TAJB156M010S

TL750MXX-Q1 TI1 | Alldatasheet

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TL750Mxx-Q1,TL751Mxx-Q1 www.ti.com SGLS312J –SEPTEMBER 2005–REVISED JUNE 2011 AUTOMOTIVELOW-DROPOUTVOLTAGEREGULATORS Check forSamples: TL750Mxx-Q1 ,TL751Mxx-Q1 1FEATURES

• QualifiedforAutomotive Applications • Load-Dump Protection
• Low Dropout Voltage,Less Than 0.6V at • OvervoltageProtection 750 mA • InternalThermal Overload Protection
• Low QuiescentCurrent • InternalOvercurrent-LimitingCircuitry
• TTL- and CMOS-Compatible Enable on TL751M Series

DESCRIPTION

The TL750M and TL751M seriesarelow-dropoutpositivevoltageregulatorsspecificallydesignedforautomotive applications.The TL750M and TL751M seriesincorporateonboard overvoltageand current-limitingprotection circuitrytoprotectthedevicesand theregulatedsystem.Both seriesarefullyprotectedagainstload-dumpand reverse-batteryconditions.Load-dump protectionisup to a maximum of 60 V at the inputof the device.Low quiescentcurrent,even duringfull-loadconditions,makes the TL750M and TL751M seriesidealforuse in applicationsthatarepermanentlyconnectedtothevehiclebattery. The TL750M and TL751M seriesoffers5-V,8-V,and 12-V options.The TL751M serieshas theadditionofan enable(ENABLE) input.The ENABLE inputgivescompletecontroloverpower up,allowingsequentialpower up or shutdown.When ENABLE ishigh,theregulatoroutputisplacedinthehigh-impedancestate.The ENABLE inputisTTL and CMOS compatible. The TL750Mxx and TL751Mxx arecharacterizedforoperationoverthevirtualjunctiontemperaturerange–40°C to125°C. AVAILABLE OPTIONS (1) VOTJ PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKINGNOM (V) TO-263-3– KTT Reelof500 TL750M05QKTTRQ1 TL750M05Q1 5 V TO-252-3– KVU Reelof2500 TL750M05QKVURQ1 750M05Q TO-263-3– KTT Reelof500 TL750M08QKTTRQ1 TL750M08Q1 8 V TO-252-3– KVU Reelof2500 TL750M08QKVURQ1 750M08Q TO-263-3– KTT Reelof500 TL750M12QKTTRQ1 TL750M12Q1 12 V TO-252-3– KVU Reelof2500 TL750M12QKVURQ1 750M12Q –40°C to125°C TO-263-5– KTT Reelof500 TL751M05QKTTRQ1 TL751M05Q1 5 V TO-252-5– KVU Reelof2500 TL751M05QKVURQ1 751M05Q TO-263-5– KTT Reelof500 TL751M08QKTTRQ1 TL751M08Q1 8 V TO-252-5– KVU Reelof2500 TL751M08QKVURQ1 751M08Q TO-263-5– KTT Reelof500 TL751M12QKTTRQ1 TL751M12Q1 12 V TO-252-5– KVU Reelof2500 TL751M12QKVURQ1 751M12Q (1) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI web siteatwww.ti.com. (2) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2005–2011,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

KVU (TO-252-3) PACKAGE (TOP VIEW) TL751M KTT (TO-263-5) PACKAGE (TOP VIEW) NC ENABLE INPUT OUTPUT COMMOM NC COMMON ENABLE TL751M KVU (TO-252-5) PACKAGE (TOP VIEW) OUTPUT INPUT TL750M KTT (TO-263-3) PACKAGE (TOP VIEW) OUTPUT COMMON INPUTCOMMON COMMOM COMMON Enable Bandgap Current Limiting Overvoltage/ Thermal Shutdown ENABLE OUTPUT COMMON INPUT 28 V TL750Mxx-Q1,TL751Mxx-Q1 SGLS312J –SEPTEMBER 2005–REVISED JUNE 2011 www.ti.com NOTE: The COMMON terminalisinelectricalcontactwiththemountingbase. NC – No internalconnection TL751Mxx FUNCTIONAL BLOCK DIAGRAM

2 Copyright© 2005–2011,Texas InstrumentsIncorporated

TL750Mxx-Q1,TL751Mxx-Q1 www.ti.com SGLS312J –SEPTEMBER 2005–REVISED JUNE 2011 ABSOLUTE MAXIMUM RATINGS overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) Continuousinputvoltage 26 V Transientinputvoltage(seeFigure4) 60 V Continuousreverseinputvoltage –15 V Transientreverseinputvoltage t= 100 ms –50 V KTT package (3pin) 26.9°C/W θJA Package thermalimpedance(2)(3) KTT package (5pin) 26.5°C/W KVU package 38.6°C/W TJ Virtualjunctiontemperaturerange –40°C to150°C Tstg Storagetemperaturerange –65°C to150°C (1) Stressesbeyond thoselistedunderabsolutemaximum ratingsmay cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunderrecommended operating conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) Maximum power dissipationisa functionofTJ(max),θJA,and TA.The maximum allowablepower dissipationatany allowableambient temperatureisPD = (TJ(max)– TA)/θJA.Operatingattheabsolutemaximum TJ of150°C can impactreliability.Due tovariationin individualdeviceelectricalcharacteristicsand thermalresistance,thebuilt-inthermaloverloadprotectionmay be activatedatpower levelsslightlyabove orbelowtherateddissipation. (3) The package thermalimpedance iscalculatedinaccordancewithJESD 51. THERMAL INFORMATION TL750M05 THERMAL METRIC (1) KTT UNITS

3 PINS

θJA Junction-to-ambientthermalresistance(2) 27.5 θJCtop Junction-to-case(top)thermalresistance(3) 43.2 θJB Junction-to-boardthermalresistance(4) 17.3 °C/W ψJT Junction-to-topcharacterizationparameter(5) 2.8 ψJB Junction-to-boardcharacterizationparameter(6) 9.3 θJCbot Junction-to-case(bottom)thermalresistance(7) 0.3 (1) Formore informationabouttraditionaland new thermalmetrics,see theIC Package ThermalMetricsapplicationreport,SPRA953 . (2) The junction-to-ambientthermalresistanceundernaturalconvectionisobtainedina simulationon a JEDEC-standard,high-Kboard,as specifiedinJESD51-7,inan environmentdescribedinJESD51-2a. (3) The junction-to-case(top)thermalresistanceisobtainedby simulatinga coldplateteston thepackage top.No specific JEDEC-standardtestexists,buta closedescriptioncan be foundintheANSI SEMI standardG30-88. (4) The junction-to-boardthermalresistanceisobtainedby simulatinginan environmentwitha ringcoldplatefixturetocontrolthePCB temperature,as describedinJESD51-8. (5) The junction-to-topcharacterizationparameter,ψJT,estimatesthejunctiontemperatureofa deviceina realsystemand isextracted fromthesimulationdataforobtainingθJA,usinga proceduredescribedinJESD51-2a (sections6 and 7). (6) The junction-to-boardcharacterizationparameter,ψJB,estimatesthejunctiontemperatureofa deviceina realsystemand isextracted fromthesimulationdataforobtainingθJA ,usinga proceduredescribedinJESD51-2a (sections6 and 7). (7) The junction-to-case(bottom)thermalresistanceisobtainedby simulatinga coldplateteston theexposed (power)pad.No specific JEDEC standardtestexists,buta closedescriptioncan be foundintheANSI SEMI standardG30-88. RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT TL75xM05 6 26 VI Inputvoltage TL75xM08 9 26 V TL75xM12 13 26 VIH High-levelENABLE inputvoltage TL751Mxx 2 15 V VIL Low-levelENABLE inputvoltage TL751Mxx 0 0.8 V IO Outputcurrent TL75xMxx 750 mA TJ Operatingvirtualjunctiontemperature TL75xMxx –40 125 °C Copyright© 2005–2011,Texas InstrumentsIncorporated 3

TL750Mxx-Q1,TL751Mxx-Q1 SGLS312J –SEPTEMBER 2005–REVISED JUNE 2011 www.ti.com TL751Mxx ELECTRICAL CHARACTERISTICS VI = 14 V,IO = 300 mA, TJ = 25°C TL751Mxx PARAMETER UNIT TYP Response time,ENABLE tooutput(start-up) 50 µs TL750M05/TL751M05 ELECTRICAL CHARACTERISTICS VI = 14 V,IO = 300 mA, ENABLE at0 V forTL751M05, TJ = –40°C to125°C (unlessotherwisenoted)(1) TL750M05 TL751M05PARAMETER TEST CONDITIONS UNIT MIN TYP MAX Outputvoltage VI= 6 V to26 V 4.85 5 5.15 V VI= 9 V to16 V, IO = 250 mA 10 25 Lineregulation mV VI= 6 V to26 V, IO = 250 mA 12 50 Power-supplyripplerejection VI= 8 V to18 V, f= 120 Hz 55 dB Load regulation IO = 5 mA to750 mA 20 50 mV IO = 500 mA, TJ = 25°C 0.5 Dropoutvoltage(2) V IO = 750 mA, TJ = 25°C 0.65 IO = 750 mA 60 75Currentconsumption mAIq = II– IO IO = 10 mA 5 Shutdown current(TL751M05 only) ENABLE VIH ≥ 2 V 200 µA (1) Pulse-testingtechniquesmaintainthejunctiontemperatureas closetotheambienttemperatureas possible.Thermaleffectsmust be takenintoaccountseparately.Allcharacteristicsaremeasured witha 0.1-µF capacitoracrosstheinputand a 10-µF tantalumcapacitor on theoutput,withequivalentseriesresistancewithintheguidelinesshown inFigure4. (2) Measured when theoutputvoltage,VO ,has dropped100 mV fromthenominalvalueobtainedatVI= 14 V. TL750M08/TL751M08 ELECTRICAL CHARACTERISTICS VI = 14 V,IO = 300 mA, ENABLE at0 V forTL751M08, TJ = –40°C to125°C (unlessotherwisenoted)(1) TL750M08 TL751M08PARAMETER TEST CONDITIONS UNIT MIN TYP MAX Outputvoltage VI= 6 V to26 V 7.76 8 8.24 V VI= 10 V to17 V, IO = 250 mA 12 40 Lineregulation mV VI= 9 V to26 V, IO = 250 mA 15 68 Power-supplyripplerejection VI= 11 V to21 V, f= 120 Hz 55 dB Load regulation IO = 5 mA to750 mA 24 80 mV IO = 500 mA, TJ = 25°C 0.5 Dropoutvoltage(2) V IO = 750 mA, TJ = 25°C 0.65 IO = 750 mA, TJ = 25°C 60 75Currentconsumption mAIq = II– IO IO = 10 mA 5 Shutdown current(TL751M08 only) ENABLE VIH ≥ 2 V 200 µA (1) Pulse-testingtechniquesmaintainthejunctiontemperatureas closetotheambienttemperatureas possible.Thermaleffectsmust be takenintoaccountseparately.Allcharacteristicsaremeasured witha 0.1-µF capacitoracrosstheinputand a 10-µF tantalumcapacitor on theoutput,withequivalentseriesresistancewithintheguidelinesshown inFigure4. (2) Measured when theoutputvoltage,VO ,has dropped100 mV fromthenominalvalueobtainedatVI= 14 V.

4 Copyright© 2005–2011,Texas InstrumentsIncorporated

TL750Mxx-Q1,TL751Mxx-Q1 www.ti.com SGLS312J –SEPTEMBER 2005–REVISED JUNE 2011 TL750M12/TL751M12 ELECTRICAL CHARACTERISTICS VI = 14 V,IO = 300 mA, ENABLE at0 V forTL751M12, TJ = –40°C to125°C (unlessotherwisenoted)(1) TL750M12 TL751M12PARAMETER TEST CONDITIONS UNIT MIN TYP MAX Outputvoltage VI= 13 V to26 V 11.76 12 12.24 V VI= 14 V to19 V, IO = 250 mA 15 43 Lineregulation mV VI= 13 V to26 V, IO = 250 mA 20 78 Power-supplyripplerejection VI= 13 V to23 V, f= 120 Hz 50 55 dB Load regulation IO = 5 mA to750 mA 30 120 mV IO = 500 mA, TJ = 25°C 0.5 Dropoutvoltage(2) V IO = 750 mA, TJ = 25°C 0.6 IO = 750 mA, TJ = 25°C 60 75Currentconsumption mAIq = II– IO IO = 10 mA 5 Shutdown current(TL751M12 only) ENABLE VIH ≥ 2 V 200 µA (1) Pulse-testingtechniquesmaintainthejunctiontemperatureas closetotheambienttemperatureas possible.Thermaleffectsmust be takenintoaccountseparately.Allcharacteristicsaremeasured witha 0.1-µF capacitoracrosstheinputand a 10-µF tantalumcapacitor on theoutput,withequivalentseriesresistancewithintheguidelinesshown inFigure4. (2) Measured when theoutputvoltage,VO ,has dropped100 mV fromthenominalvalueobtainedatVI= 14 V. Copyright© 2005–2011,Texas InstrumentsIncorporated 5

DVL = DIL × ESR TL750Mxx-Q1,TL751Mxx-Q1 SGLS312J –SEPTEMBER 2005–REVISED JUNE 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION The TL750Mxx and TL751Mxx are low-dropoutregulators.The outputcapacitorvalue and the parasitic equivalentseriesresistance(ESR) affectthebandwidthand stabilityofthecontrolloopforthesedevices.For thisreason,thecapacitorand ESR must be carefullyselectedfora givenoperatingtemperatureand loadrange. Figure2 and Figure3 can be used toestablishtheappropriatecapacitancevalueand ESR forthebestregulator transientresponse. Figure2 shows therecommended rangeofESR fora givenloadwitha 10-µF capacitoron theoutput.Figure2 alsoshows a maximum ESR limitof2 Ω and a load-dependentminimum ESR limit. For applicationswithvaryingloads,thelightestloadconditionshouldbe chosen because itistheworstcase. Figure3 shows therelationshipofthereciprocalofESR tothesquarerootofthecapacitance,witha minimum capacitancelimitof10 µF and a maximum ESR limitof2 Ω.Thisfigureestablishestheamount thattheminimum ESR limitshown inFigure2 can be adjustedfordifferentcapacitorvalues.For example,where the minimum load needed is200 mA, Figure2 suggestsan ESR range of 0.8 Ω to 2 Ω for10 µF. Figure3 shows that changingthe capacitorfrom 10 µF to 400 µF can change the ESR minimum by greaterthan 3/0.5(or6). Therefore,the new minimum ESR valueis0.8/6(or0.13 Ω).This allowsan ESR range of 0.13 Ω to 2 Ω, achievingan expanded ESR range by usinga largercapacitorattheoutput.For betterstabilityinlow-current applications,a smallresistanceplacedinserieswiththecapacitor(seeTable1)isrecommended, so thatESRs betterapproximatethoseshown inFigure2 and Figure3. Table1.Compensation forIncreasedStabilityatLow Currents MANUFACTURER CAPACITANCE ESR TYP PART NUMBER ADDITIONAL RESISTANCE AVX 15 µF 0.9Ω TAJB156M010S 1 Ω KEMET 33 µF 0.6Ω T491D336M010AS 0.5Ω Figure1.

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2.5 0.4 0.3 0.2 0.1 IL - Load Current Rang e - A This Region Not Recommended for Operation C L = 10 µF C I= 0.1 µF f = 120 Hz Equivalent Series Resistance (ESR) - 0.5 Potential Instability Region Min ESR Boundary Max ESR Boundary Region of Best Stability ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ 0.01 0.015 0.02 0.025 0.03 0.035 0.04 ÏÏÏ ÏÏÏ ÏÏÏ 200 µF ÏÏÏ ÏÏÏ ÏÏÏ 1000 µF 1/ESR 0.005 ÏÏÏ ÏÏÏ ÏÏÏ 400 µF Not Recommended Recommended Min ESR Potential Instability Region of Best Stability ÏÏÏ ÏÏÏ ÏÏÏ ÏÏÏ 100 µF ÏÏÏ ÏÏÏ ÏÏÏ ÏÏÏ 22 µF ÏÏÏ ÏÏÏ ÏÏÏ ÏÏÏ 10 µF ÎÎ ÎÎ ÎÎ C LStability − TL750Mxx-Q1,TL751Mxx-Q1 www.ti.com SGLS312J –SEPTEMBER 2005–REVISED JUNE 2011 OUTPUT CAPACITOR EQUIVALENT SERIES RESISTANCE (ESR) STABILITY vs vs LOAD CURRENT RANGE EQUIVALENT SERIES RESISTANCE (ESR) Figure2. Figure3. Copyright© 2005–2011,Texas InstrumentsIncorporated 7

IV − Transient Input Voltage − V TJ = 25°C for t ≥/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr5 ms t − Time − ms tr = 1 ms 0 2 4 6 8 10 − Output Voltage − V 12 14 VO VI − Input Voltage − V IO = 10 mA TJ = 25°C TL75xM08 TL75xM05 TL750Mxx-Q1,TL751Mxx-Q1 SGLS312J –SEPTEMBER 2005–REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS Table2.TableofGraphs FIGURE Transientinputvoltage vs Time 4 Outputvoltage vs Inputvoltage 5 IO = 10 mA 6 Inputcurrent vs Inputvoltage IO = 100 mA 7 Dropoutvoltage vs Outputcurrent 8 Quiescentcurrent vs Outputcurrent 9 Load transientresponse 10 Linetransientresponse 11 TRANSIENT INPUT VOLTAGE OUTPUT VOLTAGE vs vs TIME INPUT VOLTAGE Figure4. Figure5.

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− Input Current − mAII VI − Input Voltage − V IO = 10 mA TJ = 25°C TL75_M05 TL75_M08 200 100 0 0 2 4 6 8 10 300 350 12 14 250 150 VI − Input Voltage − V IO = 100 mA TJ = 25°C − Input Current − mAII TL75_M05 TL75_M08 200 150 125 100 0 50 100 150 200 250 250 300 225 175 IO − Output Current − mA TJ = 25°C Dropout Voltage − mV 0 20 40 60 80 100 150 IO − Output Current − mA TJ = 25°C VI = 14 V − Quiescent Current − mA 250 350 IQ TL750Mxx-Q1,TL751Mxx-Q1 www.ti.com SGLS312J –SEPTEMBER 2005–REVISED JUNE 2011 INPUT CURRENT INPUT CURRENT vs vs INPUT VOLTAGE INPUT VOLTAGE Figure6. Figure7. DROPOUT VOLTAGE QUIESCENT CURRENT vs vs OUTPUT CURRENT OUTPUT CURRENT Figure8. Figure9. Copyright© 2005–2011,Texas InstrumentsIncorporated 9

− 100 − 200 0 50 100 150 200 250 100 150 100 t − Time − ms − Output Current − mA 300 350 IO VI(NOM) = VO + 1 V ESR = 2 C L = 10 mF TJ = 25°C − Output Voltage − mVVO 0 20 40 60 80 100 150 250 350 − Output Voltage − mVVO 20 mV/DIV1 V/DIV − Input Voltage − VVIN t − Time − ms VI(NOM) = VO + 1 V ESR = 2 IL = 20 mA C L = 10 mF TJ = 25°C TL750Mxx-Q1,TL751Mxx-Q1 SGLS312J –SEPTEMBER 2005–REVISED JUNE 2011 www.ti.com LOAD TRANSIENT RESPONSE LINE TRANSIENT RESPONSE Figure10. Figure11.

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www.ti.com 24-Aug-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TL750M05QKTTRQ1 ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR -40 to 125 TL750M05Q1 TL750M05QKVURQ1 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 750M05Q TL750M08QKVURQ1 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 750M08Q TL750M12QKTTRQ1 ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR -40 to 125 TL750M12Q1 TL750M12QKVURQ1 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 750M12Q TL751M05QKVURQ1 ACTIVE TO-252 KVU 5 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 751M05Q TL751M08QKTTRQ1 ACTIVE DDPAK/ TO-263 KTT 5 500 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR -40 to 125 TL751M08Q1 TL751M08QKVURQ1 ACTIVE TO-252 KVU 5 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 751M08Q TL751M12QKTTRQ1 ACTIVE DDPAK/ TO-263 KTT 5 500 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR -40 to 125 TL751M12Q1 TL751M12QKVURQ1 ACTIVE TO-252 KVU 5 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 751M12Q (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

www.ti.com 24-Aug-2014 Addendum-Page 2 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TL750M05-Q1, TL750M08-Q1, TL750M12-Q1, TL751M05-Q1 :

• Catalog: TL750M05 , TL750M08 , TL750M12 , TL751M05 NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant TL750M12QKTTRQ1 DDPAK/ TO-263 TL751M08QKTTRQ1 DDPAK/ TO-263 TL751M12QKTTRQ1 DDPAK/ TO-263 PACKAGE MATERIALS INFORMATION www.ti.com 6-Dec-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL750M05QKVURQ1 TO-252 KVU 3 2500 340.0 340.0 38.0 TL750M08QKVURQ1 TO-252 KVU 3 2500 340.0 340.0 38.0 TL750M12QKTTRQ1 DDPAK/TO-263 KTT 3 500 340.0 340.0 38.0 TL750M12QKVURQ1 TO-252 KVU 3 2500 340.0 340.0 38.0 TL751M05QKVURQ1 TO-252 KVU 5 2500 340.0 340.0 38.0 TL751M08QKTTRQ1 DDPAK/TO-263 KTT 5 500 340.0 340.0 38.0 TL751M08QKVURQ1 TO-252 KVU 5 2500 340.0 340.0 38.0 TL751M12QKTTRQ1 DDPAK/TO-263 KTT 5 500 340.0 340.0 38.0 TL751M12QKVURQ1 TO-252 KVU 5 2500 340.0 340.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 6-Dec-2013 Pack Materials-Page 2

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