1 0 6 VOUT x ∆T
2002 Microchip Technology Inc. DS21356B-page 3 TC1107
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin SOIC) (8-Pin MSOP) Symbol Description 1V OUT Regulated voltage output. 2 GND Ground terminal. 3 NC No connect. 4 Bypass Reference bypass input. Connecting a 470pF to this input further reduces output noise.
5 SHDN
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.05 µA( t y p i c a l ) . 6 NC No connect. 7 NC No connect. IN Unregulated supply input.
DS21356B-page 4 2002 Microchip Technology Inc.
3.0 DETAILED DESCRIPTION
The TC1107 is a precision regulator available in fixed voltages. Unlike bipolar regulators, the TC1107’s supply current does not increase with load current. In addition, V OUT remains stable and within regulation over the entire 0mA to I OUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN)i sa to ra b o v eV IH, and shutdown (disabled) when SHDN is at or below V IL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 µA (typical), V OUT falls to zero. FIGURE 3-1: TYPICAL APPLICATION CIRCUIT
3.1 Output Capacitor
A1 µF( m i n )c a p a c i t o rf r o mVOUT to ground is required. The output capacitor should have an effective series resistance greater than 0.1Ω and less than 5.0Ω.A1 µF capacitor should be connected from V IN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
3.2 Bypass Input
A 470pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. TC1107 4 5 VOUTVOUT CBYPASS Shutdown Control (from Power Control Logic) 1µF GND NC Bypass VIN NC NC SHDN 1µF Battery 470pF (Optional)
2002 Microchip Technology Inc. DS21356B-page 5 TC1107
4.0 THERMAL CONSIDERATIONS
4.1 Thermal Shutdown
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150°C. The regulator remains off until the die temperature drops to approximately 140°C.
4.2 Power Dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: EQUATION 4-1: The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature AMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (θJA). The 8-Pin SOIC package has a θJA of approximately 160°C/Watt, while the 8-Pin MSOP package has a θJA of approximately 200°C/Watt. EQUATION 4-2: Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.0V + 10% VOUTMIN = 2.7V – 2.5% ILOADMAX = 250mA TJMAX = 125°C TAMAX = 55°C 8-Pin MSOP Package Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD ≈ (VINMAX –V OUTMIN)ILOADMAX =1 6 7 m W Maximum allowable power dissipation: In this example, the TC1107 dissipates a maximum of 167mW; below the allowable limit of 318mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits.
4.3 Layout Considerations
The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θ JA and therefore increase the maximum allowable power dissipation limit. Where: PD ≈ (VINMAX –V OUTMIN)ILOADMAX PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Minimum regulator output voltage = Maximum output (load) current = Maximum voltage on VIN PDMAX =( TJMAX –T AMAX) θJA Where all terms are previously defined. PDMAX =( TJMAX –T AMAX) θJA = (125 – 55) 220 = 318mW
DS21356B-page 6 2002 Microchip Technology Inc.
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Output Noise FREQUENCY (kHz) NOISE (µV/√HZ) 10.0 1.0 0.01 0.01 1 10 100 1000 0.1 0.0 RLOAD = 50Ω COUT = 1µF 0.012 0.010 0.008 0.004 0.002 0.000 -0.002 -0.004 0.006 TEMPERATURE (°C) Line Regulation LINE REGULATION (%) 2.00 1.80 1.60 1.20 1.00 0.80 0.60 0.40 0.20 0.00 1.40 TEMPERATURE ( °C) Load Regulation LOAD REGULATION (%) 1 to 300mA 1 to 50mA 1 to 100mA 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 50 100 150 200 250 300 LOAD CURRENT (mA) Dropout Voltage vs. Load Current DROPOUT VOLTAGE (V) 100.0 90.0 70.0 80.0 50.0 40.0 60.0 TEMPERATURE (°C) Supply Current SUPPLY CURRENT (µA) 3.075 3.025 2.925 2.975 TEMPERATURE (°C) VOUT vs. Temperature VOUT (V) 125°C 885°CC 70°C 25°C 0°CC -40°C VIN = 4V ILOAD = 100µA CLOAD = 3.3µF Power Supply Rejection Ratio FREQUENCY (Hz) -30dB -35dB -40dB -45dB -50dB -55dB -60dB -65dB -70dB -75dB -80dB 100 1K 10K10 1M100K VOUT = 5V RLOAD = 50Ω VINAC = 50mV p-p COUT = 1µF PSRR (dB)
2002 Microchip Technology Inc. DS21356B-page 7 TC1107
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Package marking data not available at this time.
6.2 Taping Form
Component Taping Orientation for 8-Pin MSOP Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin MSOP 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size PIN 1 User Direction of Feed Standard Reel Component Orientation for TR Suffix Device W P Component Taping Orientation for 8-Pin SOIC (Narrow) Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size Standard Reel Component Orientation for TR Suffix Device PIN 1 User Direction of Feed P W
DS21356B-page 8 2002 Microchip Technology Inc.
6.3 Package Dimensions
.122 (3.10) .114 (2.90) .122 (3.10) .114 (2.90) .043 (1.10) MAX. .006 (0.15) .002 (0.05) .016 (0.40) .010 (0.25) .197 (5.00) .189 (4.80) .008 (0.20) .005 (0.13) .028 (0.70) .016 (0.40) 6° MAX. .026 (0.65) TYP. PIN 1 Dimensions: inches (mm) .050 (1.27) TYP. 8° MAX. PIN 1 .244 (6.20) .228 (5.79) .157 (3.99) .150 (3.81) .197 (5.00) .189 (4.80) .020 (0.51) .013 (0.33) .010 (0.25) .004 (0.10) .069 (1.75) .007 (0.18) .050 (1.27) .016 (0.40) 8-Pin SOIC Dimensions: inches (mm)
2002 Microchip Technology Inc. DS21356B-page 9 TC1107 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. T o determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21356B-page 10 2002 Microchip Technology Inc. NOTES:
2002 Microchip Technology Inc. DS21356B-page 11 TC1107 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip T echnology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, K EELOQ,m i c r o I D ,M P L A B ,P I C ,P I C m i c r o ,P I C M A S T E R , PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Tech- nology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and T otal Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
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