TB110F LEIDITECH | Alldatasheet
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Technical content
Maximum Ratings and Thermal Characteristics(TA = 25°C unless otherwise specified) °CRatings at 25 ambient temperature unless otherwise specified. Single phase half-wave 60 Hz, resistive or inductive load, for capacitive load current derate by 20 %. Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) Maximum Forward Voltage at 1.0 A Parameter of Bridge Rectifier Operating and Storage Temperature Range Typical Junction Capacitance(f=1MHz,4V DC) IO IFSM VF 1.0 1.1 -55 ~ +150 A A V μA pF Units Cj T , Tj stg Symbols 130Typical Thermal Resistance(Note1) °C/WRθJA Average Rectified Output Current at T = 125 °CC Maximum DC Reverse Current at Rated DC Blocking Voltage (@VR=1000V) IR 100 @T =25 °CA @T =125 °CA
FEATURES
Lead Free Finish/RoHS Compliant Green Molding Compound (No Halogen and Antimony)
- Lower clamping voltage and excellent performance on ringing waves testing.
- Glass Passivated Chip Junction
- High Surge Current Capability
- Designed for Surface Mount Application PINNING PIN
DESCRIPTION
4 Output Cathode(-)
Output Anode(+) Input Pin(~) Input Pin(~) MECHANICAL DATA
- Case: MBF-T
- Terminals: Solderable per MIL-STD-750, Method 2026
- A pprox. Weight: 75mg / 0.0026oz Parameter of TVS Maximum allowable continuous AC voltage at 50-60Hz Symbol Unit VRMS V Maximum allowable continuous DC voltage VDC V Operating and Storage Temperature Range T , Tj stg °C-55 ~ +150 TB110F 155 220 VBR V237~263Breakdown voltage @ 1mA TB120F TB110F TB120F 209~231 135 190 4 3 1 2 310 440 492~543 TB240F TB240F TB110F~TB240F SU GE SUPPRESSOR BRIDGE SERIESR Rev : 01.12.2020 1/4 www.leiditech.com
Fig.5 Maximum Non-Repetitive Peak Forward Surage Current Peak A)Forward Surage Current ( Number of Cycles 8.3 ms Single Half Sine Wave (JEDEC Method) Fig.2 Typical Reverse Characteristics 0.1 1.0 100 20 40 60 80 100 12000 140 percent of Rated Peak Voltage (%)Reverse Instaneous Current( A)Reverse μ T =125J °C T =25J °C Fig.4 Typical Junction Capacitance Junction Capacitance ( pF) 1.0 10 1000.1 100 Reverse Voltage (V) T =25J °C 0.2 0.4 0.6 0.8 1.0 0.0 25 50 75 100 125 150 175 Fig.1 Derating Curve Average Rectified Output Current Average Rectified Output Current (A) Case Temperature (°C) 1.2 Fig.3 Typical Instaneous Forward Characteristics Instaneous Forward Current (A) 0.0 0.01 0.1 1.0 Instaneous Forward Voltage (V) T =25J °C pulse with 300μs 1% duty cycle Resistive or Inductive Load 0.01 100 100 Fig.6- Typical Transient Thermal Impedance Transient Thermal Impedance( /W)°C t, Pulse Duration(sec) 0.1 1 10 1000 TB110F~TB240F Rev : 01.12.2020 2/4 www.leiditech.com
- Recommended condition of flow soldering 2 to 5 min more than 1 min less than 10s 100°C 120°C 245°C 265°C Temperature of Soldering (°C) Preliminary Heating Soldering Cooling (in air) 100 150 200 250 300
- Recommended condition of reflow soldering Recommended peak temperature is over 245 °C. If peak temperature is below 245 °C, you may adjust the following parameters; time length of peak temperature (longer), time length of soldering (longer), thickness of solder paste (thicker) Temperature: 370°C Time: 3s max. Times: one time
- Condition of hand soldering
- Remark: Lead free solder paste (96.5Sn/3.0Ag/0.5Cu) Temperature of Soldering (°C)Pre Heating Rate 1 to 5°C / s Preliminary Heating 130 to 170°C, 50 to 120s Soldering 230°C 20 to 30s Cooling more than 60s Reflow Heating Rate 1 to 5°C / s Peak Temperature 245 to 260°C, 10s max. 100 150 200 250 300 2 times max. TB110F~TB240F Rev : 01.12.2020 3/4 www.leiditech.com
2.5 1000.9 6.0 236 2.4 mm (mil) Unit : 1.1 TB120F TB120F TB240F TB240F PACKAGE OUTLINE Plastic surface mounted package; 4 leads MBF-T UNIT mm max min mil max min 8.7 5.9 197 177 161 142 276 252 A C D E HE ∠d 0.8 0.5 e 2.7 2.3 106 C ∠ALL ROUND HE A E D e e dL a L L1 a 1.7 1.3 1.1 0.5 0.2 MBF-T mechanical data b b 0.9 TB110F~TB240F Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : 01.12.2020 4/4 www.leiditech.com