TB2923HQ TOSHIBA | Alldatasheet
Document overview
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Technical content
Features
- High output power
- POUT MAX (1) = 50 W (typ.) (VCC = 15.2 V, f = 1 kHz, JEITA max, RL = 4 Ω)
- POUT MAX (2) = 43 W (typ.) (VCC = 13.7 V, f = 1 kHz, JEITA max, RL = 4 Ω)
- POUT MAX (3) = 80 W (typ.) (VCC = 14.4 V, f = 1 kHz, JEITA max, RL = 2 Ω)
- POUT (1) = 29 W (typ.) (VCC = 14.4 V, f = 1 kHz, THD = 10%, RL = 4 Ω)
- POUT (2) = 25 W (typ.) (VCC = 13.2 V, f = 1 kHz, THD = 10%, RL = 4 Ω)
- Low THD: 0.005% (typ.) (VCC = 13.2 V, f = 1 kHz, POUT = 5 W, RL = 4 Ω)
- Low noise: VNO = 50 µVrms (typ.) (V CC = 13.2 V, Rg = 0 Ω, BW = 20 Hz to 20 kHz, RL = 4 Ω)
- Standby switch (pin 4)
- Mute function (pin 22)
- Output DC offset detection (pin 25)
- Various protection features Thermal overload; overvoltage; output short-circuits to GND, VCC and across the load; speaker current limiting
- Operating supply voltage: VCC (opr) = 8.0 to 18 V (RL = 4 Ω) Note 1: Install the device correctly. Otherwise, the device or system may be degraded, damaged or even destroyed. Note 2: The protection features are int ended to avoid output short-circuits or other abnormal conditions temporarily. It is not guaranteed that they will prevent the IC from being damaged. Exposure to conditions beyond the guaranteed operating ranges may not activate the protection features, resulting in an IC damage due to output short-circuits. Weight: 7.7 g (typ.)
Some of the functional blocks, circuits or constants may be omitted from the block diagram or simplified for explanatory purposes. 5 V 110 6 20 VCC1VCC2TABRipple
9 Out1 (+)11
Out1 (−) IN1
5 Out2 (+)12
Out2 (−) IN2
17 Out3 (+)15
Out3 (−) IN3
21 Out4 (+)14
Out4 (−) IN4
4 Stby
22 Mute
- Mute Function (pin 22) The audio mute function is enabled by setting pin 22 Low. R1 and C4 determine the time constant of the mute function. The time constant affects pop noise generated when power or the mute function is turned on or off; thus, it must be determined on a per-application basis. (Refer to Figures 4 and 5.) The value of the external pull-up resistor is determined, based on pop noise value. For example, when the control voltage is changed fr om 5 V to 3.3 V, the pull-up resistor should be:
3.3 V/5 V × 47 kΩ = 31 kΩ
Figure 3 Mute Function Figure 4 Mute Attenuation − VMUTE (V) 1 kΩ 5 V Mute On/Off control −120 −100 −80 −60 −40 −20 0.5 1 1.5 2 2.5 3 VCC = 13.2 V f = 1 kHz RL = 4 Ω VO = 20dBm BW = 400 Hz to 30 kHz Pin 22 control voltage: VMUTE (V) ATT – VMUTE Mute attenuation ATT (dB)
- DC Offset Detection The purpose of the integrated DC offset detector is to avoid an anomalous DC offset on the outputs, produced by the input capacitor due to leakage current or short-circuit. Figure 5 DC Offset Detection Mechanism Amp output OUT(+) VCC/2 GND GND Time GND Voltage at (A) (pin 25) Offset detection threshold (R S2) Time Time Voltage at (B) (LPF output) OUT(-) Vref Elec. vol 5 V LPF To a microcontroller V Negative DC offset (−) (caused by RS2) Positive DC offset (+) (caused by RS1) VCC/2 (normal DC voltage) Leakage current or short-circuit Vbias Vref/2 A B RS2 RS1 The microcontroller shuts down the system if the output is lower than the specified voltage.
- Layer Short Detection The TB2923HQ may be properly connected to a load such as a 4-Ω speaker, but one of the speaker lines may be shorted to ground through a low-impedance path. The TB2923HQ can detect such a condition. Figure 6 Layer Short As is the case with output DC offset detection, pin 25 is also activated when there is a short on one of the speaker lines as shown above. The detection impedance is 2.5 Ω (typ.). This feature allows detection of a short-circuit through a low-impedance path other than the speaker impedance. It helps to avoid speaker damage in case of anomalous system conditions and improve system reliability. VCC IC GND out out SP = 4 Ω The negative (−) speaker connection is shorted to ground through a low-impedance path due to some irregularities.
- Pop Noise Suppression Since the TB2923HQ uses the AC-GND pin (pin 16) as the common input reference voltage pin for all amplifiers, the ratio of the input capacitance (C1) to the AC-to-GND capacitance (C6) should be 1:4. Also, if power is removed before C1 and C6 are completely charged, pop noise will be generated because of unbalanced DC currents. To avoid this problem, it is recommended to use a larger capacitor as C2 to increase the charging times of C1 and C6. Note, however, that C2 also affects the time required from power-on to audio output. The pop noise generated by the muting and unmuting of the audio output varies with the time constant of C4. A larger capacitance reduces the pop noise, but increases the time from when the mute control signal is applied to C4 to when the mute function is enabled. 6. External Component Constants Effects Component Recommended Value Purpose When lower than recommended value When higher than recommended value Notes C1 0.22 µF To eliminate DC Cut-off frequency is increased. Cut-off frequency is reduced. Pop noise is generated when V CC is turned on. C2 47 µF To reduce ripple Powering on/off is faster. Powering on/off is slower. C3 0.1 µF To provide sufficient oscillation margin Reduces noise and provides sufficient oscillation margin C4 1 µF To reduce pop noise High pop noise. Duration until mute function is turned on/off is short. Low pop noise. Duration until mute function is turned on/off is long. C5 3900 µF Ripple filter Power supply humming and ripple filtering. C6 1 µF Common reference voltage for all input Pop noise is suppressed when C1: C6 = 1:4. Pop noise is generated when V CC is turned on.
Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Peak supply voltage (0.2 s) V CC (surge) 50 V DC supply voltage V CC (DC) 25 V Operating supply voltage V CC (opr) 18 V Output current (peak) I O (peak) 9 A Power dissipation P D (Note 7) 125 W Operating temperature T opr −40 to 85 °C Storage temperature T stg −55 to 150 °C Note 5: Package thermal resistance θj-T = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink) The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be exceeded during operation, even for an instant. If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other equipment. Applications using the device should be designed so that no absolute maximum rating will ever be exceeded under any operating conditions. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this document.
Electrical Characteristics
(VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, Ta = 25°C unless otherwise specified) Characteristics Symbol Test Circuit Test Condition Min Typ. Max Unit Quiescent supply current I CCQ V IN = 0 180 300 mA POUT MAX (1) V CC = 15.2 V, max POWER 50 POUT MAX (2) V CC = 13.7 V, max POWER 43 POUT MAX (3) VCC = 14.4 V, RL=2Ω, max POWER 80 POUT (1) V CC = 14.4 V, THD = 10% 29 Output power POUT (2) THD = 10% 23 25 W Total harmonic distortion THD P OUT = 5 W 0.005 0.07 % Voltage gain G V V OUT = 0.775 Vrms 25 26 27 dB Channel-to-channel voltage gain ∆GV V OUT = 0.775 Vrms −1.0 0 1.0 dB VNO (1) R g = 0 Ω, DIN45405 60 Output noise voltage VNO (2) Rg = 0 Ω, BW = 20 Hz to 20 kHz 55 70 µVrms Ripple rejection ratio R.R. frip = 100 Hz, Rg = 620 Ω Vrip = 0.775 Vrms 50 65 dB Crosstalk C.T. Rg = 620 Ω POUT = 4 W 80 dB Output offset voltage V OFFSET −90 0 90 mV Input resistance R IN 90 k Ω Standby current I SB Standby condition, V4=0,V22=0 0.1 1 µA VSB H POWER: ON 2.9 VCC Standby control voltage VSB L POWER: OFF 0 0.9 V VM H MUTE: OFF 2.9 VCC Mute control voltage VM L MUTE: ON, R 1 = 47 kΩ 0 0.9 V
Characteristics Symbol Test Circuit Test Condition Min Typ. Max Unit Mute attenuation ATT M MUTE: ONADIN_AUDIO VOUT = 7.75 Vrms → Mute: OFF 85 100 dB Upper cut-off frequency F th G V = 26dB, −3dB 250 kHz DC offset threshold voltage V off-set Rpull-up = 10 kΩ, +V = 5.0 V Layer short detection impedance R half-short Rpull-up = 10 kΩ, +V = 5.0 V channel (+) or (−) shorted to GND, when between Rs impedance output to GND. 2.5 Ω Pin 25 saturation voltage (at each detector ON condition) P25-Sat Rpull-up = 10 kΩ, +V = 5.0 V (pin 25 = low) 100 500 mV Test Circuit Components in the test circuit are only used to determine the device characteristics. It is not guaranteed that the system will work properly with these components. 5 V 110 6 20 VCC1VCC2TABRipple C2: 47 µF +B C3: 0.1 µF C5: 3900 µF C1: 0.22 µF PW-GND1 Out1 (−) IN1 Out2 (−) IN2 Out3 (−) IN3 Out4 (−) IN4 C6: 1 µF C4: 1 µF R1: 47 kΩ Play Mute RL = 4 ohm Pre-GND AC-GND Offset/short C1: 0.22 µF C1: 0.22 µF C1: 0.22 µF RL = 4 ohm RL = 4 ohm RL = 4 ohm
0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 0.3 0.5 100 f = 100 Hz VCC = 13.2 V RL = 4 Ω Filter
100 Hz : to 30 kHz
1kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to 20 kHz 10 kHz 1 kHz 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 0.3 0.5 100 f = 100 Hz 20 kHz 10 kHz 1 kHz 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 0.3 0.5 100 f = 100 Hz Output power P OUT (W) THD – POUT (ch1) Total harmonic distortion THD (%) Output power P OUT (W) Output power P OUT (W) Output power P OUT (W) THD – POUT (ch2) Total harmonic distortion THD (%) THD – POUT (ch4) Total harmonic distortion THD (%) (%) THD – POUT (ch3) Total harmonic distortion THD (%) 20 kHz 10 kHz 1 kHz 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 0.3 0.5 100 f = 100 Hz VCC = 13.2 V RL = 4 Ω Filter 1kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to VCC = 13.2 V RL = 4 Ω Filter 1kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to VCC = 13.2 V RL = 4 Ω Filter 1kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to
Output power P OUT (W) THD – POUT (ch1) Total harmonic distortion THD (%) Output power P OUT (W) Output power P OUT (W) Output power P OUT (W) THD – POUT (ch2) Total harmonic distortion THD (%) THD – POUT (ch4) Total harmonic distortion THD (%) THD – POUT (ch3) Total harmonic distortion THD (%) 13.2 V 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 0.3 0.5 100 VCC = 13.2 V RL = 4 Ω f = 1 kHz Filter
400 Hz to 30 kHz
VCC = 9 V 16 V 13.2 V 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 0.3 0.5 100 VCC = 13.2 V RL = 4 Ω f = 1 kHz Filter VCC = 9 V 16 V 13.2 V 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 0.3 0.5 100 VCC = 13.2 V RL = 4 Ω f = 1 kHz Filter VCC = 9 V 16 V 13.2 V 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 0.3 0.5 100 VCC = 13.2 V RL = 4 Ω f = 1 kHz Filter VCC = 9 V 16 V
frequency f (Hz) muteATT – f Mute attenuation muteATT (dB) frequency f (Hz) R.R. – f Ripple rejection ratio R.R. (dB) frequency f (Hz) G V – f Voltage gain G V (dB) Total harmonic distortion THD (%) frequency f (Hz) VCC = 13.2 V RL = 4 Ω VOUT = 0.775 Vrms (0dBm) 0.1 0.01 100 1 10 1 ch~4 ch VCC = 13.2 V RL = 4 Ω VOUT = 7.75 Vrms (20dBm) 100 10 100 k −120 1 k 10 k −100 −80 −60 −40 −20 1 ch~4 ch VCC = 13.2 V RL = 4 Ω Vrip = 0.775 Vrms (0dBm) 0.10.01 100 −80 1 10 −60 −40 −20 0.3 2 ch VCC = 13.2 V RL = 4 Ω POUT = 5 W No filter 0.10.01 100 0.001 1 10 0.003 0.01 0.03 0.1 THD – f 1 ch~3 ch 1 ch~4 ch
Output power P OUT (W) Input voltage V IN ( V r m s ) V IN – POUT (ch1) Output power P OUT (W) Input voltage V IN ( V r m s ) V IN – POUT (ch2) Output power P OUT (W) Input voltage V IN ( V r m s ) V IN – POUT (ch3) Output power P OUT (W) Input voltage V IN ( V r m s ) V IN – POUT (ch4) Supply voltage V CC (V) ICCQ – VCC Quiescent Current I CCQ (mA) Ambient temperature Ta (°C) PDMAX – Ta Allowable power dissipation P DMAX (W) 0 2 4 6 8 10 VCC = 13.2 V RL = 4 Ω No filter 100Hz,-20kHz 0 2 4 6 8 10 VCC = 13.2 V RL = 4 Ω No filter 0 2 4 6 8 10 VCC = 13.2 V RL = 4 Ω No filter 0 2 4 6 8 10 VCC = 13.2 V RL = 4 Ω No filter (1) (2) (3) 250 150 120 100 100 50 125 (1) INFINITE HEAT SINK RθJC = 1°C/W (2) HEAT SINK (R θHS = 3.5°C/W RθJC + RθHS = 4.5°C/W (3) NO HEAT SINK RθJA = 39°C/W 200 RL = ∞ VIN = 0 V 5 10 15 20 25 120 160 100Hz,-20kHz 100Hz,-20kHz 100Hz,-20kHz
f = 1 kHz RL = 4 Ω 4ch drive VCC = 9.0 V 13.2 V 18 V Output noise voltage V NO ( µVrms) C r o s s t a l k C . T . ( d B ) frequency f (Hz) C.T. – f (ch1) C r o s s t a l k C . T . ( d B ) frequency f (Hz) C.T. – f (ch2) C r o s s t a l k C . T . ( d B ) frequency f (Hz) C.T. – f (ch3) C r o s s t a l k C . T . ( d B ) frequency f (Hz) C.T. – f (ch4) Signal source resistance R g ( Ω) V NO – Rg Output power P OUT (W) P D – POUT Power dissipation P D (W) VCC = 13.2 V RL = 4 Ω VOUT = 0.775 Vrms (0dBm) RG = 620 Ω −80 CT (1-2) −60 −40 −20 100 1 k 10 k 100 k CT (1-3) CT (1-4) VCC = 13.2 V RL = 4 Ω VOUT = 0.775 Vrms (0dBm) RG = 620 Ω −80 CT (2-1) −60 −40 −20 100 1 k 10 k 100 k CT (2-3) CT (2-4) VCC = 13.2 V RL = 4 Ω VOUT = 0.775 Vrms (0dBm) RG = 620 Ω −80 CT (3-1) −60 −40 −20 100 1 k 10 k 100 k CT (3-2) CT (3-4) VCC = 13.2 V RL = 4 Ω VOUT = 0.775 Vrms (0dBm) RG = 620 Ω −80 CT (4-1) −60 −40 −20 100 1 k 10 k 100 k CT (4-2) CT (4-3) VCC = 13.2 V RL = 4 Ω Filter:
20 Hz~20 kHz
1ch~4ch
Weight: 7.7 g (typ.)
- Use an appropriate power supply fuse to ensure that a lar ge current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and t he breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
- If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from t he back electromotive force at power OFF. For details on how to connect a protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition.
- Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
- Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, powe r amp and regulator. If there is a lar ge amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
- Over current Protection Circuit Over current protection circuits (referred to as current li miter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown.
- Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
- Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specifi ed junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characte ristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components.
- Installation to Heat Sink Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink installation, refer to individual technical datasheets or IC databooks.
RESTRICTIONS ON PRODUCT USE 060116EBA
- The information contained herein is subject to change without notice. 021023_D
- TOSHIBA is continually working to improve the quality a nd reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their i nherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfun ction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within s pecified operating ranges as set forth in the most recent TOSHIBA products specific ations. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semico nductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A
- The TOSHIBA products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunc tion or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffi c signal instruments, comb ustion control instruments, medical instruments, all types of safety devices, et c. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B
- The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
- The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by impl ication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C
- The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E About solderability, following conditions were confirmed
- Solderability (1) Use of Sn-37Pb solder Bath
- solder bath temperature = 230°C
- dipping time = 5 seconds
- the number of times = once
- use of R-type flux (2) Use of Sn-3.0Ag-0 .5Cu solder Bath
- solder bath temperature = 245°C
- dipping time = 5 seconds
- the number of times = once
- use of R-type flux