TBA800 FAIRCHILD | Alldatasheet
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TBA800- TBA800A” FAIRCHILD LINEAR INTEGRATED CIRCUIT GENERAL DESCRIPTION ~ The TBA80O is a monolithic Audio Power Amplifier con- CONNECTION DIAGRAM structed using the Fairchild Planar* Epitaxial process. The external cooling tabs enable 12 PIN POWER PACKAGE
2.5 W output power to be achieved without external heat sink and 5 W output power trop Views
using a small area of the pc board copper as a heat sink PACKAGE OUTLINE 9W It is ideally suited as an audio amplifier in solid state television receivers and other Class PACKAGE CODE P3, P4 8 audio amplifier applications over a wide range of supply voltage (5-30 V) ; ‘ eur © OUTPUT POWER 5 W (24 V - 16.0) ne Fine @ LOW DISTORTION BIAS AOU. ]GROUND (POWER) @ WIDE SUPPLY VOLTAGE RANGE (5-30 Vv) @ HIGH PEAK OUTPUT CURRENT (1.5 A) GNO| GND © HIGH EFFICIENCY . sooveraae ee ABSOLUTE MAXIMUM RATINGS courencanionl nrur Supply Voltage 30V reeoack Fymirete aveass, Output Peak Current (Non-Repetitive) 2A Output Current (Repetitive) 115A ORDER INFORMATION = BO" 1 Power Dissipation: 4 = 80°C), iw Tyee PART NO tab o 800(P3) TBAB0O Storage and Junction Temperature “40°C to +150°C Sook (ea) TBASOGA Pin Temperature (Soldering 10 s) 230°C “Planar i a patented Fairchild process EQUIVALENT CIRCUIT to oe a ee oe eer i reneavon Toe ao Ete O18 ss tne 7 Bh $ Noa Me ov moe *0 ey sussteare 1 ones J 4-206
FAIRCHILD © TBA800 © TBA800A ELECTRICAL CHARACTERISTICS: Ta ~ 25°C (see Test Circuit) CHARACTERISTICS TEST CONDITIONS [ww | typ [ max | unms Supp Voltage a 0) tt Powe THO 10% A, TeA Ve=aaw Tate | ee] ea |W iat Sonate er our Sw vio evn, arsiKe | | ee oa Frequency Response -3.0 d8 V+ = 24V, RL = 16 2, C3 = 330 pF | 20800 || He Vote Gam Open Loon) Wen 2ew R= 16 = Tene eit oa Voltage Gain (Closed Loop) V+=24V, Ry = 162.1=1 kee [3s 42 | 45 | oe Input Noise Voltage V+ = 24 V, Rg = 0, BS (-3.0 dB) = 40-20,000 Hz [so[ | w Input Noise Current V+ = 24 V. BW (-3.0 dB) = 40-20,000 Hz A eticioey Pour” SW.ve=2ev.R, =tent=ime [f= [fs PACKAGE THERMAL RESISTANCE TBAB00 TBABOOA @Jjap Thermal resistance junction-tab max 12 °C/W 10 °C/W. Jq__ Thermal resistance junction-ambient max 70* °C/W 80 °C/W “Obtained with tabs soldered 19 printed cuit with minimum copper ares TEST CIRCUIT venaey oe ote TT ey q - s E ce west 0 2 So ur Tass Siz ey ne 2 obo . s ce e es Sor < sor sev ‘our Pa av tare he m ed mt €3, C7 see Performance Curves 4-207
FAIRCHILD © TBA800 ¢ TBA800A. TYPICAL PERFORMANCE CURVES: MAXIMUM POWER DISSIPATION TOTAL HARMONIC DISTORTION OUTPUT POWER AS A FUNCTION AS A FUNCTION OF ‘AS A FUNCTION OF (OF SUPPLY VOLTAGE ‘SUPPLY VOLTAGE OUTPUT POWER Setar esegseess! TOT) Se "SESS nits Fee =; GEESE . : gn aaeseauer JESS, | ES | Fees ete ie DEH POUCA SRE : Plo EE (EAS ERAT | ee Le Bar RszncsnccesssesGecsis| Fig. 1 Fig. 2 Fig. 3 VALUE OF C3 AS A FUNCTION VOLTAGE GAIN (CLOSED LOOP) TOTAL HARMONIC DISTORTION Reg FOR VARIOUS VALUES AND INPUT VOLTAGE AS A AS A FUNCTION OF FREQUENCY OF BW FUNCTION OF Rep 5 =>] essa 10 ea » Ae ba eet cee atte: ae et Fs | a $ vo|—| pater Lt ? St 3 iar eiliiacorttcs ME oe cea AT i KS ay Em ee oH Etcetera § i ay i eran } Ess soecensseadeeaesy Peer Reece Coe a : ; Fig. 4 Fig. 5 Fig. 6 POWER DISSIPATION AND QUIESCENT OUTPUT VOLTAGE EFFICIENCY AS A FUNCTION OF (PIN 12) AS A FUNCTION OF QUIESCENT CURRENT AS A OUTPUT POWER ‘SUPPLY VOLTAGE FUNCTION OF SUPPLY VOLTAGE Fe “CTT TT ip] DEBERR DERE EED?eEaEe| +t oH rooted ont mat Zo pase Bssatisiteeesetsceeettiea Oy beuepeeceaeecae estaacdfsseeeal UM Stas cceessssee>se0ceeses My > Z 4 smoseneaes| eas dusstape- cceueessass: Se Sseeeeeeeecaueel hall Exessoy-cteccsusaers ieee) | RY PASS
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FAIRCHILD e TBA800 ¢ TBA800A TYPICAL PERFORMANCE CURVES (cont'd) TOTAL HARMONIC DISTORTION POWER THAT CAN BE DISSIPATED AS A FUNCTION OF OUTPUT OUTPUT POWER VERSUS SUPPLY AS A FUNCTION OF POWER (FIG. 15 CIRCUIT) VOLTAGE (FIG, 15 CIRCUIT) 1 COPPER LENGTH 100 .” ar TooToo Ao eA fee RESBISeseeceC-CocceE| i a CoC] bE § Fs va : EERE] 3 Nguessessesszaresass| * . d a SHS lo 3 i Ml ceeeecsoyae7 PGS EH ef i i Se sceanee er 2 pi sssesseetesa atteeee if | f i‘ ESS" | Bp He /eonetaeea i eee I =< EAP EERE SS Fig. 10 Fig. 11 Fig. 12 POWER RATING |_SHARACTERISTICS SSceesreestereerssts i rSee¥ i Coie : NEC IES] +3 FSS Ha aa Fig. 13
APPLICATION INFORMATION
TM I ay cet —_ . A ‘ 5 soot o a NOTE: Compared withthe other circuits, this configura- ta i an be used at low supply voltages C3, C7 see Performance Curves Fig. 14. Circuit with the Load Connected to the Supply Voltage 4-209
FAIRCHILD * TBA800 * TBA800A APPLICATION INFORMATION (Cont'd) we av our 100 op pa - 8 NOTE: This circuit is only for use at high voltages. If impute pin 31s left open circuit, this automatically inserts diodes rans. a 2 ~ 03 (see schematic diagram) and enables a sym- ne ‘mettical sigal to be obtained at the output. Refer (0 100 40 3 5 s 500 uF Figs. 10 and 11 for distortion and output power. oi sev < © aia 1 ' JF teow tes der C{]n ve ' Ri fee { th C3, C7 see Performance Curves Fig. 15. Circuit with Load Connected to Ground without Bootstrap veeney 100 $ — axe 5 oe Tay I meer 0 S|, a NOTE: The bootuvep capacitor CA enable the sare ‘ neu electncal characteristics as thote ofthe test eicuit 1 be ass 2 achieved. For tow supply voltage operation (eg. 9 to Re qd 14 V) RX (150 0) is connected between pin 1 and pin 4. took 2] 1 7 2 500. uF ai os tee ' lo. ee a a 1 a re \\ fo Fig. 16. Circuit with Load Connected to Ground with Bootstrap NOTE: For the circuits of Fig. 18 and 16 an exceliont supply voltage ripple rejection is obtained by connecting the capacitor C5 (10 to 100 uF ~ 25 V1 between pin 7 and ground. PC Board and Component Layout of the Test Circuit PC Board Layout (Fig. 14 Circuit) mo180 SIRES SRSES ES c) 3 i) oo i) to 09 — on | fn rc —_ ap f= rus ” aa v” a =" so = SES SES aris — uw vi 4-210
FAIRCHILD © TBA800 © TBA800A MOUNTING INSTRUCTIONS - The tabs on the TBA8O0 can be used to conduct away the heat generated in the integrat- ed circuit so that the junction temperature does not exceed the permissible maximum (150°C). This may be done by con- necting tabs to an external heat sink, or by soldering it to a suitable copper area of the printed circuit board (Fig. 17a). Fig. 17b shows a simple type of heat sink, Assuming an area of copper on the printed circuit board of only 2 cm?, the total @ between junction to ambient is approximately 30°C/W. For TBA8OOA, the desired thermal resistance is obtained attaching the hardware shown in Fig. .17c, to a bracket with prop- er dimensions. This bracket can also act as a support for the whole printed circuit board. External heat sink or printed circuit copper area must be connected to electrical ground. In the latter case, Fig. 12 shows the maximum dissipated power (for Ta = 55°C) as a function of the side of two equal ‘square copper areas having a thickness of 35 u (1.4 mils). Fig. 17a. Example of an area of PC board copper soldered to the tabs of the TBA800, which is used as a heat dissipeter. | of bo Z q H ge ne WY, a Eo A 1 A iz Eek ZZ Z Z | cq p Z Lia Ho | ZZ N d Bo el Fig. 176, Example of TBABOO with external heatsink Fig, 17c. Example of TBABOOA with external heat sink. Rn aoe Ww a mute f XK an ir ae oo — xt < go: 421
FAIRCHILD ¢ TBA800 * TBA800A PROCEDURE TO CALCULATE AREA OF COPPER NEEDED 1) Calculate maximum power dissipation Examples: Vi may a) V# (not stabilized) = 24 V; RL = 16.9 max Pp = 0.4° —zR tVt I+ ° BRL max (24424) . where 8-16 V+max = maximum value of supply voltage (inc- From Fig, 12 L= 25 mm 10% if 7 crease 10% if not stabilized) For geometries different from the one of Fig. 17 note Ry = load resistance that copper areas near the tabs have better efficien- _ cy as regards power dissipation. Therefore addition- 4+ = quiesce 14 = uiesent grain current for, tpical value see at safety factors must be added for worst case de: worst case design) signs. Ta max = 70°C b) V+ (stabilized) = 12 V; RL = 8.2 2) From Fig. 12, and knowing Tamaxy calculate cop- Pp =04 12". 002-12=1W per length ("L") 8-8 The Fig. 12 shows that no heat sink is required if Ty < 55°C. 4-212