TB6552FN_07 TOSHIBA | Alldatasheet
Document overview
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Technical content
Features
- Power supply voltage for motor: VM ≤ 15 V (max)
- Power supply voltage for control: VCC = 2.7 V to 6.0 V
- Output current: 1 A (max)
- Low ON resistor: 1.5 Ω (typ.) (Upper side + lower side combined @ VM = 5 V)
- Direct PWM control
- Standby system (power saving)
- CW/CCW/short brake/stop function modes
- Built-in thermal shutdown circuit
- Package: SSOP16 for TB6552FN/FNG /QON24 for TB6552FL/FLG * This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. TB6552FN/FNG TB6552FL/FLG Weight SSOP16-P-225-0.65B : 0.07 g (typ.) TB6552FNG/FLG: The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230°C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245°C *dipping time = 5 seconds *number of times = once *use of R-type flux
Pin No Pin.Name FN/FNG FL/FLG Functional Description Remarks GND 1 21 Small-signal GND pin GND for small-signal power supply (VCC) AIN1 2 18 Control signal input 1 (Ch. A) AIN2 3 17 Control signal input 2 (Ch. A) APWM 4 16 PWM control signal input pin (Ch. A) Input PWM signal ASTBY 5 15 Standby control input pin (Ch. A) Ch. A circuit is in standby (power save) state while this signal is Low. AO1 7 13 Output pin 1 (Ch. A) Ch. A connect to motor coil pin AO2 8 11 Output pin 2 (Ch. A) Ch. A connect to motor coil pin PGND 9 10 GND pin for motor GND for motor power supply (VM) VM 6 14 Motor power supply pin VM (ope) = 2.5 V to 13.5 V BO2 10 8 Output pin 2 (Ch. B) Ch. B connect to motor coil pin BO1 11 5 Output pin 1 (Ch. B) Ch. B connect to motor coil pin BSTBY 12 4 Standby control input pin (Ch. B) Ch. B circuit is in standby (power save) state while this signal is Low. BPWM 13 3 PWM control signal input pin (Ch. B) Input PWM signal BIN2 14 2 Control signal input 2 (Ch. B) BIN1 15 1 Control signal input 1 (Ch. B) VCC 16 22 Small-signal power supply pin V CC (ope) = 2.7 V to 5.5 V Note: Pins 6, 7, 9, 12, 19, 20, 23 and 24 on the FL/FLG are NC (not connected) pins. VCC BSTBYBIN1 BIN2 BPWM BO1 BO2 VM GND ASTBYAIN1 AIN2 APWM AO1 AO2 PGND Control logic (Ch. B) Control logic (Ch. A) Bridge Driver (Ch. B) Bridge Driver (Ch. A) TSD
Input/Output Function (common for channel A and B) Input Output IN1 IN2 STBY PWM O1 O2 Mode H H H H L L L Short brake H L H CW/CCW L H H L L L Short brake H H L CCW/CW H L H L L L Short brake H L L H L OFF (high impedance) Stop H H/L H/L L L OFF (high impedance) Standby Operating Description
- PWM control function Speed can be controlled by inputting the high-level or low-level PWM signal to the pin PWM. When PWM control is provided, normal operation and short brake operation are repeated. To prevent penetrating current, dead time (t2 and t4) is provided in the IC. Note: Be sure to set the PWM pin to high if the PWM control function is not used. GND VCC Output Voltage Waveform (O1) VM M GND PWM ON O1 O2 VM M GND PWM ON → OFF t2 = 300 ns (typ.) O1 O2 VM M GND PWM OFF O1 O2 VM M GND PWM OFF → ON t4 = 300 ns (typ.) O1 O2 PWM ON VM M GND O1 O2
- Switching characteristics of output transistors The switching characteristics between the PWM in put and the output transistors are shown below. <Typical Value> Item Typical Value Unit tpLH 1000 tpHL 1000 tr 100 tf 100 ns
- Input pins Input pins AIN1, AIN2, APWM, ASTBY, BIN1, BI N2, BPWM and BSTBY have internal pull-down resistors that are connected to ground. Output Voltage (A01, A02, B01, B02) 90ˋ 10ˋ 50ˋ tpLH tr 50ˋ tpHL 90ˋ 10ˋ tf PWM Input (APWM, BPWM)
Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Remarks VM 15 Supply voltage VCC 6 V Input voltage V IN −0.2 to 6 V IN1, 2, STBY and PWM pins Output current I OUT 1 A Power dissipation P D 0.78 (Note 1) W Operating temperature T opr −20 to 85 °C Storage temperature T stg −55 to 150 °C Note 1: This rating is obtained when the product is m ounted on a 50 × 30 × 1.6 mm glass-epoxy PCB of which 40% or more is occupied by copper. Operating Range (Ta = −20 to 85°C) Characteristics Symbol Min Typ. Max Unit Supply voltage (VCC) V CC 2.7 3.0 5.5 V Supply voltage (VM) VM 2.5 5.0 13.5 V Output current Iout ⎯ ⎯ 0.8 A PWM frequency fPWM ⎯ ⎯ 100 kHz
Electrical Characteristics (unless otherwise specified, VCC = 3 V, VM = 12 V, Ta = 25°C) Characteristics Symbol Test Circuit Test Condition Min Typ. Max Unit ICC (STP) ⎯ Stop mode ⎯ 0.9 1.2 ICC (W) ⎯ CW/CCW mode ⎯ 0.9 1.2 ICC (SB) ⎯ Short break mode ⎯ 0.9 1.2 mA ICC (STB) ⎯ ⎯ ⎯ 10 Supply current IM (STB) ⎯ (Standby mode) ⎯ ⎯ 1 μA VINH ⎯ 2 ⎯ VCC +
0.2 Input voltage
VINL ⎯ −0.2 ⎯ 0.8 Hysteresis voltage VIN (HIS) ⎯ (Not tested) ⎯ 0.2 ⎯ V IINH ⎯ 5 15 25 Control circuit Input current IINL ⎯ ⎯ ⎯ 1 μA VINSH ⎯ 2 ⎯ VCC + VINSL ⎯ −0.2 ⎯ 0.8 V IINSH ⎯ 5 10 20 Standby circuit Input current IINSL ⎯ ⎯ ⎯ 1 μA Io = 0.2 A ⎯ 0.3 0.4 Output saturating voltage V sat (U + L) Io = 0.8 A ⎯ 1.2 1.5 V IL (U) ⎯ ⎯ 1 Output leakage current IL (L) VM = 15 V ⎯ ⎯ 1 μA VF (U) I o = 0.8 A ⎯ 1 1.2 Diode forward voltage VF (L) Io = 0.8 A ⎯ 1 1.2 V PWM frequency f PWM ⎯ ⎯ 100 kHz PWM control circuit Minimum clock pulse width tw (PWM) ⎯ ⎯ 10 μs Tr ⎯ 100 ⎯ Tf ⎯ 100 ⎯ tpLH (PWM) ⎯ 1000 ⎯ Output transistor switching tpHL (PWM) Not tested ⎯ 1000 ⎯ ns Thermal shutdown circuit operating temperature TSD (Not tested) ⎯ 170 ⎯ °C Thermal shutdown hysteresis ΔTSD (Not tested) ⎯ 20 ⎯ °C
Ron (m Ω) Ambient temperature Ta (°C) PD – Ta Power dissipation P D (W) VM (V) Hi-side VM – Ron Ron (m Ω) VCC (V) Lo-side V CC – Ron 1.2 0.2 0.6 0.8 1.0 50 100 150 180 0.4 (1) 50 × 30 × 1.6 mm PCB mounting occupied copper area in excess of 40% (2) IC only θj-a = 250°C/W (1) (2) 3000 500 1000 2000 2500 2 3 5 6 4
1500 Ta = 85°C
Ta = 25°C Ta = −20°C 1000 200 400 800 2 3 5 6 4 600 Ta = 85°C Ta = 25°C Ta = −20°C TB6552FN/FNG
Typical Application Diagram Note 1: The power supply capacitor should be connected as close as possible to the IC. Note 2: When connecting the motor pins through the capacitor for reducing noise, connect a resistor to the capacitor to limit the charge current. Note 3: Avoid using common impedance for GND and PGND. Note 4: Utmost care is necessary in the design of the output, V CC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination f aults, or faults due to improper grounding, or by short-circuiting between contiguous pins. AIN2 AIN1 GND AO1 AO2 ASTBY TB6552 Microcontroller GND VDD VM VM Note 2 Note 3 PORT2 PORT3 PORT4 PGND VCC APWM PWM BO1 BO2 PORT1 BIN2 BIN1 BSTBY PORT6 PORT7 PORT8 BPWM PWM PORT5 Note 1Note 1 M Note 2 M
Requests Concerning Use of QON Outline Drawing of Package When using QON, take into account the following items. Caution (1) Do not carry out soldering on the island sections in the four corners of the package (indicated by the hatched sections in the figure for the lower surface, above left) with the aim of increasing mechanical strength. (2) The projecting island sections on the package surfaces (indicated by the hatched sections in the figures for the upper and lower surfaces above) must be electrically insulated from outside when used. Note 6: Ensure that the island sections (indicated by the hatched sections in the figure for the lower surface, above left) do not come into contact with solder from through-holes on the board layout.
- When mounting or soldering, take care to ensure that neither static electricity nor electrical overstress is applied to the IC. (Measures to prevent electrostatic discharge, leaks, etc.)
- When incorporating the IC into a set, adopt a set design that does not apply voltage directly to the island section. Upper surface Lower surface
Weight: 0.07 g (typ.)
Weight: 0.05 g (typ.) Do not carry out soldering at the four corners of the package.
- Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor de vice are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, caus ing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse ca pacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
Points to remember on handling of ICs (1) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily prot ect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (2) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or dr iver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (T at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, de terioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (3) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back- EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
RESTRICTIONS ON PRODUCT USE 070122EBA_R6
- The information contained herein is subject to change without notice. 021023_D
- TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their i nherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within s pecified operating ranges as set forth in the most recent TOSHIBA products specific ations. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconduct or Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A
- The TOSHIBA products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage incl ude atomic energy control in struments, airplane or spaceship instruments, transportation instruments, traf fic signal instruments, comb ustion control instruments, medical instruments, all types of safety devices, et c. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B
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- The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringement s of patents or other rights of the third parties which may result from its use. No license is granted by implic ation or otherwise under any patents or other rights of TOSHIBA or the third parties. 070122_C
- Please use this product in compliance with all applicable la ws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_AF
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