T5919 TDK | Alldatasheet

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Bottom Port PDM Digital Output Multi-Mode Microphone TDK, Inc. reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. TDK Corporation 1745 Technology Drive, San Jose, CA 95110 U.S.A +1(408) 988–7339 www.tdk.com Document Number: DS-000363 Revision: 1.0 Release Date: 3/9/2021 GENERAL DESCRIPTION The T5919 is a multi-mode, low noise digital MEMS microphone in a small package. The T5919 consists of a MEMS microphone element and an impedance converter amplifier followed by a fourth-order Σ-Δ modulator. The digital interface allows the pulse density modulated (PDM) output of two microphones to be time multiplexed on a single data line using a single clock. The T5919 has multiple modes of operation: High Quality, Low-Power (AlwaysOn), and Sleep. The T5919 has high SNR in all operational modes. It has 135 dB SPL AOP in High Quality Mode and 120 dB SPL AOP in Low-Power mode. The T5919 is available in a standard 3.5 × 2.65 × 0.98 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. The package integrates a Particle Ingress Filter (PIF) for enhanced robustness to environmental contaminants such as water and dust.

APPLICATIONS

  • Smartphones
  • Microphone Arrays
  • Tablet Computers
  • Cameras

FEATURES

SPEC HIGH QUALITY MODE LOW-POWER MODE Sensitivity −41 dB FS ±1 dB −26 dB FS ±1 dB SNR 64.5 dBA 62 dBA Current 590 µA 220 µA AOP 135 dB SPL 120 dB SPL Clock 2.0 MHz to 3.3 MHz 400 kHz to 800 kHz

  • 3.5 × 2.65 × 0.98 mm surface-mount package
  • Extended frequency response from 40 Hz to >20 kHz
  • Sleep Mode: 9 µA
  • Fourth-order Σ-Δ modulator
  • Digital pulse density modulation (PDM) output
  • Compatible with Sn/Pb and Pb-free solder processes
  • RoHS/WEEE compliant
  • Features PIF (Particle Ingress Filter) to enhance product robustness to water & dust FUNCTIONAL BLOCK DIAGRAM

ORDERING INFORMATION

MMICT5919-00-012 −40°C to +85°C 13” Tape and Reel ICS-51360 ADC POWER MANAGEMENT CLK DATA VDD GND PDM MODULATOR CHANNEL SELECT SELECT T5919

Document Number: DS-000363 Revision: 1.0

TABLE 1. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – GENERAL TA = 25°C, VDD = 1.8 V, SCK = 2.4 MHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed. TABLE 2. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – HIGH QUALITY MODE TA = 25°C, VDD = 1.8 V, SCK = 2.4 MHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed. Note 1: Sensitivity is relative to the RMS level of a sine wave with positive amplitude equal to 100% 1s density and negative amplitude equal to 0% 1s density.

TABLE 3. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – LOW-POWER MODE TA = 25°C, VDD = 1.8 V, SCK = 768 kHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed. Note 2: Sensitivity is relative to the RMS level of a sine wave with positive amplitude equal to 100% 1s density and negative amplitude equal to 0% 1s density. TABLE 4. DIGITAL INPUT/OUTPUT CHARACTERISTICS TA = 25°C, VDD = 1.8 V, unless otherwise noted.

TABLE 5. PDM DIGITAL INPUT/OUTPUT TA = 25°C, VDD = 1.8 V, unless otherwise noted. Figure 1. Pulse Density Modulated Output Timing

extended periods may affect device reliability. TABLE 6. ABSOLUTE MAXIMUM RATINGS ESD (electrostatic discharge) sensitive device. devices subjected to high energy ESD.

Figure 2. Recommended Soldering Profile Limits TABLE 7. RECOMMENDED SOLDERING PROFILE*

Figure 3. Pin Configuration (Top View, Terminal Side Down) TABLE 8. PIN FUNCTION DESCRIPTIONS

1 DATA Digital Output Signal (DATA1 or DATA2)

2 SELECT

3 GND Ground

4 CLK Clock Input to Microphone

5 VDD

Figure 8. Power Supply Rejection (PSR) vs. Frequency

not true because of the definition of the 0 dB FS sine wave. Figure 11. 1 kHz, 0 dB FS Sine Wave sample in units of D, where 1.0 D is digital full scale. In this case, a − 26 dB FS sine wave has peaks at 0.05 D.

retaining high electro-acoustic performance. modulator, limits at 0 dB FS. the decimation filter has a dynamic range of 10 dB better than the microphone, the overall system noise only degrades by 0.4 dB. This 116 dB filter dynamic range requires the filter to have at least 20 bit resolution. left channel, tie the SELECT pin to VDD instead of tying it to GND. Figure 12. Mono PDM Microphone (Right Channel) Connection to Codec

Document Number: DS-000363 Revision: 1.0 the CLK trace on the PCB. Depending on the drive capability of the codec clock output, a buffer may still be needed, as shown in Figure 14. SLEEP MODE The microphone enters sleep mode when the clock frequency falls below 200 kHz. In this mode, the microphone data output is in a high impedance state. The current consumption in sleep mode is 9 µA. The microphone wakes up from sleep mode and begins to output data 7 ms after the clock becomes active. The wake-up time indicates the time from when the clock is enabled to when the T5919 outputs data within 0.5 dB of its settled sensitivity. START-UP TIME The start-up time of the T5919 is typically 7 ms, measured by the time from when power and clock are enabled until sensitivity of the output signal is within 0.5 dB of its settled sensitivity.

Document Number: DS-000363 Revision: 1.0 SUPPORTING DOCUMENTS For additional information, see the following documents. APPLICATION NOTES – GENERAL AN-000048, PDM Digital Output MEMS Microphone Flex Evaluation Board User Guide AN-100, MEMS Microphone Handling and Assembly Guide AN-1003, Recommendations for Mounting and Connecting the TDK, Bottom-Ported MEMS Microphones AN-1112, Microphone Specifications Explained AN-1124, Recommendations for Sealing TDK Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140, Microphone Array Beamforming

Document Number: DS-000363 Revision: 1.0 HANDLING INSTRUCTIONS PICK AND PLACE EQUIPMENT The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows:

  • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface.
  • Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out of or blow air into the microphone port.
  • Do not use excessive force to place the microphone on the PCB. REFLOW SOLDER For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 2 and Table 7. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or ultrasonic cleaning.

Document Number: DS-000363 Revision: 1.0

REVISION HISTORY

REVISION DATE REVISION DESCRIPTION 3/9/21 1.0 Initial version

Document Number: DS-000363 Revision: 1.0 COMPLIANCE DECLARATION DISCLAIMER TDK believes the environmental and other compliance information given in this document to be correct but cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on file. TDK subcontracts manufacturing, and the information contained herein is based on data received from vendors and suppliers, which has not been validated by TDK. This information furnished by TDK, Inc. (“TDK”) is believed to be accurate and reliable. However, no responsibility is assumed by TDK for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice . TDK reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. TDK makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. TDK assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by TDK and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of TDK. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. TDK sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. ©2021 TDK. All rights reserved. TDK, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the TDK logo are trademarks of TDK, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product names may be trademarks of the respective companies with which they are associated. ©2021 TDK. All rights reserved.