TB6562ANG TOSHIBA | Alldatasheet
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2-phase/1-2 phase/W 1-2 phase excitation PWM current control Power supply voltage: 40 V (max) Output current: 1.5 A (max) Low ON-resistance: 1.5 Ω (upper and lower transistors/typ.) Power-saving function Overcurrent protection: Ilim＝2.5 A (typ.) Thermal shutdown Weight: 1.62 g (typ.) Preliminary TB6562ANG: TB6562ANG is Pb-free product. The following conditions apply to solderability: *Solderability Use of Sn-63Pb solder bath *solder bath temperature = 230˚C *dipping time = 5 seconds *number of times = once *use of R-type flux Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245˚C *dipping time = 5 seconds *number of times = once *use of R-type flux
Some functional blocks, circuits, or constants may be omitted or simplified in the block diagram for explanatory purposes. GND 5 V Vreg SB OSC VCC OUT2A Vcc OUT1A OUT2B Vcc OUT1B GND GND Phase A X1A X2A Phase B X1B X2B VrefA RSA VrefB RSB GND OSC Waveform squaring circuit Control logic Thermal shutdown Decoder
Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Power supply voltage VCC V Output voltage Vo V Output current IO (Peak) 1.5 A Input voltage Vin 5.5 V Power dissipation PD 2.5 (Note 1) W Operating temperature Topr −20 to 85 Storage temperature Tstg −55 to 150 Junction temperature Tjmax 150 Note 1: When mounted on a board (50 mm × 50 mm × 1.6 mm, Cu area: 50%) The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be exceeded during operation, even for an instant. If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably altered, in which case the reliability and lifetime of the device can no longer be guaranteed. Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other equipment. Applications using the device should be designed so that no maximum rating will ever be exceeded under any operating condition. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this document. Operating Range (Ta = 25°C) Characteristics Symbol Rating Unit Power supply voltage VCC 10~ 34 V Input voltage Vin 0~ 5 V Vref voltage Vref 0.5~ 7.0 V PWM frequency fpwm 15~ 80 kHz Triangular-wave oscillation frequency fosc 45~ 400 kHz
Pin No. Symbol Function Description Remarks GND Ground pin Vreg 5-V output pin Connect a capacitor between this pin and GND pin. SB Standby pin HIGH: Start, LOW: Standby Phase A Rotation direction control pin (ch. A) Apply a 0-V/5-V signal. X1A Input pin used to set output current level (ch. A) Apply a 0-V/5-V signal. X2A Input pin used to set output current level (ch. A) Apply a 0-V/5-V signal. VCC Power supply voltage input pin VCC (opr) = 10 V to 34 V OUT1A Output pin 1 (ch. A) Connect to a motor coil pin. VrefA Input pin for external reference voltage (ch. A) RSA Output current detection resistor connection pin (ch. A) OUT2A Output pin 2 (ch. A) Connect to a motor coil pin. GND Ground pin GND Ground pin OUT2B Output pin 2 (ch. B) Connect to a motor coil pin. RSB Output current detection resistor connection pin (ch. B) VrefB Power supply voltage input pin for motor drive (ch. B) OUT1B Output pin 1 (ch. B) Connect to a motor coil pin. VCC Power supply voltage input pin VCC (opr) = 10 V to 34 V X2B Input pin used to set output current level (ch. B) Apply a 0-V/5-V signal. X1B Input pin used to set output current level (ch. B) Apply a 0-V/5-V signal. Phase B Rotation direction control pin (ch. B) Apply a 0-V/5-V signal. OSC Capacitor connection pin for triangular-wave oscillation VCC Power supply voltage input pin VCC (opr) = 10 V to 34 V GND Ground pin
Electrical Characteristics (VCC = 24 V, Ta = 25°C) Characteristics Symbol Test Circuit Test Condition Min Typ. Max Unit ICC1 XT1A = XT2A = H, XT1B = XT2B = H 6.5 ICC2 XT1A = XT2A = L, XT1B = XT2B = L 7.0 Supply current ICC3 Standby mode 2.0 4.0 mA VINH 5.5 Input voltage VINL -0.2 0.8 Input hysteresis voltage VIN (HYS) 0.4 V IINH VIN = 5 V Control circuit (Note 1) Input current IINL VIN = 0 V µA VINSH 5.5 Input voltage VINSL −0.2 0.8 Input hysteresis voltage VIN (HYS) 0.4 V IINSH VIN = 5 V Standby circuit Input current IINSL VIN = 0 V µA IO = 1.5 A 1.5 2.0 Output ON-resistance Ron (U + L) IO = 1.5 A 1.5 2.0 Ω IL (U) VCC = 40 V Output leakage current IL (L) VCC = 40 V µA VF (U) IO = 1.5 A 1.3 2.0 Diode forward voltage VF (L) IO = 1.5 A 1.3 2.0 V Internal reference voltage Vreg 1 mA 4.75 5.25 V Input current Iref Vref = 0.5 V µA Vref (1/10) X1 = X2 = L Vref = 5 V 0.45 0.5 0.55 Vref (1/15) X1 = L, X2 = H Vref = 5 V 0.28 0.33 0.38 Vref circuit Current limit voltage Vref (1/30) X1 = H, X2 = L Vref ＝5 V 0.12 0.17 0.22 V Triangular-wave oscillation frequency fosc C = 4700 pF 110 132 kHz Thermal shutdown circuit operating temperature TSD 160 Note 1: Phase, X1 and X2 pins
< 2-phase excitation > Phase A Phase B Input Output Input Output Phase A X1A X2A IO(A) Phase B X1B X2B IO (B) H L L 100% H L L 100% L L L −100% H L L 100% L L L −100% L L L −100% H L L 100% L L L −100% < 1-2 phase excitation > Phase A Phase B Input Output Input Output Phase A X1A X2A IO (A) Phase B X1B X2B IO (B) H L L 100% H L L 100% X H H H L L 100% L L L −100% H L L 100% L L L −100% X H H L L L −100% L L L −100% X H H L L L −100% H L L 100% L L L −100% H L L 100% X H H < W1-2 phase excitation > Phase A Phase B Input Output Input Output Phase A X1A X2A IO (A) Phase B X1B X2B IO (B) X H H L L L −100% H H L 33.3% L L L −100% H L H 66.7% L L H −66.7% H L L 100% L H L −33.3% H L L 100% X H H H L L 100% H H L 33.3% H H L 33.3% H L H 66.7% H L H 66.7% H L L 100% X H H H L L 100% L H L −33.3% H L L 100% L L H −66.7% H L H 66.7% L L L −100% H H L 33.3% L L L −100% X H H L L L −100% L H L −33.3% L L H −66.7% L L H −66.7% L H L −33.3% L L L −100%
Timing charts may be simplified for explanatory purposes. < 2-phase excitation > < 1-2 phase excitation > IO (A) 100％ −100％ 100％ −100％ H L H L H L H L H L H L IO (B) Phase A X1A X2A Phase B X1B X2B H L H L H L H L H L H L Phase A X1A X2A Phase B X1B X2B IO (A) 100％ −100％ IO (B) 100％ −100％
< W1-2 phase excitation > H L H L H L H L H L H L Phase A X1A X2A Phase B X1B X2B IO (A) 100％ 66.7% 33.3% −33.3％ −66.7% −100% IO (B) 100％ 66.7% 33.3% −33.3％ −66.7% −100%
The IC enters CW (CCW) mode and short brake mode alternately during PWM current control. To prevent shoot-through current caused by simultaneous conduction of upper and lower transistors in the output stage, a dead time is internally generated for 500 ns (target spec) when the upper and lower transistors are being switched. Therefore synchronous rectification for high efficiency in PWM current control can be achieved without an off-time generated via an external input. Even when toggling between CW and CCW modes, and CW (CCW) and short brake modes, no off-time is required due to the internally generated dead time. VCC M RS VCC M RS PWM ON PWM OFF → ON t4 = 500 ns (typ.) VCC M RS PWM OFF PWM ON → OFF t2 = 500 ns (typ.) VCC M RS OUT1 OUT1 OUT1 OUT1 VCC M RS PWM ON OUT1
(1) Constant current regulation When VRS reaches the reference voltage (Vref), the IC enters discharge mode. After four clock signals are generated from the oscillator, the IC moves from discharge mode to charge mode. VRS Vref Internal clock Discharge Charge Vref OSC VRS GND Discharge
(2) Transition from charge mode to discharge mode If VRS > Vref after four clock signals in charge mode, the IC again enters discharge mode. After a further four clock signals in discharge mode, VRS is compared with Vref. If VRS < Vref, the IC operates in charge mode until VRS reaches Vref. (3) Transition from discharge mode to charge mode Even when the reference voltage has risen, discharge mode lasts for four clock signals and is then toggled to charge mode. Internal oscillation frequency (fosc) The internal oscillation frequency is determined by the charging and discharging of the external capacitor (Cosc): ｆosc = 1 / (0.523 × (Cosc × 3700 ＋ Cosc × 600)) （theoretical formula） Internal clock Discharge Charge Discharge Charge Internal clock Discharge Discharge Charge Vref VRS OSC GND Vref VRS OSC GND
Reference Voltage Generator The current value at 100% is determined by applying voltage at the Vref pin. The value can be calculated as: IO (100％) = Vref × 1/10 × 1/RS[A] (X1 = X2 = L) Thermal Shutdown Circuit (TSD) The IC incorporates a thermal shutdown circuit. When the junction temperature (Tj) reaches 160°C (typ.), the output transistors are turned off. After 50 µs (typ.), the output transistors are turned on automatically. The IC has 20°C of temperature hysteresis. TSD = 160°C (target spec) ∆TSD = 20°C (target spec) Overcurrent Protection Circuit (ISD) The IC incorporates an overcurrent protection circuit to detect voltage flowing through the output transistors. The overcurrent threshold is 2.5 A (typ.). Currents flowing through the output transistors are monitored individually. If overcurrent is detected in at least one of the transistors, all transistors are turned off. The IC incorporates a timer to count the 50 µs (typ.) for which the transistors are off. After the 50 µs, the transistors are turned on automatically. If an overcurrent occurs again, the same operation is repeated. To prevent false detection due to glitches, the circuit turns off the transistors only when current exceeding the overcurrent threshold flows for 10 µs or longer. The target specification for the overcurrent limiter value (overcurrent threshold) is 2.5 A (typ.), and varies in a range from approximately 1.5 A to 3.5 A. These protection functions are intended only as a temporary means of preventing output short circuits or other abnormal conditions and are not guaranteed to prevent damage to the IC. - If the guaranteed operating ranges of this product are exceeded, these protection features may not operate and some output short circuits may result in the IC being damaged. The overcurrent protection feature is intended to protect the IC from temporary short circuits only. Short circuits persisting over long periods may cause excessive stress and damage the IC. Systems should be configured so that any overcurrent condition will be eliminated as soon as possible. Decoder Control circuit ILIM 50 µs (typ.) 10 µs (typ.) Not detected 50 µs (typ.) 10 µs (typ.) Output current VCC M IO OUT1 RS Vref IO OUT2
Note 1: A power supply capacitor should be connected between VCC and RSA (RSB) and as close as possible to the IC. Note 2: C2 and C3 should be connected as close as possible to S-GND. Note 3: When changing the Vref, a DAC output can be connected directly to the Vref pin. Note 4: The VCC pins (pin 23, pin 7, pin 18) should be shorted externally. Caution on Use The IC may be destroyed by short circuits between output pins, an output pin and the VCC pin, or an output pin and the ground pin. Exercise due care when designing output lines, VCC lines and ground lines. Install the product correctly. Otherwise, breakdown, damage and/or degradation to the product or equipment may result. (Note 2) 24 V VCC OSC Vreg GND OUT1A RSA TB6562ANG PORT1 PORT2 PORT3 PORT4 PORT5 PORT6 PORT7 PORT8 PORT9 GND DAC output signal SB Phase A XA1 XA2 Phase B XB1 XB2 OUT2A OUT1B RSB OUT2B VrefA VrefB 1,12,13,24 (Note 4) (Note 1) VDD Stepping motor 5 V Vcc Vcc
Weight: 1.62 g (typ.)
- Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Maximum Ratings The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be exceeded during operation, even for an instant. If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably altered, in which case the reliability and lifetime of the device can no longer be guaranteed. Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other equipment. Applications using the device should be designed so that no maximum rating will ever be exceeded under any operating conditions. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this document. 5. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required in the mass production design phase. In furnishing these examples of application circuits, Toshiba does not grant the use of any industrial property rights. 6. Test Circuits Components in test circuits are used only to obtain and confirm device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure in application equipment. Handling of the IC Ensure that the product is installed correctly to prevent breakdown, damage and/or degradation in the product or equipment. Overcurrent protection and heat protection circuits These protection functions are intended only as a temporary means of preventing output short circuits or other abnormal conditions and are not guaranteed to prevent damage to the IC. If the guaranteed operating ranges of this product are exceeded, these protection features may not operate and some output short circuits may result in the IC being damaged. The overcurrent protection feature is intended to protect the IC from temporary short circuits only. Short circuits persisting over long periods may cause excessive stress and damage the IC. Systems should be configured so that any overcurrent condition will be eliminated as soon as possible. Counter-electromotive force When the motor reverses or stops, the effect of counter-electromotive force may cause the current to flow to the power source. If the power supply is not equipped with sink capability, the power and output pins may exceed the maximum rating. The counter-electromotive force of the motor will vary depending on the conditions of use and the features of the motor. Therefore make sure there will be no damage to or operational problem in the IC, and no damage to or operational errors in peripheral circuits caused by counter-electromotive force.
- The information contained herein is subject to change without notice.
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