TBD

CEM710 AXIOMTEK | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 3

Technical content

Features

CPU Intel® Xeon® D-1712TR (4 x 2.0 GHz, 10MB cache, 50G Eth, 40W) Intel® Xeon® D-1715TER (4 x 2.4 GHz, 10MB cache, 50G Eth, 50W) Intel® Xeon® D-1732TE (8 x 1.9 GHz, 15MB cache, 50G Eth, 52W) Intel® Xeon® D-1735TR (8 x 2.2 GHz, 15MB cache, 50G Eth, 59W) Intel® Xeon® D-1746TER (10 x 2.0 GHz, 15MB cache, 100G Eth, 67W) System Memory 2 x 260-pin DDR4-2400 SO-DIMM, up to 64GB with ECC support Chipset SoC integrated BIOS AMI uEFI (Legacy free) Storage N/A Watchdog Timer 65536 levels, 0 to 65535 sec. Expansion Interface 1 x PCIe x16 Gen3 (PEG) 1 x PCIe x8 Gen3 6 x PCIe x1 Gen3 Battery Lithium N/A Power Input ATX: +12V, +5VSB AT: +12V Front view Rear view Intel® Xeon® D-1700 series COM Express connector 2 x DDR4 SO-DIMM

• Intel® Xeon® D-1700 series processor (Ice Lake D)
• 2 DDR4-2400 SO-DIMM for up to 64 GB memory
• 1 PCIe x16 Gen3 (PEG), 1 PCIe x8 Gen3, and 6 PCIe x1 Gen3
• 2 SATA Gen3
• 4 USB 3.0 and 4 USB 2.0
• 4 10GBase-KR
• Supports TPM 2.0 USB 3.0PCIe PCIe AiRDWide Temp. Updated Sep. 10, 2024.

• All specifications and photos are subject to change without notice. System on Modules 1

Ordering Information

(P/N: TBD) COM Express Type 7 basic module with Intel® Xeon® D-1712TR, 10GBASE-KR, USB 3.0, and TPM CEM710-D1715TER (P/N: TBD) COM Express Type 7 basic module with Intel® Xeon® D-1715TER, 10GBASE-KR, USB 3.0, and TPM CEM710-D1732TE (P/N: TBD) COM Express Type 7 basic module with Intel® Xeon® D-1732TE, 10GBASE-KR, USB 3.0, and TPM CEM710-D1735TR (P/N: TBD) COM Express Type 7 basic module with Intel® Xeon® D-1735TR, 10GBASE-KR, USB 3.0, and TPM CEM710-D1746TER (P/N: TBD) COM Express Type 7 basic module with Intel® Xeon® D-1746TER, 10GBASE-KR, USB 3.0, and TPM Optional CEB94701 (P/N: E394701100) COM Express Type 7 development board TBD CEM710 heat pipe cooler TBD CEM710 heat spreader Packing List Quick installation guide I/O SATA 2 x SATA Gen3 Hardware Monitoring Yes Ethernet 1 x 10/100/1000/2500 Mbps with Intel® I226, configured through COMe PCIe port 7 4 x 10GBASE-KR with Intel® 10G external PHY Audio N/A USB 4 x USB 3.0 4 x USB 2.0 Serial 2 x TX/RX TPM TPM 2.0 SMBus Yes Others 1 x I C 1 x LPC 1 x SPI GPIO 4-CH in & 4-CH out Smart Battery N/A Mechanical and Environmental Dimensions 125 x 95 mm Board Thickness 2.0 mm Operating Temperature Standard: 0°C to 60°C (32°F to 140°F) Extended: -40°C to 85°C (-40°F to 185°F) with system thermal solution Humidity 10% to 95% relative humidity, non-condensing Vibration Endurance 3.5 Grms

ver. 3.0 ROW C-D PCIe 3.0 [ x16 / 2x8 / 4x4 ] PCIe 3.0 x 5 COM Express Connector Type 7 PCIe 3.0 x 1 [ #6 ] PCIe 3.0 x 1 [ #7 Opt. w/o GbE ] LAN MDI x 4 I226 PCIE3.0 x 1 PCIe 3.0 x 8 ( x8 / 2x4 ) [ #8:15 ] [ #7 ] USB2.0 x 4 [ #0:3 ] LPC IT8528 GPIOEC UART(TX/RX) x 2 SATA3 x 2 [ #0:1 ] SPI ROM TPM 10GBase-KR x 4 [ #0:3 ] 10G Sideband Signals 10G_INT 10G_PHY_MDIO/MDC & SDA/SCL 10G_PHY_CAP 10G_PHY_RST 10G_LED_I2C 10G_SFP_I2C 10G_SDP DDR4 / CHB_0 ROW A-B USB3.0 x 4 [ #0:3 ] NCSI D-1715TER (4 x 2.4 GHz, 10 MB cache, 50G Eth, 50W) D-1712TR (4 x 2.0 GHz, 10 MB cache, 50G Eth, 40W) D-1732TE (8 x 1.9 GHz, 15 MB cache, 50G Eth, 52W) D-1735TR (8 x 2.2 GHz, 15 MB cache, 50G Eth, 59W) D-1746TER (10 x 2.0 GHz, 15 MB cache, 100G Eth, 67W) Intel Xeon ICE LAKE-D LCC FCBGA2227 DDR4 / CHA_1 DDR4 / CHB_1

260 PIN DDR4 SODIMM

[ Option ] [ Option ] BOT SIDE DDR4 / CHA_0 TOP SIDE SPI Block Digram Updated Sep. 10, 2024.