TB62706BNG MARKTECH | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 14

Technical content

TOSHIBA Bi- CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC TB62706BNG, TB62706BFG 16BIT SHIFT REGISTER, LATCHES & CONSTANT CURRENT DRIVERS The TB62706BNG, TB62706BFG are specifically designed for LED and LED DISPLAY constant current drivers. This constant current output circuits are able to set up external resistor (IOUT = 5~90 mA). (Note) These devices are monolithic integrated circuit designed to be used together with Bi- CMOS process. The devices consist of 16bit shift register, latch, AND- GATE and Constant Current Drivers. These products are Pb free.

FEATURES

: Can set up all output current with one resister for 5 to 90 mA. l Maximum Clock Frequency : fCLK = 15 (MHz) (Cascade Connected Operate, Topr = 25°C) l 5 V C- MOS Compatible Input l Package : SDIP24- P- 300- 1.78 (TB62706BNG) SSOP24- P- 300- 1.00B (TB62706BFG) l Constant Output Current Matching: OUTPUT- GND VOLTAGE CURRENT MATCHING OUTPUT CURRENT =0.4 V ±6.0% 5~40 mA =0.7 V ±6.0% 5~90 mA PIN CONNECTION (Top view) TB62706BNG TB62706BFG Weight SDIP24-P-300-1.78 : 1.22 g (typ.) SSOP24-P-300-1.00B : 0.32 g (typ.) Company Headquarters

3 Northway Lane North

Latham, New York 12110 Toll Free: 800.984.5337 Fax: 518.785.4725 Web: www.marktechopto.com | Email: info@marktechopto.com California Sales Office:

950 South Coast Drive, Suite 265

Costa Mesa, California 92626 Toll Free: 800.984.5337 Fax: 714.850.9314 Company Headquarters Latham, New York 12110 Toll Free: 800.984.5337 Fax: 518.785.4725 Web: www.marktechopto.com | Email: info@marktechopto.com California Sales Office: Costa Mesa, California 92626 Toll Free: 800.984.5337 Fax: 714.850.9314

Note: Latches are level sensitive, not rising edges sensitive and not syncronus CLOCK. Input of LATCH- terminal to H Level, data passes latches, and input to L level, data hold latches. Input of ENABLE- terminal to H level, all output (OUT0~15) do off.

PIN No. PIN NAME FUNCTION GND GND terminal for control logic. SERIAL- IN Input terminal of a serial- data for shift- register. CLOCK Input terminal of a clock for data shift to up- edge. LATCH Input terminal of a data strobe. Latches passes data with “H” level input of LATCH - terminal, and hold data with "L" level input. 5~20 OUT0 Output terminals. ENABLE Input terminal of output enable. All outputs (OUT0~15) do off with “H” level input of ENABLE - terminal, and do on with "L" level input. SERIAL- OUT Output terminal of a serial- data for next SERIAL- IN terminal. R- EXT Input terminal of connects with a resister for to set up all output current. VDD 5 V Supply voltage terminal. TRUTH TABLE CLOCK LATCH ENABLE SERIAL- IN SERIAL- OUT UP H L Dn Dn- 15 UP L L Dn+1 No change Dn- 14 UP H L Dn+2 Dn- 13 DOWN X L Dn+3 Dn- 13 DOWN X H Dn+3 Off Dn- 13 Note: OUT0 = on in case of Dn = H level and OUT0 = off in case of Dn = L level. A resistor is connected with R- EXT and GND accompanied with outside, and it is necessary that a correct power supply voltage is supplied. EQUIVALENT CIRCUIT OF INPUTS AND OUTPUTS 1. ENABLE terminal 2. LATCH terminal 3. CLOCK, SERIAL- IN terminal 4. SERIAL- OUT terminal

MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC SYMBOL RATING UNIT Supply Voltage VDD 0~7.0 V Input Voltage VIN - 0.4~VDD + 0.4 V Output Current IOUT mA Output Voltage VOUT - 0.5~17.0 V Clock Frequency fCK MHz GND Terminal Current IGND 1440 mA 1.78 (BNG- type : ON PCB, Ta = 25°C ) Power Dissipation PD 1.00 (BFG- type : ON PCB, Ta = 25°C ) W BNG : 70 (BN- type : ON PCB) Tharmal Resistance Rth (j- a) BFG : 120 (BF- type : ON PCB) °C / W Operating Temperature Topr - 40~85 Storage Temperature Tstg - 55~150 Note: BN- type : Ambient temperature delated above 25°C in the proportion of 14.2 mW / °C BF- type : Ambient temperature delated above 25°C in the proportion of 8.3 mW / °C RECOMMENDED OPERATING CONDITION (Ta = - 40~85°C unless otherwise noted) CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT Supply Voltage VDD 4.5 5.0 5.5 V Output Voltage VOUT 15.0 V IO OUTn, DC 1 circuit IOH SERIAL- OUT 1.0 Output Current IOL SERIAL- OUT - 1.0 mA VIH 0.7 VDD VDD +0.3 Input Voltage VIL - 0.3 0.3 VDD V LATCH Pulse Width t LAT w 100 ns CLOCK Pulse Width tw CLK ns ENABLE Pulse Width t EN w 4500 ns Set- Up Time for DATA tsetup (D) ns Hold Time for DATA thold (D) ns Set- Up Time for LATCH tsetup (L) 100 ns Hold Time for LATCH thold (L) VDD = 4.5~5.5 V ns Clock Frequency fCLK Cascade operation 10.0 MHz Ta = 85°C (BNG- type) 0.92 Power Dissipation PD Ta = 85°C (BFG- type) 0.50 W

ELECTRICAL CHARACTERISTICS (VDD = 5.0 V, Ta = 25°C unless otherwise noted) CHARACTERISTIC SYMBOL TEST CIR- CUIT CONDITION MIN TYP. MAX UNIT "H" Level VIH Ta = - 40~85°C 0.7 VDD VDD Input Voltage "L" Level VIL Ta = - 40~85°C GND 0.3 VDD V Output Leakage Current IOH VOH = 15.0 V µA VOL IOL = 1.0 mA 0.4 Output Voltage SERIAL- OUT VOH IOH = - 1.0 mA 4.6 V IOL1 VCE = 0.7 V 34.1 40.0 45.9 Output Current 1 IOL2 VCE = 0.4 V REXT = 470 Ω (Include current matching) 33.7 39.5 45.3 mA Current Skew ∆ IOL1 IO = 40 mA, VCE = 0.4 V REXT = 470 Ω ±1.5 ±6.0 IOL3 VCE = 1.0 V 64.2 75.5 86.8 Output Current 2 IOL4 VCE = 0.7 V REXT = 250 Ω (Include current matching) 63.8 75.0 86.2 mA Current Skew ∆ IOL2 IO = 75 mA, VCE = 0.7 V REXT = 250 Ω ±1.5 ±6.0 Supply Voltage Regulation % / VDD REXT = 470 Ω, Ta = - 40~85°C 1.5 5.0 % / V Pull- Up Resistor RIN (up) 150 300 600 Ω Pull- Down Resistor RIN (down) 100 200 400 Ω IDD (off) 1 REXT = Open, OUT0 = off 0.6 1.2 IDD (off) 2 REXT = 470 Ω, OUT0 = off 3.5 5.8 8.0 "OFF" IDD (off) 3 REXT = 250 Ω, OUT0 = off 6.5 10.7 15.0 IDD (on) 1 REXT = 470 Ω, OUT0 = on 10.0 16.0 22.0 Supply Current "ON" IDD (on) 2 REXT = 250 Ω, OUT0 = on 18.0 28.3 38.5 mA

SWITCHING CHARACTERISTICS (Ta = 25°C unless otherwise noted) CHARACTERISTIC SYMBOL TEST CIR- CUIT CONDITION MIN TYP MAX UNIT CLK- OUTn 1200 1500 LATCH - OUTn 1200 1500 ENABLE - OUTn 1200 1500 Propagation Delay Time (“L” to “H”) CLK- SOUT tpLH ns CLK- OUTn 700 1000 LATCH - OUTn 700 1000 ENABLE - OUTn 700 1000 Propagation Delay Time (“H” to “L”) CLK- SOUT tpHL ns CLK tw CLK ns Pulse Width LATCH tw LAT ns L- H tsetup (L) ns Set- up Time H- L tsetup (C) ns L- H thold (L) ns Hold Time H- L thold (C) ns Maximum CLOCK Rise Time tr µs Maximum CLOCK Fall Time tf µs Output Rise Time tor 150 300 600 ns Output Fall Time tof VDD = 5.0 V VCE = 0.4 V VIH = VDD VIL = GND REXT = 470 Ω VL = 3.0 V RL = 65 Ω CL = 10.5 pF 150 300 600 ns

Utmost care is necessary in the design of the output line, VCC (VDD) and GND line since IC may be destroyed due to short- circuit between outputs, air contamination fault, or fault by improper grounding.

  1. CLOCK- SERIAL OUT, OUTn 2. CLOCK- LATCH 3. ENABLE - OUTn

Fig.1

LED DRIVER TB6270X SERIES APPICATION NOTE [1] Output current (IOUT) IOUT is set by the enternal resistor (R- EXT) as shown in Fig.1. [2] Total supply voltage (VLED) This device can operate 0.4~0.7V (VO). When a higher voltage is input to the device, the excess voltage is consumed inside the device, that leads to power dissipation. In order to minimize power dissipation and loss, we would like to recommend to set the total supply voltage as shown below, VLED (total supply voltage) = VCE (Tr Vsat) + Vf (LED Forward voltage) + VO (IC supply voltage) When the total supply is too high considering the power dissipation of this device, an additional R can decrease the supply voltage (VO). [3] Pattern layout This device owns only one ground pin that means signal ground pin and power ground pin are common. If ground pattern layout contains large inductance and impedance, and the voltage between ground and LATCH, CLOCK terminals exceeds 2.5 V by switching noise in operation, this device may miss- operate. So we would lile you to pay attention to pattern layout to minimize inductance.

Weight: 1.22 g (typ.)

Weight: 0.32 g (typ.)

  • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
  • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk.
  • The products described in this document are subject to the foreign exchange and foreign trade laws.
  • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others.
  • The information contained herein is subject to change without notice. 000707EBA RESTRICTIONS ON PRODUCT USE About solderability, following conditions were confirmed
  • Solderability (1) Use of Sn-63Pb solder Bath
  • solder bath temperature = 230°C
  • dipping time = 5 seconds
  • the number of times = once
  • use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath
  • solder bath temperature = 245°C
  • dipping time = 5 seconds
  • the number of times = once
  • use of R-type flux