TC1014-5.0VCT713

TC1014_07 MICROCHIP | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 22

Technical content

© 2007 Microchip Technology Inc. DS21335E-page 1 TC1014/TC1015/TC1185 Features:

• Low Supply Current (50 µA, typical)
• Low Dropout Voltage
• Choice of 50 mA (TC1014), 100 mA (TC1015) and 150 mA (TC1185) Output
• High Output Voltage Accuracy
• Standard or Custom Output Voltages
• Power-Saving Shutdown Mode
• Reference Bypass Input for Ultra Low-Noise Operation
• Overcurrent and Overtemperature Protection
• Space-Saving 5-Pin SOT-23 Package
• Pin-Compatible Upgrades for Bipolar Regulators
• Standard Output Voltage Options: Applications:
• Battery-Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
• Cellular/GSM/PHS Phones
• Linear Post-Regulator for SMPS
• Pagers Typical Application General Description The TC1014/TC1015/TC1185 are high accuracy (typically ±0.5%) CMOS upgrades for older (bipolar) Low Dropout Regulators (LDOs) such as the LP2980. Designed specifically for battery-operated systems, the devices’ CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 50 µA at full load (20 to 60 times lower than in bipolar regulators). The devices’ key features include ultra low-noise operation (plus optional Bypass input), fast response to step changes in load, and very low dropout voltage, typically 85 mV (TC1014), 180 mV (TC1015), and 270 mV (TC1185) at full-load. Supply current is reduced to 0.5 µA (max) and VOUT falls to zero when the shutdown input is low. The devices incorporate both overtemperature and overcurrent protection. The TC1014/TC1015/TC1185 are stable with an output capacitor of only 1 µF and have a maximum output current of 50 mA, 100 mA and 150 mA, respectively. For higher output current regulators, please see the TC1107 (DS21356), TC1108 (DS21357), TC1173 (DS21362) (IOUT = 300 mA) data sheets. Package Type TC1014 TC1015 TC1185 VOUT SHDN GND Bypass 470 pF Reference Bypass Cap (Optional) 1 µF VIN VIN VOUT Shutdown Control (from Power Control Logic) Bypass SHDN 5-Pin SOT-23 TC1014 TC1015 TC1185 VIN VOUT GND 50 mA, 100 mA and 150 mA CMOS LDOs with Shutdown and Reference Bypass

© 2007 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† † Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1014/TC1015/TC1185 ELECTRICAL SPECIFICATIONS Electrical Specifications: VIN = VR + 1V, IL = 100 µA, CL = 1.0 µF, SHDN > VIH, TA = +25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameter Symbol Min Typ Max Units Device Test Conditions Input Operating Voltage VIN 2.7 6.0 V Note 1 Maximum Output Current IOUTMAX 100 150 mA TC1014 TC1015 TC1185 Output Voltage VOUT VR – 2.5% VR ±0.5% VR + 2.5% V Note 2 VOUT Temperature Coefficient TCVOUT ppm/°C Note 3 Line Regulation ΔVOUT/ ΔVIN 0.05 0c.35 (VR + 1V) ≤ VIN ≤ 6V Load Regulation ΔVOUT/ VOUT 0.5 0.5 TC1014; TC1015 TC1185 IL = 0.1 mA to IOUTMAX IL = 0.1 mA to IOUTMAX (Note 4) Dropout Voltage VIN-VOUT 180 270 120 250 400 mV TC1015; TC1185 TC1185 IL = 100 µA IL = 20 mA IL = 50 mA IL = 100 mA IL = 150 mA (Note 5) Supply Current (Note 8) IIN µA SHDN = VIH, IL = 0 Shutdown Supply Current IINSD 0.05 0.5 µA SHDN = 0V Power Supply Rejection Ratio PSRR dB FRE ≤ 1 kHz Output Short Circuit Current IOUTSC 300 450 mA VOUT = 0V Thermal Regulation ΔVOUT/ ΔPD 0.04 V/W Notes 6, 7 Thermal Shutdown Die Temperature TSD 160 Thermal Shutdown Hysteresis ΔTSD Note The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VR + VDROPOUT. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details. Apply for Junction Temperatures of -40°C to +85°C. TC VOUT = (VOUTMAX – VOUTMIN)x 106 VOUT x ΔT

© 2007 Microchip Technology Inc. DS21335E-page 3 TC1014/TC1015/TC1185 TEMPERATURE CHARACTERISTICS Output Noise eN 600 nV/√Hz IL = IOUTMAX, F = 10 kHz 470 pF from Bypass to GND SHDN Input High Threshold VIH %VIN VIN = 2.5V to 6.5V SHDN Input Low Threshold VIL %VIN VIN = 2.5V to 6.5V TC1014/TC1015/TC1185 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Specifications: VIN = VR + 1V, IL = 100 µA, CL = 1.0 µF, SHDN > VIH, TA = +25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameter Symbol Min Typ Max Units Device Test Conditions Note The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VR + VDROPOUT. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details. Apply for Junction Temperatures of -40°C to +85°C. TC VOUT = (VOUTMAX – VOUTMIN)x 106 VOUT x ΔT Electrical Specifications: VIN = VR + 1V, IL = 100 µA, CL = 1.0 µF, SHDN > VIH, TA = +25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Temperature Ranges: Extended Temperature Range TA -40 +125 Operating Temperature Range TA -40 +125 Storage Temperature Range TA -65 +150 Thermal Package Resistances: Thermal Resistance, 5L-SOT-23 θJA 256 °C/W

© 2007 Microchip Technology Inc. DS21335E-page 11 TC1014/TC1015/TC1185 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 3.1 Input Voltage (VIN) Connect the VIN pin to the unregulated source voltage. Like all low dropout linear regulators, low source impedance is necessary for the stable operation of the LDO. The amount of capacitance required to ensure low source impedance will depend on the proximity of the input source capacitors or battery type. For most applications, 1.0 µF of capacitance will ensure stable operation of the LDO circuit. The type of capacitor used can be ceramic, tantalum or aluminum electrolytic. The low Effective Series Resistance (ESR) char- acteristics of the ceramic will yield better noise and Power Supply Ripple Rejection (PSRR) performance at high frequency. 3.2 Ground Terminal (GND) Connect the ground pin to the input voltage return. For the optimal noise and PSRR performance, the GND pin of the LDO should be tied to a quiet circuit ground. For applications have switching or noisy inputs tie the GND pin to the return of the output capacitor. Ground planes help lower inductance and voltage spikes caused by fast transient load currents and are recommended for applications that are subjected to fast load transients. 3.3 Shutdown (SHDN) The Shutdown input is used to turn the LDO on and off. When the SHDN pin is at a logic high level, the LDO output is enabled. When the SHDN pin is pulled to a logic low, the LDO output is disabled. When disabled, the quiescent current used by the LDO is less than 0.5 µA max. 3.4 Bypass Connecting a low-value ceramic capacitor to the Bypass pin will further reduce output voltage noise and improve the PSRR performance of the LDO. While smaller and larger values can be used, these affect the speed at which the LDO output voltage rises when the input power is applied. The larger the bypass capacitor, the slower the output voltage will rise. 3.5 Output Voltage (VOUT) Connect the output load to VOUT of the LDO. Also connect one side of the LDO output capacitor as close as possible to the VOUT pin. Pin No. (5-Pin SOT-23) Symbol

Description

Unregulated supply input. GND Ground terminal. SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.5 µA (maximum). Bypass Reference bypass input. Connecting a 470 pF to this input further reduces output noise. VOUT Regulated voltage output.

© 2007 Microchip Technology Inc. DS21335E-page 13 TC1014/TC1015/TC1185 5.0 THERMAL CONSIDERATIONS 5.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. The regulator remains off until the die temperature drops to approximately 150°C. 5.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst-case actual power dissipation: EQUATION 5-1: The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (θJA). The 5-pin SOT-23 package has a θJA of approximately 220°C/Watt. EQUATION 5-2: Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: Find: Actual power dissipation Maximum allowable dissipation Actual power dissipation: PD ≈ (VINMAX – VOUTMIN)ILOADMAX = 26.7 mW Maximum allowable power dissipation: In this example, the TC1014 dissipates a maximum of 26.7 mW below the allowable limit of 318 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. 5.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and therefore increase the maximum allowable power dissipation limit. PD VINMAX VOUTMIN )ILOADMAX Where: PD = Worst-case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current Where all terms are previously defined. PDMAX TJMAX TAMAX θJA VINMAX 3.0V +10% VOUTMIN 2.7V – 2.5% ILOADMAX 40 mA TJMAX 125°C TAMAX 55°C PDMAX TJMAX TAMAX θJA 125 220 318 mW

© 2007 Microchip Technology Inc. 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 6.2 Taping Form c&d represents part number code + temperature range and voltage e represents year and 2-month period code f represents lot ID number 2 3 TABLE 6-1: PART NUMBER CODE AND TEMPERATURE RANGE (V) TC1014 Code TC1015 Code TC1185 Code 1.8 AY BY NY 2.5 2.6 NB BT NT 2.7 2.8 AZ BZ NZ 2.85 3.0 3.3 3.6 4.0 5.0 W, Width of Carrier Tape User Direction of Feed P,Pitch Standard Reel Component Orientation Reverse Reel Component Orientation PIN 1 Device Marking PIN 1 Carrier Tape, Number of Components per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 5-Pin SOT-23 8 mm 4 mm 3000 7 in

© 2007 Microchip Technology Inc. DS21335E-page 15 TC1014/TC1015/TC1185 5-Lead Plastic Small Outline Transistor (OT) [SOT-23] Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Lead Pitch e

0.95 BSC

1.90 BSC

A 0.90 1.45 Molded Package Thickness 0.89 1.30 Standoff 0.00 0.15 Overall Width E 2.20 3.20 Molded Package Width 1.30 1.80 Overall Length D 2.70 3.10 Foot Length L 0.10 0.60 Footprint 0.35 0.80 Foot Angle φ 30° Lead Thickness c 0.08 0.26 Lead Width b 0.20 0.51 φ N b E D e A c L Microchip Technology Drawing C04-091B

© 2007 Microchip Technology Inc. NOTES:

© 2007 Microchip Technology Inc. DS21335E-page 17 TC1014/TC1015/TC1185 APPENDIX A:

REVISION HISTORY

Revision E (February 2007)

• Section 1.0 “Electrical characteristics”: Changed Dropout Voltage from mA to µA.
• Updated “Product Identification System”, page 19.
• Updated Section 6.0 “Packaging Information”. Revision D (April 2006)
• Removed “ERROR is open circuited” from SHDN pin description in Pin Function Table.
• Added verbiage for pinout descriptions in Pin Function Table.
• Replaced verbiage in first paragraph of Section 4.0 Detailed Description.
• Added Section 4.3 Input Capacitor Revision C (January 2006)
• Changed TR suffix to 713 suffix in Taping Form in Package Marking Section Revision B (May 2002)
• Converted Telcom data sheet to Microchip standard for Analog Handbook Revision A (February 2001)
• Original Release of this Document under Telcom.

© 2007 Microchip Technology Inc. NOTES:

© 2007 Microchip Technology Inc. DS21335E-page 19 TC1014/TC1015/TC1185 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: TC1014: 50 mA LDO with Shutdown and VREF Bypass TC1015: 100 mA LDO with Shutdown and VREF Bypass TC1185: 150 mA LDO with Shutdown and VREF Bypass Output Voltage: 1.8 = 1.8V 2.5 = 2.5V 2.6 = 2.6V 2.7 = 2.7V 2.8 = 2.8V 2.85 = 2.85V 3.0 = 3.0V 3.3 = 3.3V 3.6 = 3.6V 4.0 = 4.0V 5.0 = 5.0V Temperature Range: V Package: CT713 = Plastic Small Outline Transistor (SOT-23), 5-lead, Tape and Reel PART NO. -X.X X Temperature Output Voltage Device Examples: a) TC1014-1.8VCT713: 1.8V, 5LD SOT-23, Tape and Reel. b) TC1014-2.85VCT713: 2.85V, 5LD SOT-23, Tape and Reel. TC1014-3.3VCT713: 3.3V, 5LD SOT-23, Tape and Reel. a) TC1015-1.8VCT713: 1.8V, 5LD SOT-23, Tape and Reel. b) TC1015-2.85VCT713: 2.85V, 5LD SOT-23, Tape and Reel. TC1015-3.0VCT713: 3.0V, 5LD SOT-23, Tape and Reel. a) TC1185-1.8VCT713: 1.8V, 5LD SOT-23, Tape and Reel. b) TC1185-2.8VCT713: 2.8V, 5LD SOT-23, Tape and Reel. Range XXXXX Package

© 2007 Microchip Technology Inc. NOTES:

© 2007 Microchip Technology Inc. DS21335E-page 21 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

© 2007 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256 ASIA/PACIFIC India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 WORLDWIDE SALES AND SERVICE 12/08/06