TAS2574YCGR

TAS2574 TI | Alldatasheet

Document overview

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Technical content

TAS2574 8.5W Digital Input Smart Amp with I/V Sense and Integrated 15V Class-H Boost

1 Features

• Powerful class-D amplifier – 8.5W 1% THD+N – 15V boost with 5.1A max current limit
• Best in class efficiency – Upto 90% efficiency at system level – 4.8mW idle channel power – Integrated Y-bridge – Advanced 33mV step size class-H boost
• High performance audio channel – 4.2µV A-wt. idle channel noise – 114dB Dynamic Range – -90dB THDN – Low EMI performance
• Advanced integrated features – Integrated Speaker IV sense – Signal detection high efficiency modes – High accuracy voltage monitor & temp sensor – Programmable battery input current limit
• Ease of use features – 1cell, 2cell and 3cell Li-ion battery support – Clock based power up/down – Auto clock rate detection: 16kHz to 192kHz – Integrated ultrasonic tone and chirp generator – External 14V PVDD supply support – MCLK free operation – Thermal and over current protection – Programmable drive strength IO buffers
• Power Supplies and user interface – Battery Voltage: 1.8V to 5.5V – VDD: 1.65V to 1.95V – IOVDD: 1.2V or 1.8V – I2S/TDM: 8 channels – I2C: 4 selectable addresses
• WCSP package

2 Applications

• Mobile phone, Tablets & Wearables
• Smart Speakers with Voice Assistance
• Bluetooth and Wireless speakers

3 Description

The TAS2574 is a digital input Class-D audio amplifier with an integrated Boost for higher power delivery in battery-operated systems. The device has integrated speaker voltage and current sense (IV-Sense) for real-time monitoring of the loudspeakers. IV-sense data can be used to run speaker protection algorithms on a host DSP to enable high output SPL while keeping speakers in a safe operating region. The device is optimized for delivering the best battery life for real use cases of Music playback and Voice calls. Advanced efficiency optimization features like Class-H, Y-bridge and algorithms enable the device to produce best-in-class efficiency across all power regions of operation. The Class-D amplifier is capable of delivering 8.5W output power using the integrated Class-H 15V Boost. A battery tracking peak voltage limiter and a battery voltage monitor ADC enables advanced battery monitoring algorithms on the host processor to manage peak output power delivery while avoiding any audio distortion when battery capacity is depleting. Up to four devices can share a common bus via I2S/TDM + I2C interfaces. Digital Audio Interface Boost Control Interface Clocking Device Protections Power Management Digital Core Monitor ADC VBAT, PVDD, and Temp Monitor Efficiency Algos Filters / Control IV Sense ADCs VBAT PVDD TEMP PVDD OUT_P OUT_N VSNS_P VSNS_N SW DREG GREG SBCLK FSYNC SDIN SDOUT AD1 AD2 SDA SCL GND PGND BGND SDZ IRQZ Class-D Amp VBATVDDIOVDD VBAT_SNS (opt.) Functional block diagram TAS2574 SLASF74 – AUGUST 2024 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

7 Mechanical, Packaging, and Orderable Information....6

4 Pin Configuration and Functions

VDDGNDVBAT_SNSSDZGNDVBAT PGNDPGNDPGNDBGNDBGNDBGND VSNS_PVSNS_NPGNDSWSWSW OUT_POUT_NGREGPVDDPVDDPVDD Notes: - Not to Scale A B C D E F 1 2 3 4 5 6 Figure 4-1. Package Top Level View Pinout TAS2574 SLASF74 – AUGUST 2024 www.ti.com

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NAME NO. AD1 B4 I I2C address pin LSB. AD2 B5 I I2C address pin LSB+1. BGND P Boost ground. Connect to PCB GND plane strongly with multiple vias.D2 DREG A6 P Digital core voltage regulator output. Bypass to GND with a capacitor. Do not connect to external load. FSYNC A2 I I2S word clock or TDM frame sync. GREG F4 P High-side gate CP regulator output. Do not connect to external load. GND P Digital ground. Connect to PCB GND plane. Strong connection to ground plane required through multiple vias.C2 IOVDD A4 P 1.2V or 1.8V Digital IO supply. Decouple to GND with capacitor. IRQZ B3 O Open drain, active low interrupt pin. Pull up to IOVDD with resistor if optional internal pullup is not used. OUT_N F5 O Class-D negative output. OUT_P F6 O Class-D positive output. PGND P Class-D Power stage ground. Connect to PCB GND plane strongly through multiple vias. PVDD P Integrated boost output and Class-D power stage supply.F2 SBCLK A1 I I2S/TDM serial bit clock. SCL B6 I I²C Clock Pin. Pull up to IOVDD with a resistor. SDA A5 I/O I²C Data Pin. Pull up to IOVDD with a resistor. SDIN B2 I I2S or TDM serial data input. SDOUT B1 I/O I2S or TDM serial data output. SDZ C3 I Active low hardware shutdown. SW P Boost converter switch input.E2 VBAT C1 P Battery power supply input. Connect to 2.5V to 5.5V supply and decouple with a capacitor. VBAT_SNS C4 I Battery sense terminal. Connect to 1S or 2S battery supply for remote battery sensing. Ground the pin if remote sensing is not used. VDD C6 P Analog, digital power supply. Connect to 1.8V supply and decouple to GND with capacitor. VSNS_N E5 I Voltage sense negative input. Connect to speaker negative terminal as close to speaker as possible. Add series resistor if EMI filter is used. VSNS_P E6 I Voltage sense positive input. Connect to speaker positive terminal as close to speaker as possible. Add series resistor if EMI filter is used. 1. I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. www.ti.com TAS2574 SLASF74 – AUGUST 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TAS2574

August 2024 * Initial Release TAS2574 SLASF74 – AUGUST 2024 www.ti.com

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6 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.

6.1 Documentation Support

6.1.1 Related Documentation

For related documents see the following

• Texas Instruments, Purepath Console 3 (PPC3) Software

6.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

6.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

6.4 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

6.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

6.6 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions. www.ti.com TAS2574 SLASF74 – AUGUST 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TAS2574

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. TAS2574 SLASF74 – AUGUST 2024 www.ti.com

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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TAS2574YCGR Active Production DSBGA (YCG) | 36 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 TAS257X TAS2574YCGR.A Active Production DSBGA (YCG) | 36 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 TAS257X (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TAS2574YCGR DSBGA YCG 36 3000 182.0 182.0 20.0 TAS2574YCGR DSBGA YCG 36 3000 182.0 182.0 20.0 Pack Materials-Page 2

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