TBD62503AFNG

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Document overview

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Technical content

Features

• 7 circuits built-in
• High voltage : VOUT = 50 V (MAX)
• High current : IOUT = 300 mA/ch (MAX)
• Input voltage(output on) : TBD62502A series 14 V (MIN) TBD62503A series 2.5 V (MIN)
• Input voltage(output off) : TBD62502A series 7.0 V (MAX) TBD62503A series 0.6 V (MAX)
• Package : PG type DIP16-P-300-2.54A FG type SOP16-P-225-1.27 FNG type SSOP16-P-225-0.65B FWG type P-SOP16-0410-1.27-002 Pin connection (top view) Pin connection may be simplified for explanatory purpose. TBD62502APG,TBD62503APG DIP16-P-300-2.54A TBD62502AFG,TBD62503AFG SOP16-P-225-1.27 TBD62502AFNG,TBD62503AFNG SSOP16-P-225-0.65B TBD62502AFWG,TBD62503AFWG P-SOP16-0410-1.27-002 Weight DIP16-P-300-2.54A : 1.11g (Typ.) SOP16-P-225-1.27 : 0.16g (Typ.) SSOP16-P-225-0.65B : 0.07g (Typ.) 1 2 3 4 5 6 7 8 16 15 14 13 12 11 O1 O2 O3 O4 O5 O6 O7 NC I1 I2 I3 I4 I5 I6 I7 GND 10 9

TBD62502A series, TBD62503A series 2015-07-24 2 ©2015 Toshiba Corporation Pin explanations Pin No. Pin name Function

1 I1 Input pin

2 I2 Input pin

3 I3 Input pin

4 I4 Input pin

5 I5 Input pin

6 I6 Input pin

7 I7 Input pin

8 GND GND pin

9 NC Non-connection pin

10 O7 Output pin

11 O6 Output pin

12 O5 Output pin

13 O4 Output pin

14 O3 Output pin

15 O2 Output pin

16 O1 Output pin

Equivalent circuit (each driver) Equivalent circuit may be simplified for explanatory purpose. Clamp INPUT OUTPUT

TBD62502A series, TBD62503A series 2015-07-24 3 ©2015 Toshiba Corporation Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Output voltage VOUT 50 V Output current IOUT 300 mA/ch Input voltage VIN −0.5 to 30 V Power dissipation PG (Note 1) PD 1.47 W FG (Note 2) 0.625 FNG (Note 3) 0.78 FWG (Note 4) 1.25 Operating temperature Topr −40 to 85 °C Storage temperature Tstg −55 to 150 °C Note 1: Device alone. When Ta exceeds 25°C, it is necessary to do the derating with 11.8 mW/°C. Note 2: On PCB (Size: 30 mm × 30 mm × 1.6 mm, Cu area: 50%, single-side glass epoxy). When Ta exceeds 25°C, it is necessary to do the derating with 5 mW/°C. Note 3: On PCB (Size: 50 mm × 50 mm × 1.6 mm, Cu area: 40%, single-side glass epoxy). When Ta exceeds 25°C, it is necessary to do the derating with 6.24 mW/°C. Note 4: On PCB (JEDEC 2s2p). When Ta exceeds 25°C, it is necessary to do the derating with 10 mW/°C.

TBD62502A series, TBD62503A series 2015-07-24 4 ©2015 Toshiba Corporation Operating Ranges (Ta = −40 to 85 °C) Characteristics Symbol Condition Min Typ. Max Unit Output voltage VOUT ― ― ― 50 V Output current PG(Note 1) IOUT 1 circuits ON, Ta = 25 °C 0 ― 250 mA/ch tpw = 25 ms 7 circuits ON Ta = 85 °C Tj = 120 °C Duty = 10 % 0 ― 250 Duty = 50 % 0 ― 190 FG(Note 2) 1 circuits ON, Ta = 25 °C 0 ― 250 tpw = 25 ms 7 circuits ON Ta = 85 °C Tj = 120 °C Duty = 10 % 0 ― 250 Duty = 50 % 0 ― 120 FNG(Note 3) 1 circuits ON, Ta = 25 °C 0 ― 250 tpw = 25 ms 7 circuits ON Ta = 85 °C Tj = 120 °C Duty = 10 % 0 ― 250 Duty = 50 % 0 ― 130 FWG(Note 4) 1 circuits ON, Ta = 25 °C 0 ― 250 tpw = 25 ms 7 circuits ON Ta = 85 °C Tj = 120 °C Duty = 10 % 0 ― 250 Duty = 50 % 0 ― 170 Input voltage (Output on) TBD62502A series VIN (ON) IOUT = 100 mA or upper, VOUT = 2 V 14 ― 25 V TBD62503A series IOUT = 100 mA or upper, VOUT = 2 V 2.5 ― 25 Input voltage (Output off) TBD62502A series VIN (OFF) IOUT = 100 μA or less, VOUT = 2 V 0 ― 7.0 V TBD62503A series IOUT = 100 μA or less, VOUT = 2 V 0 ― 0.6 Note 1: Device alone. Note 2: On PCB (Size: 30 mm × 30 mm × 1.6 mm, Cu area: 50%, single-side glass epoxy). Note 3: On PCB (Size: 50 mm × 50 mm × 1.6 mm, Cu area: 40%, single-side glass epoxy). Note 4: On PCB (JEDEC 2s2p).

TBD62502A series, TBD62503A series 2015-07-24 5 ©2015 Toshiba Corporation Electrical Characteristics (Ta = 25 °C unless otherwise noted) Characteristics Symbol Test Circuit Condition Min Typ. Max Unit Output leakage current Ileak 1 VOUT = 50V, Ta = 85 °C VIN = 0 V ― ― 1.0 μA Output voltage (Output ON-resistance) TBD62502A series VDS (RON) 2 IOUT = 200 mA, VIN =14 V ― 0.4 (2.0) 0.65 (3.25) V (Ω) IOUT = 100 mA, VIN =14 V ― 0.2 (2.0) 0.325 (3.25) TBD62503A series IOUT = 200 mA, VIN =5.0 V ― 0.4 (2.0) 0.65 (3.25) IOUT = 100 mA, VIN =5.0 V ― 0.2 (2.0) 0.325 (3.25) Input current (Output on) TBD62502A series IIN (ON) 3 VIN = 14 V ― ― 1.0 mA TBD62503A series VIN = 2.5 V ― ― 0.1 Input current(Output off) IIN (OFF) 4 VIN = 0 V, Ta = 85°C ― ― 1.0 μA Input voltage (Output on) TBD62502A series VIN (ON) 5 IOUT = 100 mA, VOUT = 2 V ― ― 14 V TBD62503A series ― ― 2.5 Turn−on delay tON VOUT = 50 V RL = 200 Ω CL = 15 pF ― 0.4 ― μs Turn−off delay tOFF ― 0.8 ―

TBD62502A series, TBD62503A series 2015-07-24 6 ©2015 Toshiba Corporation Test circuit 1. Ileak 2. VDS (RON) 3. IIN (ON) 4. IIN (OFF) 5. VIN (ON) Test circuit may be simplified for explanatory purpose. OUTPUT INPUT GND VOUT OUTPUT INPUT GND IOUT VIN VDS RON = VDS / IOUT Ileak INPUT GND VIN IIN(ON) INPUT GND IIN(OFF) OUTPUT INPUT GND IOUT VIN(ON) VOUT OUTPUT OUTPUT

TBD62502A series, TBD62503A series 2015-07-24 7 ©2015 Toshiba Corporation 6. tON, tOFF Note 1: Pulse width 50 μs, Duty cycle 10% Output impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns Please refer to the following table for the VIH condition. Product VIH TBD62502A series 14.0 V TBD62503A series 5.0 V Note 2: CL includes the probe and the test board capacitance. Test circuit and timing chart may be simplified for explanatory purpose. Precautions for Using This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. (注 2) (注 1) (Note 2) (Note 1)

TBD62502A series, TBD62503A series 2015-07-24 8 ©2015 Toshiba Corporation Package Dimensions DIP16-P-300-2.54A Unit: mm Weight: 1.11 g (Typ.) SOP16-P-225-1.27 Unit: mm Weight: 0.16 g (Typ.)

TBD62502A series, TBD62503A series 2015-07-24 9 ©2015 Toshiba Corporation SSOP16-P-225-0.65B Unit: mm Weight: 0.07 g (Typ.) P-SOP16-0410-1.27-002 Unit: mm Weight: 0.15 g (Typ.)

TBD62502A series, TBD62503A series 2015-07-24 10 ©2015 Toshiba Corporation Notes on Contents 1. Pin connection Pin connection may be simplified for explanatory purpose. 2. Equivalent Circuits Equivalent circuit may be simplified for explanatory purpose. 3. Test circuit Test circuit may be simplified for explanatory purpose. 4. Timing chart Timing charts may be simplified for explanatory purposes. IC Usage Considerations Notes on handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. (2) Do not insert devices in the wrong orientation or incorrectly.Make sure that the positive and negative terminals of power supplies are connected properly.Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion.In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is applied even just once. (3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (4) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition.Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator.If there is a large amount of leakage current such as from input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly. Points to remember on handling of ICs Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.

TBD62502A series, TBD62503A series 2015-07-24 11 ©2015 Toshiba Corporation RESTRICTIONS ON PRODUCT USE

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