TB386 INTERSIL | Alldatasheet
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All Intersil semiconductor products are manufactured, assembled and tested underISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with- out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web sitewww.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111 ASIA Intersil Ltd. 8F-2, 96, Sec. 1, Chien-kuo North, Taipei, Taiwan 104 Republic of China TEL: 886-2-2515-8508 FAX: 886-2-2515-8369 Summary The HIP1011 along with a minimal number of power FETs, external logic and passives can be used for effective Hot Swap power control in the CompactPCI High Availability environment. FIGURE 5. M12VIN FLTN 3V5VG VCC 12VIN 3VISEN 3VS OCSET M12VO 12VG GND 12VO 5VISEN 5VS PWRON M12VG HIP1011B R2R1 BD_SEL# -12V +12V HEALTHY# 3.3V 5m Ω 5m Ω 0.033µF 0.033µF 0.033µF 0.1µFC5 0.1µF 0.1µF 200pF 6kΩ 1.2kΩ 1.2kΩ ITF86130SK8TITF86130SK8T CP12 100µF CP5 2200µF CM12 100µF CP3 2200µF RP12 47Ω RP5 2.4Ω RP3 1.1Ω RM12 240Ω V(I/O) GND LOAD MED MED MED MEDMED MED MED SHORT LONG MED BACK PLANE CONNECTOR CARD SIDE PIN LENGTH 1.2kΩ V(I/O) MED 0.01µF 4M ΩGND 0.1µF Technical Brief 386