TB62747AFG

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Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 20

Technical content

Features

• Power supply voltages: VDD = 3.3 V to 5.0 V
• 16-output built-in
• Output current setting range : 1.5 to 35 mA @ VDD = 3.3 V , VO = 0.4 to 1.0 V : 1.5 to 45 mA @ VDD = 5.0 V , VO = 0.4 to 1.2 V
• Constant current output voltage: VO = 26 V (max)
• Current accuracy (@ REXT = 1.2 kΩ, VO = 0.4 V , VDD = 3.3 V , 5.0 V) : Between outputs: ± 1.5 % (max) : Between devices: ± 1.5 % (max)
• Fast response of output current : twOE(L) = 100 ns (min)
• Control data format: serial-in, parallel-out
• Input signal voltage level: 3.3 V and 5 V CMOS interfaces (Schmitt trigger input)
• Serial data transfer rate: 25 MHz (max) @cascade connection
• Operation temperature range: Topr = −40 to 85 °C
• Power on reset (POR)
• Package : AFG type : SSOP24-P-300-1.00B : AFNG type : SSOP24-P-300-0.65A : AFNAG type : SSOP24-P-150-0.64 : BFNAG type : SSOP24-P-150-0.64 TB62747AFG SSOP24-P-300-1.00B TB62747AFNG SSOP24-P-300-0.65A TB62747AFNAG/BFNAG SSOP24-P-150-0.64 Weight SSOP24-P-300-1.00B : 0.29 g (typ.) SSOP24-P-300-0.65A : 0.14 g (typ.) SSOP24-P-150-0.64: 0.14 g (typ.)

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 2 Pin Assignment (top view) Note1: Short circuiting an output pin to a power supply pin (V DD or VLED*), or short-circuiting the REXT pin to the GND pin will likely exceed the rating, which in turn may result in smoldering and/or permanent damage. Please keep this in mind when determining the wiring layout for the power supply and GND pins. LED: LED power supply TB62747AFG/AFNG/AFNAG TB62747BFNAG OUT15 SOUT VDD REXT GND SIN SCK SLAT OUT0 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 VDD REXT SOUT OE OUT15 OUT14 OUT13 OUT12 OUT11 OUT10 OUT8 OE GND SIN SLAT OUT0 OUT1 SCK OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8 OUT9 OUT10 OUT11 OUT12 OUT13 OUT9 OUT14

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 3 Block Diagram OUT0 OUT1 Constant current outputs OUT0 OUT1 OUT15 OUT15 16-bit D-latch G Q0 Q1 Q15 D0 D1 D15 R 16-bit shift register Q15Q0 Q1 Q15 R SLAT OE SIN SCK POR VDD GND REXT SOUT B.G

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 Truth Table SCK SLAT OE SIN OUT0 … OUT7 … OUT15 *1 SOUT H L Dn Dn … Dn − 7 … Dn − 15 Dn − 15 L L Dn + 1 No Change Dn − 14 H L Dn + 2 Dn + 2 … Dn − 5 … Dn − 13 Dn − 13 −*2 L Dn + 3 Dn + 2 … Dn − 5 … Dn − 13 Dn − 13 −*2 H Dn + 3 OFF Dn − 13 Note1: When OUT0 to OUT15 output pins are set to "H" the respective output will be ON and when set to "L" the respective output will be OFF. Note2: “-“ is irrelevant to the truth table. Timing Diagram Note 1: The latch circuit is a leveled-latch circuit. Please exercise precaution as it is not triggered-latch circuit. Note 2: Keep the SLAT pin is set to “L” to enable the latch circuit to hold data. In addition, when the SLAT pin is set to “H” the latch circuit does not hold data. The data will instead pass onto output. When the OE pin is set to “L” the OUT0 to OUT15 output pins will go ON and OFF in response to the data. In addition, when the OE pin is set to “H” all the output pins will be forced OFF regardless of the data. SIN SLAT SCK OUT0 OUT1 SOUT OE OUT15 H L n = 0 1 2 3 4 5 6 8 H L H L H L ON OFF ON OFF ON OFF ON OFF H L 79 1 1 10 12 13 1514 2OUT

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 Pin Functions Pin No AFG AFNG AFNAG BFNAG Pin Name I/O Function 1 7 GND ⎯ The ground pin. 2 8 SIN I The serial data input pin. 3 9 SCK I The serial data transfer clock input pin. 4 10 SLAT I The latch signal input pin. Data is saved at L level. 5 11 OUT0 O A sink type constant current output pin. 6 12 OUT1 O A sink type constant current output pin. 7 13 OUT2 O A sink type constant current output pin. 8 14 OUT3 O A sink type constant current output pin. 9 15 OUT4 O A sink type constant current output pin. 10 16 OUT5 O A sink type constant current output pin. 11 17 OUT6 O A sink type constant current output pin. 12 18 OUT7 O A sink type constant current output pin. 13 19 OUT8 O A sink type constant current output pin. 14 20 OUT9 O A sink type constant current output pin. 15 21 OUT10 O A sink type constant current output pin. 16 22 OUT11 O A sink type constant current output pin. 17 23 OUT12 O A sink type constant current output pin. 18 24 OUT13 O A sink type constant current output pin. 19 1 OUT14 O A sink type constant current output pin. 20 2 OUT15 O A sink type constant current output pin. 21 3 OE I The constant current output enable signal input pin. During the “H” level, the output will be forced off. 22 4 SOUT O The serial data output pin. 23 5 R EXT ⎯ The constant current value setting resistor connection pin. 24 6 V DD ⎯ The power supply input pin.

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating *1 Unit Power supply voltage V DD −0.4 to 6.0 V Output current I O 55 mA Logic input voltage V IN −0.3 to VDD + 0.3 *2 V Output voltage V O −0.3 to 26 V Operating temperature T opr −40 to 85 °C Storage temperature T stg −55 to 150 °C Thermal resistance Rth(j-a) 94 (AFG) *3, 120 (AFNG) *3, 80.07(AFNAG/BFNAG) When mounted PCB °C/W Power dissipation P D*4 1.32 (AFG) *3, 1.04 (AFNG) *3, 1.56(AFNAG/BFNAG) When mounted PCB W Note1: Voltage is ground referenced. Note2: However, do not exceed 6V. Note3: PCB condition 76.2 x 114.3 x 1.6 mm, Cu 30% (SEMI conforming) Note4: The power dissipation decreases the reciprocal of the saturated thermal resistance (1/ Rth(j-a)) for each degree (1°C) that the ambient temperature is exceeded (Ta = 25°C). Operating Conditions DC Items (Unless otherwise specified, VDD = 3.0 to 5.5 V, Ta = −40°C to 85°C) Characteristics Symbol Test Conditions Min Typ. Max Unit Power supply voltage V DD ⎯ 3.0 ⎯ 5.5 V Output voltage when OFF V O (ON) OUTn 0.4 ⎯ 4.0 V High level logic input voltage V IH SIN,SCK, SLAT , OE 0.7 × VDD ⎯ V DD V Low level logic input voltage V IL SIN,SCK, SLAT , OE GND ⎯ 0.3 × VDD V High level SOUT output current I OH ⎯ ⎯ ⎯ −1 mA Low level SOUT output current I OL ⎯ ⎯ ⎯ 1 mA IO1 OUTn , VDD = 3.3 V, VO = 0.4 to 1.0 V 1.5 ⎯ 35 Constant current output IO2 OUTn , VDD = 5.0 V, VO = 0.4 to 1.2 V 1.5 ⎯ 45 mA AC Items (Unless otherwise specified, VDD = 3.0 to 5.5 V, Ta = −40°C to 85°C) Characteristics Symbol Test Circuits Test Conditions Min Typ. Max Unit Serial data transfer frequency f SCK 6 ⎯ ⎯ ⎯ 25 MHz tHOLD1 6 ⎯ 5 ⎯ ⎯ ns Hold time tHOLD2 6 ⎯ 5 ⎯ ⎯ ns tSETUP1 6 ⎯ 5 ⎯ ⎯ ns Setup time tSETUP2 6 ⎯ 5 ⎯ ⎯ ns Maximum clock rise time t r 6 *1 ⎯ ⎯ 500 ns Maximum clock fall time t f 6 *1 ⎯ ⎯ 500 ns Note1: If the device is connected in a cascade and the tr/tf of the clock waveform increases due to deceleration of the clock waveform,it may not be possible to achieve the timing required for data transfer. Please keep these timing conditions in mind when designing your application.

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 Electrical Characteristics (Unless otherwise specified, VDD = 3.3V, Ta = 25°C) Characteristics Symbol Test Circuits Test Conditions Min Typ. Max Unit High level logic output voltage V OH 1 I OH = −1 mA VDD − 0.4 ⎯ ⎯ V Low level logic output voltage V OL 1 I OL = +1 mA ⎯ ⎯ 0.4 V High level logic input current I IH 2 V IN = VDD, OE , SIN, SCK ⎯ ⎯ 1 µA Low level logic input current I IL 3 V IN = GND, SLAT , SIN, SCK ⎯ ⎯ −1 µA IDD1 4 VO = 25 V, REXT = OPEN, SCK = “L”, OE = “H” ⎯ ⎯ 1.0 mA IDD2 4 R EXT = 1.2 kΩ, All output off ⎯ ⎯ 4.0 mAPower supply current IDD3 4 R EXT = 1.2 kΩ, All output on ⎯ ⎯ 8.0 mA Output current I O 5 VDD = 3.3 V, VO = 0.4 V, REXT = 1.2 kΩ, OUT0 to OUT15 ⎯ 14 ⎯ mA Constant current error(Ch to Ch) ∆IO 5 VDD = 3.3 V, VO = 0.4 V, REXT = 1.2 kΩ, OUT0 to OUT15 ⎯ ±1 ±1.5 % Constant current error(IC to IC) ∆IO(IC) 5 VDD = 3.3 V, VO = 0.4 V, REXT = 1.2 kΩ, OUT0 to OUT15 ⎯ ±1 ±1.5 % Output OFF leak current I OK 5 VDD = 3.3 V, VO = 25 V, REXT = 1.2 kΩ, OUT0 to OUT15 ⎯ ⎯ 0.5 µA Constant current power supply voltage regulation %VDD 5 VDD = 3.0 to 3.6 V, VO = 0.4 V, REXT = 1.2 kΩ, OUT0 to OUT15 ⎯ ±1 ±2 % Constant current output voltage regulation %VO 5 VDD = 3.3 V, VO = 0.4 to 3.0 V, REXT = 1.2 kΩ, OUT0 to OUT15 ⎯ ±1 ⎯ %/V Pull-up resistor R UP 3 OE 250 500 800 k Ω Pull-down resistor R DOWN 2 SLAT 250 500 800 k Ω Electrical Characteristics (Unless otherwise specified, VDD = 5.0V, Ta = 25°C) Characteristics Symbol Test Circuits Test Conditions Min Typ. Max Unit High level logic output voltage V OH 1 I OH = −1 mA VDD − 0.4 ⎯ ⎯ V Low level logic output voltage V OL 1 I OL = +1 mA ⎯ ⎯ 0.4 V High level logic input current I IH 2 V IN = VDD, OE , SIN, SCK ⎯ ⎯ 1 µA Low level logic input current I IL 3 V IN = GND, SLAT , SIN, SCK ⎯ ⎯ −1 µA IDD1 4 VO = 25 V, REXT = OPEN, SCK = “L”, OE = “H” ⎯ ⎯ 1.0 mA IDD2 4 R EXT = 1.2 kΩ, All output off ⎯ ⎯ 4.5 mAPower supply current IDD3 4 R EXT = 1.2 kΩ, All output on ⎯ ⎯ 8.0 mA Output current I O 5 VDD = 5.0 V, VO = 0.4 V, REXT = 1.2 kΩ, OUT0 to OUT15 ⎯ 14 ⎯ mA Constant current error(Ch to Ch) ∆IO 5 VDD = 5.0 V, VO = 0.4 V, REXT = 1.2 kΩ, OUT0 to OUT15 ⎯ ±1 ±1.5 % Constant current error(IC to IC) ∆IO(IC) 5 VDD = 5.0 V, VO = 0.4 V, REXT = 1.2 kΩ, OUT0 to OUT15 ⎯ ±1 ±1.5 % Output OFF leak current I OK 5 VDD = 5.0 V, VO = 25 V, REXT = 1.2 kΩ, OUT0 to OUT15 ⎯ ⎯ 0.5 µA Constant current power supply voltage regulation %VDD 5 VDD = 4.5 to 5.5 V, VO = 0.4 V, REXT = 1.2 kΩ, OUT0 to OUT15 ⎯ ±1 ±2 % Constant current output voltage regulation %VO 5 VDD = 5.0 V, VO = 0.4 to 3.0 V, REXT = 1.2 kΩ, OUT0 to OUT15 ⎯ ±1 ⎯ %/V Pull-up resistor R UP 3 OE 250 500 800 k Ω Pull-down resistor R DOWN 2 SLAT 250 500 800 k Ω

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 Switching Characteristics (Unless otherwise specified, VDD = 3.3V, Ta = 25°C) Characteristics Symbol Test Circuits Test Conditions Min Typ. Max Unit SCK- OUT0 t pLH1 6 SLAT = “H”, OE = “L” ⎯ 20 300 ns SLAT - OUT0 t pLH2 6 OE = “L” ⎯ 20 300 ns OE - OUT0 t pLH3 6 SLAT = “H” ⎯ 20 300 ns SCK-SOUT t pLH 6 CL=10.5 pF 10 20 35 ns SCK- OUT0 t pHL1 6 SLAT = “H”, OE = “L” ⎯ 30 340 ns SLAT - OUT0 t pHL2 6 OE = “L” ⎯ 70 340 ns OE - OUT0 t pHL3 6 SLAT = “H” ⎯ 70 340 ns Propagation delay time SCK-SOUT t pHL 6 CL=10.5 pF 10 20 35 ns Output rise time t or 6 10 to 90% of voltage waveform ⎯ 20 90 ns Output fall time t of 6 90 to 10% of voltage waveform ⎯ 25 180 ns Enable pulse width t wOE(L) 6 OE = “L” *1 100 ⎯ ⎯ ns Clock pulse width t wSCK 6 SCK = “H” or “L” 20 ⎯ ⎯ ns Latch pulse width t wSLAT 6 SLAT = “H” 20 ⎯ ⎯ ns Note1: At the condition of twOE(H) = 250ns or more Switching Characteristics (Unless otherwise specified, VDD = 5.0V, Ta = 25°C) Characteristics Symbol Test Circuits Test Conditions Min Typ. Max Unit SCK- OUT0 t pLH1 6 SLAT = “H”, OE = “L” ⎯ 20 300 ns SLAT - OUT0 t pLH2 6 OE = “L” ⎯ 20 300 ns OE - OUT0 t pLH3 6 SLAT = “H” ⎯ 20 30 ns SCK-SOUT t pLH 6 CL=10.5 pF 10 20 35 ns SCK- OUT0 t pHL1 6 SLAT = “H”, OE = “L” ⎯ 30 340 ns SLAT - OUT0 t pHL2 6 OE = “L” ⎯ 70 340 ns OE - OUT0 t pHL3 6 SLAT = “H” ⎯ 70 340 ns Propagation delay time SCK-SOUT t pHL 6 CL=10.5 pF 10 20 35 ns Output rise time t or 6 10 to 90% of voltage waveform ⎯ 20 90 ns Output fall time t of 6 90 to 10% of voltage waveform ⎯ 25 180 ns Enable pulse width t wOE(L) 6 OE = “L” *1 100 ⎯ ⎯ ns Clock pulse width t wSCK 6 SCK = “H” or “L” 20 ⎯ ⎯ ns Latch pulse width t wSLAT 6 SLAT = “H” 20 ⎯ ⎯ ns Note1: At the condition of twOE(H) = 250ns or more

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 I/O Equivalent Circuits 1. SCK, SIN 2. OE 3. SLAT 4. SOUT 5. OUT0 to OUT15 VDD SOUT GND VDD (SCK) (SIN) VDD OE VDD SLAT GND GND OUT0 to 15OUT GND GND

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 Test Circuits SCK SIN OE VDD OUT0 OUT7 OUT15 SOUTGNDREXT IO = -1mA to 1mA CL = 10.5 pF VDD = 3.3 V, 5.0 V F.G VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) SLAT Test Circuit1: High level logic input voltage / Low level logic input voltage REXT V SCK SIN OE VDD OUT0 OUT7 OUT15 SOUTGNDREXT CL = 10.5 pF VDD = 3.3 V, 5.0 V SLAT Test Circuit2: High level logic input current / Pull-down resistor REXT VIN = VDD A A A A SCK SIN OE VDD OUT0 OUT7 OUT15 SOUTGNDREXT CL = 10.5 pF VDD = 3.3 V, 5.0 V SLAT Test Circuit3: Low level logic input current / Pull-up resistor REXT A A A A

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 Test Circuit4: Power supply current Test Circuit5: Constant current output / Output OFF leak current / Constant current error Test Circuit5: Constant current power supply voltage regulation / Constant current output voltage regulation SCK SIN OE VDD OUT0 RL = 300 Ω CL OUT7 CL RL OUT15 CL = 10.5 pF RL SOUTGNDREXT CL = 10.5 pF VDD = 3.0 V, 5.5 V SLAT Test Circuit6: Switching Characteristics REXT = 1.2kΩ F.G VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) VLED = 4.9 V VO = 0.4 V, 25 V SCK SIN OE VDD OUT0 OUT7 OUT15 SOUTGNDREXT CL = 10.5 pF VDD = 3.3 V, 5.0 V SLAT F.G VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) A A A REXT = 1.2kΩ SCK SIN OE VDD OUT0 OUT7 OUT15 SOUTGNDREXT CL = 10.5 pF VDD = 3.3 V, 5.0 V SLAT REXT = 1.2kΩ F.G VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) A VO = 0.4 V

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 Timing Waveforms 1. SCK, SIN, SOUT 2. SCK, SIN, SLAT , OE , OUT0 3. OE, OUT0 10% 90% 10% 90% tor OUT0 OFF ON 50% 50% 50% 50% twOE tpLH3tpHL3 OE tof twOE(L) 50% tHOLD2 SIN SCK 50% 50% 50% 50% tpHL1/tpLH1 tpHL2/tpLH2 twSLAT OE OUT0 50%SLAT 50% tSETUP2 tHOLD1 tpLH/tpHL twSCK 50%50% 50% 50% tSETUP1 SIN SCK SOUT 50% 90% 10% tr tf 90% 10% twSCK 50%

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 17 Reference data *This data is provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. Output Current – REXT Resistor VDD=5.0V VO=1.0V Ta=25°C IOUT - REX T 100 1000 10000 R EX T (Ω) IOUT (mA) Theoretical value IOUT (A) = 1.13 (V) ÷ REXT (Ω) × 14.9 All output on Ta=25°C VOUT=0.7V

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 18 Reference data *This data is provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. Output Current – Duty (LED turn-on rate) IO - Duty 02 0 4 0 6 0 8 0 1 0 0 Duty - Turn on rate (%) IO (mA) IO - Duty 0 2 04 06 08 0 1 0 0 Duty - Turn on rate (%) IO (mA) IO - Duty 0 2 04 06 08 0 1 0 0 Duty - Turn on rate (%) IO (mA) Power dissipation – Ta PD - Ta 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 1 02 03 04 05 06 07 08 09 0 Ta (℃) PD (W) Ta=25°C VDD=5.0V VO=1.0V ON PCB Ta=55°C VDD=5.0V VO=1.0V ON PCB Ta=85°C VDD=5.0V VO=1.0V ON PCB AFG AFNAG/BFNAG AFNG AFNG AFG AFNAG/BFNAG AFG AFNAG/BFNAG AFNG AFNAG/BFNAG AFG AFNG

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 19 Package Dimensions Weight: 0.29 g (typ.)

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 20 Package Dimensions Weight: 0.14 g (typ.)

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 21 Package Dimensions SSOP24-P-150-0.64 Unit : Inch Weight: 0.14 g (typ.) 0.337 to 0.344 0.229 to 0.244 0.150 to 0.157 0.0325(REF) 0.025 0.008 to 0.012 0.004 to 0.098 0.054 to 0.068 0.016 to 0.034 0.010(TYP)

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 22 Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 23 IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. [5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. Points to remember on handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (T J) at any time and condition. These ICs generate heat ev en during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF . If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.

TB62747AFG/AFNG/AFNAG/BFNAG 2009-01-21 24 RESTRICTIONS ON PRODUCT USE 20070701-EN

• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semico nductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a gui de for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties.
• Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
• The products described in this document are subject to foreign exchange and foreign trade control laws.