TA4800AF

TA4800AF TOSHIBA | Alldatasheet

Document overview

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Technical content

Features

• Maximum output current : 1 A
• Output voltage : V OUT = 1.5 V ∼ 9.0 V
• Reference voltage accuracy : V REF ± 2.5% (@Tj = 25°C)
• Low quiescent current : 850 μA (Typ.) (@VOUT = 3.3 V ,IOUT = 0 A)
• Low standby current (output OFF mode): 0.5 μA (Typ.)
• Low-dropout voltage : V D = 0.5 V (Max) (@VOUT = 3.3 V, IOUT = 500 mA)
• Protection function : Over current protection / thermal shutdown
• Package type : Surface-mount New PW-Mold5pin Pin Assignment Marking HSIP5-P-1.27B Weight : 0.36 g (Typ.) Mark ADJ 5 3 GND NC IN OUT 4800 Lot No. A line indicates lead (Pb) - free package or lead (Pb) – free finish. Part No. (or abbreviation code) 1 3 5 42 AF

Pin No. Symbol Description

1 NC Non-connection

2 IN Input terminal. Connected by capacitor (C IN) to GND.

3 GND Ground terminal

4 OUT Output terminal. Connected by capacitor (C OUT) to GND. 5 ADJ Output voltage feedback to regulator. It is connected to an error amplifier with VREF=1.245 V (Typ.). How to Order Product No. Package Package Type and Capacity TA4800AF (T6L1,Q) New PW-Mold5pin : Surface-mount Tape (2000 pcs/reel) Block Diagram GND Over- temperature protection Over-current protection Control circuit IN OUT Reference voltage ADJ 1.245 V (Typ.)

Absolute Maximum Rating (Ta = 25°C) Characteristic Symbol Rating Unit Input voltage VIN 16 V Output current IOUT 1 A Operating junction temperature Tj(opr) -40~135 °C Junction temperature Tj 150 °C Storage temperature Tstg −55~150 °C Ta = 25°C 1 Power dissipation Tc= 25°C PD W junction-ambient R th(j-a) 125 Thermal resistance junction-case R th(j-c) 12.5 °C/W Note 1: Do not apply current and voltage (including re verse polarity) to any pin that is not specified. Note 2: Using continuously under heavy loads (e.g. t he application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Operating Input Voltage Range Characteristic Symbol Min Typ. Max Unit Input voltage V IN 2.5(Note2) ⎯ 16.0 V Note 3: This is the voltage at which the IC begins operating. VD must be considered when determining the best input voltage for the application. Output Voltage Range Characteristic Symbol Min Typ. Max Unit Output voltage V OUT 1.5 ⎯ 9.0 V Protection Function (Reference) Characteristic Symbol Test Condition Min Typ. Max Unit Thermal shutdown TSD 150 170 ⎯ °C Thermal shutdown hysteresis width TSD(hys) VIN = 4.3 V ⎯ 15 ⎯ °C Peak circuit current IPEAK A Short circuit current ISC VIN = 16V , Tj = 25°C ⎯ 0.7 ⎯ A Note 4: Ensure that the devices operate within th e limits of the maximum rating when in actual use.

Electrical Characteristics

(Unless otherwise specified, VEN = VIN, VOUT = 3.3 V, CIN = 0.33 μF, COUT = 3.3 μF, Tj = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Reference voltage VREF V IN = 4.3 V 1.214 1.245 1.276 V Line regulation Reg･line 4.3 V < = VIN < = 8.3 V, IOUT = 500 mA ⎯ 8 24 mV Load regulation Reg･load V IN = 4.3 V, 5 mA < = IOUT < = 1 A ⎯ 5 20 mV IOUT = 0 A ⎯ 0.85 1.70 Quiescent current IB IOUT = 1 A ⎯ 10 20 mA VIN = 2.1 V, IOUT = 0 A ⎯ 3.3 4.0 Starting quiescent current IBstart VIN = 3.5 V, IOUT = 1 A ⎯ 17.0 28.5 mA Output noise voltage VNO VIN = 5.3 V, IOUT = 50 mA,

10 Hz < = f < = 100 kHz ⎯ 100 ⎯ μVrms

Ripple rejection R.R. VIN = 5.3 V, IOUT = 50 mA, f = 120 Hz ⎯ 63 ⎯ dB IOUT = 500 mA ⎯ 0.32 0.50 Dropout voltage VD IOUT = 1 A ⎯ 0.69 ⎯ V Average temperature coefficient of output voltage TCVO VIN = 5.3 V, IOUT = 5 mA,

Electrical Characteristics Common to All Products

• Tj = 25°C in the measurement conditions of each item is the standard condition when a pulse test is carried out, and any drift in the electrical characteristic due to a rise in th e junction temperature of the chip may be disregarded. Standard Application Circuit
• Be sure to connect a capacitor near the input terminal and output terminal between both terminals and GND. The use of a monolithic ceramic capacitor (B Characterist ic or X7R) of low ESR (equivalent series resistance) is recommended. The IC may oscillate due to external cond itions (output current, temp erature, or the type of the capacitor used). The type of capacitor required must be determined by the actual application circuit in which the IC is used. Setting Output Voltage
• The output voltage is determined by the equation shown below. When you control the output voltage with R1, a recommended value to use for R2 is 5 k Ω. R1 and R2must be placed as close as possible to each other, and the board trace to the ADJ terminal must be kept as short as possible. )R2 R1+ 1 ( ×REFV =OUTV The notice in case of application
• The IC might be destroyed if a voltage greater than the input terminal voltage is applied to the output terminal, or if the input terminal is connected to GND during operation. To prevent such an occurrence, connect a diode as in the following diagram.
• There is a possibility that internal parasitic device s may be generated when momentary transients cause a terminal’s potential to fall below that of the GND termin al. In such case, that the device could be destroyed. The voltage of each terminal and any state must therefore never fall below the GND potential. CIN 0.33 μF IN OUT ADJ GND Load COUT 3.3 μFTA4800AF R1 CIN 0.33 μF IN OUT ADJ GND Load COUT 3.3 μFTA4800AF R1

I OUT = 5 mA 500 mA 100 mA 10 mA 100 mA I OUT = 500 mA 100 mA 10 mA I OUT = 500 mA Ta = Tc Single 50 × 50 × 0.8 mmt 30 × 30 × 0.8 mmt VOUT = 3.3V Tj = 25°C PDmax – Ta VOUT – Tj VOUT – VIN IB – VIN IB – Tj Ambient temperature T a ( ° C ) Junction temperature T j ( ° C ) Input voltage V IN (V) Input voltage V IN (V) Junction temperature T j ( ° C ) Allowable power dissipation P Dmax (W) Output voltage V OUT (V) Output voltage V OUT (V) Quiescent current I B (mA) Quiescent current I B (mA) 1600 100 60 20 80 140 40 120 Condition: Number of IC = 1 Reflow soldering on a ceramic substrate IB – IOUT Output curren I OUT ( m A ) Quiescent current I B (mA) 3.1 3.5 150−50 3.3 3.4 3.2 0 100 VIN = 5.3 V VOUT = 3.3V 8 0 4 6 I OUT = 1 A 150−50 50 0 100 VIN = 5.3 V 0 A 10000 400200 800 VIN = 5.3 V Tj = 25°C 600 8 0 4 2 6 Tj = 25°C

I OUT = 1 A 500 mA VOUT – I OUT VOUT – I OUT Output curren I OUT ( m A ) Output curren I OUT (A) Output voltage V OUT (V) Output voltage V OUT (V) 10000 400 200 600 3.1 3.2 3.3 3.5 3.4 2 0 1 0.5 1.5 VD – I OUT Output curren I OUT ( m A ) Dropout voltage V D (V) Tj = −40℃ 0.8 0.6 0.2 10000 400 200 600 25℃ 125℃ 0.4 800 VD – Tj Junction temperature T j ( ° C ) Dropout voltage V D (V) 0.8 0.6 0.2 150−50 0 100 0.4 50 800 85℃ 2.5 Junction temperature Tj (°C) IPEAK – Tj Dropout voltage V D (V) IPEAK – VD Peak output current I PEAK (A) Peak output current I PEAK (A) VIN = 5.3 V Ta = 25℃ 0 10 20 5 2.5 0.5 1.5 1.0 2.0 -50 50 150 0 100 15 3.0 0.5 1.5 1.0 2.5 2.0 VIN = 5.3 V VOUT = 3.3V Tj = 25°C VIN = 5.3 V VOUT = 3.3V Tj = 25°C

HSIP5-P-1.27B U n i t : mm Weight: 0.36 g (Typ.) 6.5±0.2 5.2±0.2 1.5±0.25.5±0.2 0.6max 0.7max 0.5±0.1 0.6±0.1 0.6max 2.3±0.2 0.1±0.1 1.27 9.5±0.3 0.8max 1.5±0.20.7±0.1 0.5±0.1 1.1±0.2

RESTRICTIONS ON PRODUCT USE 20070701-EN

• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity a nd vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIB A products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconduct or Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.
• The TOSHIBA products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, et c.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringement s of patents or other rights of the third parties which may result from its use. No license is granted by implic ation or otherwise under any patents or other rights of TOSHIBA or the third parties.
• Please contact your sales representative for product- by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.