T6328A TMT | Alldatasheet

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Technical content

TM Technology Inc. reserves the right P. 1 Publication Date: OCT. 2007 to change products or specifications without notice. Revision: A 500mA Low Dropout Voltage Regulator

FEATURES

  • Wide Input Range: 2.5V to 5.5V
  • Available Output Voltages: / 3.3V / 3.7V
  • Low-Noise for RF Application
  • Quick Start-Up (Typically 50us)
  • Fast Response in Line/Load Transient
  • Standby Current : <0.01uA
  • TTL-Logic-Controlled Shutdown Input
  • Low Temperature Coefficient
  • Current Limiting Protection
  • Thermal Shutdown Protection
  • High Power Supply Rejection Ratio
  • Only 1uF Output Capacitor Required for Stability
  • Available Package (Lead-Free) : SOT-23-3, SOT-23-5, SOT-223, SOT-89, SC-82

APPLICATIONS

  • CDMA/GSM Cellular Handsets
  • Battery-Powered Equipment
  • Laptop, Palmtops, Notebook Computers
  • Hand-Held Instruments
  • PCMCIA Cards
  • Portable Information Appliances DX=SOT-89(A), EX=SOT-89(B), GENERAL DESCRIPTION The T6328A is designed for portable RF and wireless applications with dem anding performance and space requirem ents. The T6328A performance is optim ized for battery- powered systems to deliver ultra low noise and low quiescent current. Regulator ground current increases only slightly in dropout, further prolonging the battery life. The T6328A also works with low-ESR ceram ic capacitors, reducing the amount of board space necessary f or power applications, critical in hand-held wireless devices. The T6328A consumes less than 0.01uA in shutdown m ode and has fast turn-on tim e less than 50us. The other features include ultra low dropout voltage, high output accuracy, current lim iting protection, and high ripple rejection ratio. Available in the SOT-23-3, SOT-23-5, SOT- 223, SC-82 and SOT -89 packages. PART NUMBER EXAMPLES T632 8A- 18AX G a bc d a : Device Number b : Output Voltage c : Pin-out / function and Package AX=SOT-23-5(A), BX=SOT-23-5(B), CX=SOT-23-3(A), FX=SOT223(A), AU=SC-82(A) d : G=lead-free

TM Technology Inc. reserves the right P. 2 Publication Date: OCT. 2007 to change products or specifications without notice. Revision: A PIN ARRANGEMENT (Top view) SOT23-5(A) SOT23-5(B) SOT23-3(A) T6328A-XXAXG T6328A-XXBXG T6328A-XXCXG GND VOUT EN 3 4 5VIN NC GND VOUT EN 1 3 4 5V IN NC GND VOUT 3V IN SOT-89(A) SOT-89(B) SOT-223(A) T6328A-XXDXG T6328A-XXEXG T6328A-XXFXG GND VOUT VIN 12 3 GND VOUT VIN 12 3 GND VOUT VIN 12 3 SC-82(A) T6328A-XXAUG GND VOUT EN 1

4 VIN

EN Enable signal, high active VIN Input supply pin. NC No connect

TM Technology Inc. reserves the right P. 3 Publication Date: OCT. 2007 to change products or specifications without notice. Revision: A Absolute Maximum Ratings Power Dissipation, PD @ TA = 25°C : Package Thermal Resistance : ESD Susceptibility

Electrical Characteristics

( VIN = VOUT + 1V, TA = 25°C, CIN = COUT = 1uF, unless otherwise noted ) Symbol Description Conditions Min. Typ. Max Unit VIN Input Voltage 2.5 - 5.5 V ∆VOUT Output Voltage Accuracy IOUT=1mA -2 - +2 % IOUT Output current - 500 - mA ILIM Current Limit RLoad =1 ohm - 600 - mA IQ Quiescent Current EN≥ 1.2V, IOUT=0mA - 65 90 uA ∆VLINE Line Regulation VIN= VOUT +1V to 5.5V, IOUT =1mA - 3 10 mV ∆VLOAD Load Regulation 0.1mA< IOUT < 500mA - 10 30 mV VOUT=3.0~3.9V - 650 850 mV VOUT=2.5~2.9V - 780 980 mV VOUT=2.0~2.4V - 1100 1300 mVVDROP Dropout Voltage IL=500mA VOUT=1.4~1.9V - 1400 1600 mV ISHDN Shutdown current EN = VIN - 0.01 1 uA IIBEN EN Input Bias Current EN = VIN or GND - 0 100 nA VENH EN Input High Voltage 1.2 - - V VENL EN Input Low Voltage - - 0.4 V f =100Hz - -60 - PSRR Power Supply Rejection Rate COUT=1uF, IOUT =100mA f =10KHz - -30 - dB TSD Thermal Shutdown Temperature - 165 - °C ∆TSD Thermal Shutdown Temperature Hysteresis - 30 - °C

TM Technology Inc. reserves the right P. 4 Publication Date: OCT. 2007 to change products or specifications without notice. Revision: A Applications Information Like any voltage regulator, the external capacitors used for the T6328A must be carefully selected for regulator stability and performance. Using a capacitor whose value is > 1uF on the T6328A input and the amount of capacitance can be increas ed without limit. The input capacitor must be located a distance of not more than 0.5 inch from the input pin of the IC and returned to a clean analog ground. Any good quality ceramic or tantalum can be used for this capacitor. The capacitor with larger value and lower ESR (equivalent series resistance) provides better PSRR and line- transient response. The output capacitor must meet both requirements for minimum amount of capacitance and ESR in all voltage regulator application. The T6328A is designed specifically to work with low ESR ceramic output capacitor in space-saving and perfor mance consideration. Using a ceramic capacitor whose value is at least 1uF with ESR is more than 20m Ω on the T6328A output ensures stability. The T6328A still works well with output capacitor of other types due to the wide stable ESR range. Output capacitor of larger capacitance can redu ce noise and improve load transient response, stability and PSRR.The output capacitor should be lo cated with in 0.5 inch from the VOUT pin of the T6328A and returned to a clean analog ground. Enable Function The T6328A features an voltage regulator enable/disable function. To assure the T6328A voltage regulator will switch on, the EN turn on control level must be greater than 1.2V. The T6328A voltage regulator will go into shutdown mode when the voltage on the EN pin falls below 0.4V. The T6328A equips a quick-discharge function to protect the system. When the regulator is turned off by EN pin, the internal MOSFET between VOUT and GND will be turned on to discharge output voltage quickly. If the enable f unction is not needed in a specific application, it may be tied to GND/VIN to keep the voltage regulator in a continuously on state.

TM Technology Inc. reserves the right P. 5 Publication Date: OCT. 2007 to change products or specifications without notice. Revision: A Thermal Considerations Thermal protection limits power dissipation in T6328A. When the operating junction temperature exceeds 165°C, the OTP circuit starts the thermal shutdow n function and turns the pass element off. The pass element turns on again after the junction temperature cools by 30 °C. For continuous operation, do not exceed absolute maximum operatiog junction temperature 125 °C. The power dissipation definition in device is shown as following formula : PD = (VIN - VOUT) x IOUT + VIN x IQ The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : PD(MAX) = ( TJ(MAX) - TA ) / θJA Where T J(MAX) is the maximum operating junction temperature 125 °C, T A is the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of T6328A, where TJ(MAX) is the maximum junction temperature of the die (125°C) and T A is the maximum ambient temperature. Th e junction to ambient thermal resistance θJA is layout dependent) for SO T-23-3/SOT-23-5 package is 250°C/W, SC-82 package is 333°C/W, SOT-89/ SOT-223 package is 300°C/W on standard JEDEC 51-3 thermal test board. The maximum power dissipation at TA = 25°C can be calculated by following formula : PD(MAX) = (125°C - 25°C)/250 = 400mW (SOT-23-3/SOT-23-5) PD(MAX) = (125°C - 25°C)/333 = 300mW (SC-82) PD(MAX) = (125°C - 25°C)/200 = 500mW (SOT-89/ SOT-223) The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA For T6328A packages.

TM Technology Inc. reserves the right P. 6 Publication Date: OCT. 2007 to change products or specifications without notice. Revision: A PACKAGE DIMENSIONS SOT-23-3 A1 A B CC1 D E F GHI B1 1.90(BSC) 0.075(BSC) B2 0.95(BSC) 0.037(BSC) C2 0 0.075 0.150 0 0.003 0.06 D 0.40 0.015 G 0.60(REF) 0.023(REF) H 0~8° 0~8° I 5~15° 5~15°

TM Technology Inc. reserves the right P. 7 Publication Date: OCT. 2007 to change products or specifications without notice. Revision: A PACKAGE DIMENSIONS SOT-23-5 A1 A B CC1 D E F GHI B1 1.90(BSC) 0.075(BSC) B2 0.95(BSC) 0.037(BSC) C2 0 0.075 0.150 0 0.003 0.06 D 0.40 0.015 G 0.60(REF) 0.023(REF) H 0~8° 0~8° I 5~15° 5~15°

TM Technology Inc. reserves the right P. 8 Publication Date: OCT. 2007 to change products or specifications without notice. Revision: A PACKAGE DIMENSIONS SC-82 A1 A B CC1 D E F GHI A 1.80 - 2.45 0.071 - 0.096 A1 1.15 - 1.35 0.045 - 0.053 B 1.80 - 2.20 0.071 - 0.087 B1 1.30(BSC) 0.051(BSC) C 0.80 - 1.10 0.031 - 0.043 C1 0.80 - 1.00 0.031 - 0.039 C2 0.00 - 0.10 0.000 - 0.004 D 0.15 - 0.40 0.006 - 0.016 D1 0.35 - 0.50 0.014 - 0.020 E 0.20 - 0.46 0.008 - 0.018 F 0.08 - 0.26 0.003 - 0.010 G 0.65(REF) 0.025(REF) H 0~8° 0~8° I 5~15° 5~15°

TM Technology Inc. reserves the right P. 9 Publication Date: OCT. 2007 to change products or specifications without notice. Revision: A PACKAGE DIMENSIONS SOT-89 D PO LISHED(2X) C HE L B B1 12 3 10'(2X) e A Dimension in mm Dimension in inch Symbol Min. Max. Min. Max. A 1.40 1.60 0.055 0.063 B 0.44 0.56 0.017 0.022 B1 0.36 0.48 0.014 0.019 C 0.35 0.44 0.013 0.017 D 4.40 4.60 0.173 0.181 D1 1.35 1.83 0.053 0.072 E 2.29 2.60 0.090 0.102 H 3.94 4.25 0.155 0.167 e 1.50 BSC 0.059 BSC e1 3.00 BSC 0.118 BSC L 0.89 1.2 0.035 0.047

TM Technology Inc. reserves the right P. 10 Publication Date: OCT. 2007 to change products or specifications without notice. Revision: A PACKAGE DIMENSIONS SOT-223 A1 A B CC1 D E F H e C2 0.02 - 0.10 0.001 - 0.003 H 0~10° 0~10°